Patents by Inventor Mitsuhiro Takayama

Mitsuhiro Takayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9339949
    Abstract: A die for forming a molding includes a molding die including an upper die and a lower die cooperating with the upper die to support a glass plate and forming a resin molding, the lower die having a concave surface including a contact surface that comes into contact with a metal molding, and a plurality of aperture portions formed on the contact surface, a non-magnetic cylindrical intermediate member contacted with an inner surface of each of the aperture portions, a molding-fixing member including a crown portion that retains the metal molding, and a flange portion disposed on a lower side of the crown portion, and a magnetic force generation device. The flange portion of the molding-fixing member has an outer diameter larger than an inner diameter of each of the aperture portions.
    Type: Grant
    Filed: July 12, 2011
    Date of Patent: May 17, 2016
    Assignee: Central Glass Company, Limited
    Inventors: Takahiro Asada, Mitsuhiro Takayama
  • Patent number: 9205786
    Abstract: Disclosed is a molding that is attached to a front side edge portion of a side window of a vehicle and covers only a bottom surface or the bottom surface and a side surface of the side window, the molding being formed with a door lip for covering an inclined portion of a body opening portion between a glass attachment surface of the body of the vehicle, to which the side window is attached, and a flat portion of the body opening portion, to which a door of the vehicle is attached, the molding being characterized by that a tip portion of the door lip of the molding is bent towards the inclined portion of the body opening portion to form a body abutment portion. This molding can be attached without increasing the operation man-hour when assembling the body and can be prevented from coming off the side window.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: December 8, 2015
    Assignee: Central Glass Company, Limited
    Inventor: Mitsuhiro Takayama
  • Patent number: 8992209
    Abstract: Disclosed herein is an injection molding die used for producing a frame-mounted plate glass by injection molding. The die is characterized in that an auxiliary cavity is provided at a position to exposed a surface of a plate glass and communicated with a cavity for a frame through a communication opening, the cavity for the frame being provided at position facing a vehicle inside surface of the plate glass. When the die is practically used for injection molding, a load applied to a peripheral portion of the plate glass during the injection molding is reduced, so that when the frame is molded onto the plate glass by injection molding, undesired breakage of the plate glass is suppressed.
    Type: Grant
    Filed: May 1, 2009
    Date of Patent: March 31, 2015
    Assignee: Central Glass Company, Limited
    Inventors: Osamu Nakata, Mitsuhiro Takayama
  • Publication number: 20140197663
    Abstract: Disclosed is a molding having a window clamping portion clamped on a bottom edge of a vehicle side window. The molding is such that it is equipped with a molding backside member provided with a groove, on a side of a flange surface of a vehicle side window attachment portion of the molding, and that an opening surface of the groove is opposed to the flange surface of the vehicle side window attachment portion. This molding is a molding that can be constituted by a small number of parts and that can be prevented from falling off the side window.
    Type: Application
    Filed: July 26, 2012
    Publication date: July 17, 2014
    Applicant: Central Glass Company, Limited
    Inventor: Mitsuhiro Takayama
  • Publication number: 20140145463
    Abstract: Disclosed is a molding that is attached to a front side edge portion of a side window of a vehicle and covers only a bottom surface or the bottom surface and a side surface of the side window, the molding being formed with a door lip for covering an inclined portion of a body opening portion between a glass attachment surface of the body of the vehicle, to which the side window is attached, and a flat portion of the body opening portion, to which a door of the vehicle is attached, the molding being characterized by that a tip portion of the door lip of the molding is bent towards the inclined portion of the body opening portion to form a body abutment portion. This molding can be attached without increasing the operation man-hour when assembling the body and can be prevented from coming off the side window.
    Type: Application
    Filed: July 26, 2012
    Publication date: May 29, 2014
    Applicant: Central Glass Company, Limited
    Inventor: Mitsuhiro Takayama
  • Publication number: 20130115323
    Abstract: A die for forming a molding includes a molding die including an upper die and a lower die cooperating with the upper die to support a glass plate and forming a resin molding, the lower die having a concave surface including a contact surface that comes into contact with a metal molding, and a plurality of aperture portions formed on the contact surface, a non-magnetic cylindrical intermediate member contacted with an inner surface of each of the aperture portions, a molding-fixing member including a crown portion that retains the metal molding, and a flange portion disposed on a lower side of the crown portion, and a magnetic force generation device. The flange portion of the molding-fixing member has an outer diameter larger than an inner diameter of each of the aperture portions.
