Abstract: An exhaust-gas treatment apparatus capable of efficiently making a harmful gas containing in an exhaust gas harmless without increasing a size of the apparatus is disclosed. The exhaust-gas treatment apparatus includes a main body in which a flow passage is formed for a liquid to flow, an exhaust-gas supply line to be coupled to the main body, and for supplying the exhaust gas to the flow passage through which the liquid flows, a suction device configured to suck the exhaust gas from the exhaust-gas supply line into the flow passage, a low-temperature plasma generator for generating low-temperature plasma in the flow passage to decompose the harmful gas, and a discharge line for discharging the exhaust gas, which has passed through the low-temperature plasma generator, from the main body.

Abstract: A plating support system is provided and includes a simulator that predicts an in-plane uniformity value of a plating film formed on a substrate based on assumed conditions for an electroplating treatment of the substrate; a numerical analysis data storage unit that stores numerical analysis data in which each assumed condition is associated with the in-plane uniformity value for plural assumed conditions; a regression analysis unit that estimates a model that the in-plane uniformity value is an objective variable and variables of assumed conditions are explanatory variables by regression analysis based on the numerical analysis data; and an implement condition search unit that uses the estimated model to search for implement conditions that are recommended values of the assumed conditions related to the in-plane uniformity of the plating film formed in the electroplating treatment of the substrate to be plated.

Abstract: Provided is a plate that is arranged between a substrate and an anode in a plating tank. This plate has a plurality of circular pores on each one of at least three reference circles that are concentric with each other and that are different from each other in diameter. The plurality of circular pores include three circular pores that are arranged respectively on adjacent three of the at least three reference circles, and that have centers which are out of alignment with each other on an arbitrary radius on the plate.

Abstract: A plating device includes: an anode; a substrate holder which holds a substrate; a substrate contact which comes into contact with a peripheral edge portion of the substrate; a resistor which is disposed in a way of facing the substrate holder between the anode and the substrate holder, and is used for adjusting ion movement; and a rotation driving mechanism which causes the resistor and the substrate holder to relatively rotate. The resistor includes: a shielding region which forms an outer frame and shields the ion movement between the anode and the substrate; and a resistance region which is formed on the radially inner side of the shielding region, and has a porous structure allowing the passage of an ion. An outer diameter of the resistance region has an amplitude centering on an imaginary reference circle, and has a wave shape which is periodic and annularly continuous.

Abstract: To optimize a location of a power feeding point with the use of a square substrate. There is disclosed a method for determining a location of a power feeding point in an electroplating apparatus. The electroplating apparatus is configured to plate a rectangular substrate having a substrate area of S. The rectangular substrate has opposed two sides coupled to a power supply. The rectangular substrate has a length L of the sides coupled to the power supply and a length W of sides not coupled to the power supply meeting a condition of 0.8×L?W?L. The method includes determining a number N of the power feeding points according to the substrate area S.

Abstract: Provided is a plate that is arranged between a substrate and an anode in a plating tank. This plate has a plurality of circular pores on each one of at least three reference circles that are concentric with each other and that are different from each other in diameter. The plurality of circular pores include three circular pores that are arranged respectively on adjacent three of the at least three reference circles, and that have centers which are out of alignment with each other on an arbitrary radius on the plate.

Abstract: A plating device includes: an anode; a substrate holder which holds a substrate; a substrate contact which comes into contact with a peripheral edge portion of the substrate; a resistor which is disposed in a way of facing the substrate holder between the anode and the substrate holder, and is used for adjusting ion movement; and a rotation driving mechanism which causes the resistor and the substrate holder to relatively rotate. The resistor includes: a shielding region which forms an outer frame and shields the ion movement between the anode and the substrate; and a resistance region which is formed on the radially inner side of the shielding region, and has a porous structure allowing the passage of an ion. An outer diameter of the resistance region has an amplitude centering on an imaginary reference circle, and has a wave shape which is periodic and annularly continuous.

Abstract: A plating support system is provided and includes a simulator that predicts an in-plane uniformity value of a plating film formed on a substrate based on assumed conditions for an electroplating treatment of the substrate; a numerical analysis data storage unit that stores numerical analysis data in which each assumed condition is associated with the in-plane uniformity value for plural assumed conditions; a regression analysis unit that estimates a model that the in-plane uniformity value is an objective variable and variables of assumed conditions are explanatory variables by regression analysis based on the numerical analysis data; and an implement condition search unit that uses the estimated model to search for implement conditions that are recommended values of the assumed conditions related to the in-plane uniformity of the plating film formed in the electroplating treatment of the substrate to be plated.

Abstract: To optimize a location of a power feeding point with the use of a square substrate. There is disclosed a method for determining a location of a power feeding point in an electroplating apparatus. The electroplating apparatus is configured to plate a rectangular substrate having a substrate area of S. The rectangular substrate has opposed two sides coupled to a power supply. The rectangular substrate has a length L of the sides coupled to the power supply and a length W of sides not coupled to the power supply meeting a condition of 0.8×L?W?L. The method includes determining a number N of the power feeding points according to the substrate area S.

Abstract: A plating apparatus that reduces a terminal effect is provided. The plating apparatus is provided. The plating apparatus includes a substrate holder for holding a substrate as a plating object, an electric contact disposed on the substrate holder to apply a current to a substrate, and a plurality of anodes arranged to face the substrate holder. Each of the plurality of anodes has a long and thin shape. Each of the plurality of anodes is arranged such that a longitudinal direction of the anode is parallel to a surface of a substrate held onto the substrate holder and such that at least one end in the longitudinal direction of each of the anodes faces the electric contact of the substrate holder.

