Patents by Inventor Mitsuhiro Seki

Mitsuhiro Seki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5176784
    Abstract: A method and apparatus for bonding thin film supplied from a continuous roll to at least one bonding surface along the entire length of a discrete printed surface base plate and efficiently cutting the film to a proper length which covers an entire planar surface of the board. Each board is conveyed to a film bonding position and the leading end of the continuous film is transported to the film bonding position that is held by suction. A compression bonding roller moves across the surface of the board and automatically feeds film and bonds the film to the board while leaving a portion of the film loose over the trailing end of the board. A cutter comprising a rotary blade and a fixed blade disposed across the direction of movement of the film and the board is mounted on a slide bed which is moveable towards and away from the film. The rotary blade is obliquely oriented in order to permit the cutting of the film when the blade is rotated in opposition to the fixed blade.
    Type: Grant
    Filed: May 29, 1991
    Date of Patent: January 5, 1993
    Assignee: Somar Corporation
    Inventors: Yasuhiro Nagafuchi, Mitsuhiro Seki, Shigeo Sumi, Fumio Hamamura
  • Patent number: 5162071
    Abstract: A thin film laminating apparatus which is operative to bond a continuous thin film to the surface of a base plate, using heat and pressure applied by a pressure laminating roller, and to cut the film to a length corresponding to that of the base plate. The apparatus has an adjustable film cut-off unit having a fixed cutter and a rotary cutter, both of which extend across the width of the thin film, transverse to the direction of continuous film feed. The fixed cutter and the rotary cutter are independently supported by members which are movable and convey the respective cutters into and out of a film cutting position. The support members are movable manually, to permit initial insertion of the thin film into a cutoff position, and automatically during continuous operation of the thin film laminating apparatus.
    Type: Grant
    Filed: June 4, 1990
    Date of Patent: November 10, 1992
    Assignee: Somar Corporation
    Inventors: Yasuhiro Nagafuchi, Mitsuhiro Seki, Shigeo Sumi, Fumio Hamamura
  • Patent number: 5131972
    Abstract: A film guide device for film bonding in which a movable guide roller support and guides the film and swing roller arms prevent the slackening of the film while the film is being fed. Also, a driving action of a rotation-drive source, which controls the movement of the movable guide roller support arms, is synchronized with the braking of the film supply role and the movement of the leading edge of the film towards the bonding surface. This device prevents longitudinal wrinkles in the film, misplacement on the bonding surface, and excessive tension on the film.
    Type: Grant
    Filed: June 4, 1990
    Date of Patent: July 21, 1992
    Assignee: Somar Corporation
    Inventors: Mitsuhiro Seki, Shigeo Sumi, Fumio Hamamura
  • Patent number: 5120386
    Abstract: A film sticking method is disclosed in which the tip of the cutting portion of a sharp-pointed cutting member is caused to pierce a continuous film. The member is moved rightward and leftward across the direction of the feed of the film so that the film is cut off to a prescribed length. The cut-off film is stuck to a base plate. Also, a film sticking apparatus is disclosed which includes a film cutter for cutting off a continuous film to a prescribed length by moving a cutting member across the direction of the feed of the film and sticks the cut-off film to a base plate. The cutting member is formed so that it is sharp-pointed and has a cutting edge at least one side of edges of the member. The cutting edge can be moved backward and forward relative to the surface of the continuous film.
    Type: Grant
    Filed: September 21, 1990
    Date of Patent: June 9, 1992
    Assignee: Somar Corporation
    Inventors: Mitsuhiro Seki, Fumio Hamamura
  • Patent number: 5110400
    Abstract: A method and apparatus for bonding thin film supplied from a continuous roll to at least one bonding surface along the entire length of a discrete printed surface base plate and efficiently cutting the film to a proper length which covers an entire planar surface of the board. Each board is conveyed to a film bonding position and the leading end of the continuous film is transported to the film bonding position that is held by suction. A compression bonding roller moves across the surface of the board and automatically feeds film and bonds the film to the board while leaving a portion of the film loose over the trailing end of the board. A cutter comprising a rotary blade and a fixed blade disposed across the direction of movement of the film and the board is mounted on a slide bed which is moveable towards and away from the film. The rotary blade is obliquely oriented in order to permit the cutting of the film when the blade is rotated in opposition to the fixed blade.