    Type: Application
    Filed: July 12, 2011
    Publication date: May 9, 2013
    Applicant: Central Glass Company, Limited
    Inventors: Takahiro Asada, Mitsuhiro Takayama
  • Patent number: 8360499
    Abstract: A decorative molding that is to be fixed to a frame of a framed window glass plate for a vehicle is provided. The decorative molding is configured such that when the frame is formed around a peripheral portion of a glass plate by injecting a molten resin, the decorative molding is simultaneously fixed to the frame. The body of the decorative molding is made of a metal. A cationically electrodeposited coating film is formed on a surface of the body of the decorative molding and a resinous coating film is formed on the cationically electrodeposited coating film.
    Type: Grant
    Filed: February 18, 2010
    Date of Patent: January 29, 2013
    Assignee: Central Glass Company, Limited
    Inventors: Takuya Hasegawa, Mitsuhiro Takayama, Teturo Yamada, Koichi Fukuta
  • Patent number: 8162658
    Abstract: There is provided an injection die characterized in that the injection die is separated into at least two pieces, that a cavity for frame is formed between the separated dies, that the cavity for frame is provided with an additional cavity via a coupling hole, and that the coupling hole communicating with the additional cavity is provided at a confluence point of a resin in melted condition of the cavity for frame, at around a gate, at around a cavity for a fixing component, or at around a cavity for frame of which thickness is deep.
    Type: Grant
    Filed: April 23, 2008
    Date of Patent: April 24, 2012
    Assignee: Central Glass Company, Limited
    Inventors: Osamu Nakata, Mitsuhiro Takayama
  • Publication number: 20120025554
    Abstract: Summary: Task: In a field wherein a frame is formed around a peripheral portion of a glass plate by injection molding and a decorative molding is simultaneously fixed to the frame upon the injection molding, there are provided a decorative molding and a framed window glass plate having the decorative molding mounted thereto, the decorative molding being suppressed from an appearance failure at the time of injection molding and suitable for a multi-coloring. Means for achieving Task: A body proper of the decorative molding is made of a metal, a cationically electrodeposited coating film is formed on a surface of the body proper, and a resinous coating film is formed on the cationically electrodeposited coating film. By containing a pigment or dye in the resinous coating film which is made of a melamine-based resin, acrylic resin, polyester-based resin, fluororesin or epoxy resin, the decorative molding has the same color as the frame and the body of the vehicle, which is a feature.
    Type: Application
    Filed: February 18, 2010
    Publication date: February 2, 2012
    Applicant: Central Glass Company, Limited
    Inventors: Takuya Hasegawa, Mitsuhiro Takayama, Teturo Yamada, Koichi Fukuta
  • Patent number: 7928560
    Abstract: A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: April 19, 2011
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Masashi Miyazaki, Mitsuhiro Takayama, Tatsuro Sawatari
  • Publication number: 20110045123
    Abstract: In an injection molding die, there is defined a cavity for a frame or a cavity for the frame and an auxiliary cavity communicating with the cavity for the frame, and into the cavity for the frame or the auxiliary cavity, there is injected a melted resin from a runner through a gate, and a section of the gate has a width of 1 to 5 mm in the direction of a thickness of a plate glass and a width of 10 mm or more in the direction parallel with a side of the plate glass but smaller than a side length of the plate glass. When this die is practically used, a load that would be applied to a peripheral portion of the plate glass during injection molding is reduced, so that when the frame is integrally molded to the plate glass by injection molding, undesired breakage of the plate glass is suppressed.
    Type: Application
    Filed: May 1, 2009
    Publication date: February 24, 2011
    Applicant: Central Glass Company, Limited
    Inventors: Osamu Nakata, Mitsuhiro Takayama
  • Publication number: 20110031647
    Abstract: Disclosed herein is an injection molding die used for producing a frame-mounted plate glass by injection molding. The die is characterized in that an auxiliary cavity is provided at a position to exposed a surface of a plate glass and communicated with a cavity for a frame through a communication opening, the cavity for the frame being provided at position facing a vehicle inside surface of the plate glass. When the die is practically used for injection molding, a load applied to a peripheral portion of the plate glass during the injection molding is reduced, so that when the frame is molded onto the plate glass by injection molding, undesired breakage of the plate glass is suppressed.