Abstract: In-plane uniformity of a membrane electroplated on a polygon substrate is improved. An electroplating device includes an anode holder configured to hold an anode, a substrate holder configured to hold a polygon substrate, and a regulation plate provided between the anode holder and the substrate holder. The regulation plate has a body portion having a first polygon opening following an outer shape of the polygon substrate, and wall portions protruding on a substrate holder side from edges of the first polygon opening. The wall portions protrude over a first distance on the substrate holder side in first regions which contain middle portions of sides of the first polygon opening, and are notched in second regions which contain corner portions of the first polygon opening, or protrude over a second distance smaller than the first distance on the substrate holder side.

Abstract: To optimize a location of a power feeding point with the use of a square substrate. There is disclosed a method for determining a location of a power feeding point in an electroplating apparatus. The electroplating apparatus is configured to plate a rectangular substrate having a substrate area of S. The rectangular substrate has opposed two sides coupled to a power supply. The rectangular substrate has a length L of the sides coupled to the power supply and a length W of sides not coupled to the power supply meeting a condition of 0.8×L?W?L. The method includes determining a number N of the power feeding points according to the substrate area S.

Abstract: According to one embodiment, a plating apparatus for electroplating a substrate including a non-pattern area is provided. The plating apparatus includes a plating tank for holding the plating solution, an anode configured to be connected to a positive electrode of a power supply, and a paddle configured to move in the plating tank to stir the plating solution held in the plating tank. The paddle is configured such that at least a part of the non-pattern area of the substrate is constantly blocked when the paddle is viewed from the anode while the paddle is stirring the plating solution.

Abstract: To prevent a tin alloy from coming into contact with a copper wiring layer when a tin alloy bump layer is reflowed. According to an aspect of the present invention, a method of manufacturing a substrate having a bump at a resist opening is provided. The method of manufacturing a substrate includes a step of forming a copper wiring layer on the substrate by plating at a first temperature, a step of forming a barrier layer on the copper wiring layer by plating at a second temperature that is approximately equal to the first temperature, and a step of forming a tin alloy bump layer on the barrier layer by plating.

Abstract: The present disclosure provides techniques for determining plating conditions by numerically analyzing a film-thickness distribution. The disclosed techniques comprise performing electrochemical measurement in an electroplating apparatus; determining electrochemical parameters based on a result of the electrochemical measurement; receiving initial plating conditions for performing a plating process; based on the electrochemical parameters and the initial plating conditions, determining a current density distribution on a surface of a substrate based on a function formula which comprises a variable which represents a position on the substrate; based on the current density distribution, calculating a thickness of a film to be plated on the substrate; and performing the plating process based on final plating conditions corresponding to a calculated film-thickness distribution satisfying a desired film-thickness distribution.

Abstract: A plating apparatus that reduces a terminal effect is provided. The plating apparatus is provided. The plating apparatus includes a substrate holder for holding a substrate as a plating object, an electric contact disposed on the substrate holder to apply a current to a substrate, and a plurality of anodes arranged to face the substrate holder. Each of the plurality of anodes has a long and thin shape. Each of the plurality of anodes is arranged such that a longitudinal direction of the anode is parallel to a surface of a substrate held onto the substrate holder and such that at least one end in the longitudinal direction of each of the anodes faces the electric contact of the substrate holder.

Abstract: According to one embodiment, a plating apparatus for electroplating a substrate including a non-pattern area is provided. The plating apparatus includes a plating tank for holding the plating solution, an anode configured to be connected to a positive electrode of a power supply, and a paddle configured to move in the plating tank to stir the plating solution held in the plating tank. The paddle is configured such that at least a part of the non-pattern area of the substrate is constantly blocked when the paddle is viewed from the anode while the paddle is stirring the plating solution.

Abstract: In-plane uniformity of a membrane electroplated on a polygon substrate is improved. An electroplating device includes an anode holder configured to hold an anode, a substrate holder configured to hold a polygon substrate, and a regulation plate provided between the anode holder and the substrate holder. The regulation plate has a body portion having a first polygon opening following an outer shape of the polygon substrate, and wall portions protruding on a substrate holder side from edges of the first polygon opening. The wall portions protrude over a first distance on the substrate holder side in first regions which contain middle portions of sides of the first polygon opening, and are notched in second regions which contain corner portions of the first polygon opening, or protrude over a second distance smaller than the first distance on the substrate holder side.

Abstract: To optimize a location of a power feeding point with the use of a square substrate. There is disclosed a method for determining a location of a power feeding point in an electroplating apparatus. The electroplating apparatus is configured to plate a rectangular substrate having a substrate area of S. The rectangular substrate has opposed two sides coupled to a power supply. The rectangular substrate has a length L of the sides coupled to the power supply and a length W of sides not coupled to the power supply meeting a condition of 0.8×L?W?L. The method includes determining a number N of the power feeding points according to the substrate area S.

Abstract: An object of the present invention is to provide a numerical analysis method, by which film-thickness distribution of an electroplated film can be obtained. A method for analyzing plating comprising steps for: performing electrochemical measurement in an electroplating apparatus; deriving electrochemical parameters from result of the electrochemical measurement; specifying plating conditions which are applied when performing a plating process; based on the electrochemical parameters and the plating conditions, determining current density distribution on a surface of a substrate which is an object of the plating process, wherein the current density distribution is represented by a predetermined function formula which comprises a variable which represents a position on the substrate; and based on the current density distribution, calculating thickness of a film plated on the substrate.