    Type: Grant
    Filed: March 29, 1990
    Date of Patent: May 5, 1992
    Assignee: Somar Corporation
    Inventors: Yasuhiro Nagafuchi, Mitsuhiro Seki, Shigeo Sumi, Fumio Hamamura
  • Patent number: 5053099
    Abstract: The apparatus for bonding a film, having a length corresponding to the length of a board, to a film bonding surface of the board by compression bonding rollers which comprises a conveying device for conveying the board, a board clamp and guide device for clamping and guiding said board at a predetermined position, a film feed member for holding the leading end of the film by suction and feeding the leading end of the film to a film bonding position, a film leading end-holding member provided in the vicinity of the film bonding position, and having a holding surface for face-to-face contact with the leading end of the film fed by the film feed member to the film bonding position, the film leading end-holding member having film suction apertures connected to a vacuum system so as to cause the leading end of the film to be held on the holding surface by suction, compression bonding rollers for bonding the film, held at the film bonding position by the film feed member, from its leading toward trailing end to the
    Type: Grant
    Filed: January 2, 1990
    Date of Patent: October 1, 1991
    Assignee: Somar Corporation
    Inventors: Mitsuhiro Seki, Shigeo Sumi, Takashi Goto
  • Patent number: 5000816
    Abstract: A thin film peeling apparatus in which a portion of a thin film adhered to a base plate is initially lifted and subsequently peeled therefrom. The film peeling apparatus includes a conveying device for conveying the base plate along a base plate conveyance path, a first thin film conveyance device for conveying the lifted portion of the thin film and a second thin film conveyance device for subsequently conveying the thin film. The first thin film conveyance device is disposed so that the thin film is peeled in a direction substantially perpendicular to the direction of conveyance of the base plate. The second thin film conveyance device includes at least one fluid ejector for ejecting fluid against the thin film such that the thin film is conveyed in a direction parallel to the surface of the base plate and substantially perpendicular to the direction of conveyance of the base plate.
    Type: Grant
    Filed: April 25, 1989
    Date of Patent: March 19, 1991
    Assignee: Somar Corporation
    Inventors: Mitsuhiro Seki, Shigeo Sumi
  • Patent number: 4983248
    Abstract: A thin-film coating method for laminating thin-films to opposing surfaces of a substrate and an apparatus for accomplishing the same. A pair of tack members 10E are respectively disposed on opposite sides of the substrate and are moveable in a direction perpendicular to the direction of conveyance of the substrate so as to temporarily tack forward and portions of the thin-films to the substrate. Compression rollers 16 are movably disposed with respect to the substrate such that the compression rollers can respectively contact forward end portions of the thin-films after the tack members have been removed from the substrate. The compression rollers are rotatable to thereby convey the substrate and to cause the thin films to adhere to the opposing surfaces of the substrate. A void-space preventing agent device 30 is provided in a position upstream to the tacking position.
    Type: Grant
    Filed: December 16, 1988
    Date of Patent: January 8, 1991
    Assignee: Somar Corporation
    Inventor: Mitsuhiro Seki
  • Patent number: 4964937
    Abstract: A thin film adhering apparatus and method in which a thin film whose length corresponds to that of a substrate is adhered to the substrate by applying pressure using a pressure adhering roller.
    Type: Grant
    Filed: September 22, 1989
    Date of Patent: October 23, 1990
    Assignee: Somar Corporation
    Inventor: Mitsuhiro Seki
  • Patent number: 4961817
    Abstract: A thin-film releasing apparatus in which a portion of a thin-film is released from a surface of a substrate on which the thin film is stuck, the remaining portion of the thin film is then released starting from the released portion thereof and the thus released thin film is then removed. The apparatus comprises a first thin film conveyange system for releasing the remaining portion of the thin film from the thin film by nipping the thin film at the intitially released portion thereof and for conveying the thus released thin film upwardly from the surface of the substrate simultaneously, and a second thin-film conveyance system for mounting thereon the thin film conveyed by the first thin film conveyance system and for conveying the mounted thin film in a direction intersecting a conveyance direction of the substrate.
    Type: Grant
    Filed: December 13, 1988
    Date of Patent: October 9, 1990
    Assignee: Somar Corporation
    Inventor: Mitsuhiro Seki
  • Patent number: 4885048
    Abstract: A laminator for cutting a continuous thin film in a predetermined size and laminating same over a substrate is disclosed which comprises a stationary laminator body; a thin film supply member for supplying the continuous thin film to the substrate; a temporary bonding member for temporarily bonding a leading end of the continuous thin film within a pathway of thin film supply; and a support member for suppporting the thin film supply member and the temporary bonding member in such a manner that the thin film supply member and the temporary bonding member are movable toward or away from the substrate. The support member is mounted on the stationary laminator body. The laminator also includes a cutter for cutting the continuous thin film in a predetermined size. The cutter is secured to the laminator body in an area near the pathway of thin film supply between the thin film supply member and the substrate.
    Type: Grant
    Filed: December 2, 1987
    Date of Patent: December 5, 1989
    Assignee: Somar Corporation
    Inventors: Sigeo Sumi, Fumio Hamamura, Ichio Fukuda, Mitsuhiro Seki, Noriyasu Sawada
  • Patent number: 4867837
    Abstract: A film peeler for peeling off a film sticking to a base is used to peel off part of the film sticking to the base, to make that part of the film thus peeled off adhere to a peel direction setting plate and to discharge the film with a film carrying device. The face of the peel direction setting plate where film adheres is formed with a conductive member. The conductive member is provided on an insulating material.
    Type: Grant
    Filed: November 18, 1987
    Date of Patent: September 19, 1989
    Assignee: Somar Corporation
    Inventors: Mitsuhiro Seki, Sigeo Sumi, Fumio Hamamura
  • Patent number: 4844772
    Abstract: A laminator for cutting a continuous thin film in a predetermined size and laminating same over a substrate is disclosed which comprises a stationary laminator body; a thin film supply member for supplying the continuous thin film to the substrate; a temporary bonding member for temporarily bonding a leading end of the continuous thin film within a pathway of thin film supply; and a support member for supporting the thin film supply member and the temporary bonding member in such a manner that the thin film supply member and the temporary bonding member are movable toward or away from the substrate. The support member is mounted on the stationary laminator body. The laminator also includes a cutter for cutting the continuous thin film in a predetermined size. The cutter is secured to the laminator body in an area near the pathway of thin film supply between the thin film supply member and the substrate.
    Type: Grant
    Filed: May 7, 1987
    Date of Patent: July 4, 1989
    Assignee: Somar Corporation
    Inventors: Sigeo Sumi, Fumio Hamamura, Ichio Fukuda, Mitsuhiro Seki, Noriyasu Sawada
  • Patent number: 4770737
    Abstract: A film peeling apparatus for peeling off a film stuck onto a base by raising one end thereof comprises a projection-formed detecting member for detecting the end of said film stuck onto said base and an oscillating device for oscillating said projection-formed detecting member upon detection of the end of film by said detecting member to thereby raise the end of said film.
    Type: Grant
    Filed: July 31, 1987
    Date of Patent: September 13, 1988
    Assignee: Somar Corporation
    Inventor: Mitsuhiro Seki
  • Patent number: 4717441
    Abstract: A laminator for depositing sheets cut from a web into desired lengths onto a base panel using press rolls installed opposite to each other with respect to the base panel and for transferring the base panel deposited with the cut sheets, characterized in that web support means are respectively installed close to the circumferential surfaces of said press roll and moved at the same rate as or slightly lower rate than a circumferential speed of the press roll up to positions close to the contacts between the cut sheets on the base panel and the press roll while the trailing edges of the cut sheets or portions close to the trailing edges thereof are being supported by the web support means.
    Type: Grant
    Filed: July 16, 1986
    Date of Patent: January 5, 1988
    Assignee: Somar Corporation
    Inventors: Mitsuhiro Seki, Fumio Hamamura
  • Patent number: D339147
    Type: Grant
    Filed: April 12, 1991
    Date of Patent: September 7, 1993
    Assignee: Somar Corporation
    Inventors: Shigeo Sumi, Fumio Hamamura, Mitsuhiro Seki