    Type: Application
    Filed: May 1, 2009
    Publication date: February 10, 2011
    Applicant: CENTRAL GLASS COMPANY, LIMITED
    Inventors: Osamu Nakata, Mitsuhiro Takayama
  • Publication number: 20100300736
    Abstract: A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.
    Type: Application
    Filed: May 14, 2010
    Publication date: December 2, 2010
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Masashi Miyazaki, Mitsuhiro Takayama, Tatsuro Sawatari
  • Patent number: 7745926
    Abstract: A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: June 29, 2010
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Masashi Miyazaki, Mitsuhiro Takayama, Tatsuro Sawatari
  • Publication number: 20100086637
    Abstract: There is provided an injection die characterized in that the injection die is separated into at least two pieces, that a cavity for frame is formed between the separated dies, that the cavity for frame is provided with an additional cavity via a coupling hole, and that the coupling hole communicating with the additional cavity is provided at a confluence point of a resin in melted condition of the cavity for frame, at around a gate, at around a cavity for a fixing component, or at around a cavity for frame of which thickness is deep.
    Type: Application
    Filed: April 23, 2008
    Publication date: April 8, 2010
    Applicant: Central Glass Company, Limited
    Inventors: Osamu Nakata, Mitsuhiro Takayama
  • Patent number: 7348662
    Abstract: A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.
    Type: Grant
    Filed: May 27, 2003
    Date of Patent: March 25, 2008
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Masashi Miyazaki, Mitsuhiro Takayama, Tatsuro Sawatari
  • Publication number: 20080006928
    Abstract: A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.
    Type: Application
    Filed: August 29, 2007
    Publication date: January 10, 2008
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Masashi Miyazaki, Mitsuhiro Takayama, Tatsuro Sawatari
  • Patent number: 7278205
    Abstract: A multilayer printed wiring board (PWB) including via holes with satisfactory quality without defective shapes like swelling or recession on the end faces is provided. The multilayer PWB includes a build-up board of plural insulation layers as the main structure. In each of the insulation layers, via holes (columnar conductors) for electrically connecting between conductor circuits on the base layer or adjacent layers are formed. The via holes are formed by patterning metal foil with conductivity. The height “H” of the via holes (dimension in the thickness direction of the via hole forming layer) depends on the thickness “D” of the original metal foil only. Accordingly, the via holes can be formed without carrying out filling with conductive paste or electrolytic plating. Thus, multilayer PWB having via holes with satisfactory quality without defective shapes like swelling or recession on the end faces can be manufactured.
    Type: Grant
    Filed: August 7, 2003
    Date of Patent: October 9, 2007
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Masashi Miyazaki, Mitsuhiro Takayama, Tatsuro Sawatari, Takatoshi Murota
  • Publication number: 20070029109
    Abstract: A multilayer printed wiring board (PWB) including via holes with satisfactory quality without defective shapes like swelling or recession on the end faces is provided. The multilayer PWB includes a build-up board of plural insulation layers as the main structure. In each of the insulation layers, via holes (columnar conductors) for electrically connecting between conductor circuits on the base layer or adjacent layers are formed. The via holes are formed by patterning metal foil with conductivity. The height “H” of the via holes (dimension in the thickness direction of the via hole forming layer) depends on the thickness “D” of the original metal foil only. Accordingly, the via holes can be formed without carrying out filling with conductive paste or electrolytic plating. Thus, multilayer PWB having via holes with satisfactory quality without defective shapes like swelling or recession on the end faces can be manufactured.
    Type: Application
    Filed: October 13, 2006
    Publication date: February 8, 2007
    Inventors: Masashi Miyazaki, Mitsuhiro Takayama, Tatsuro Sawatari, Takatoshi Murota
  • Patent number: RE45146
    Abstract: A composite multi-layer substrate comprising a flat plate-like core member formed of a material having an excellent electric conductivity, an excellent heat conductivity, and a high rigidity, a front resin layer and a rear resin layer covering at least the front and rear surfaces of the core member, and a bottomless hole formed in the core member through the front and rear sides of the core member, wherein an electronic component is installed in the bottomless hole, whereby since the strength of the composite multi-layer substrate can be assured by the rigidity of the core member, conventional prior art glass cloth can be eliminated, deterioration in the electric characteristics caused by ion migration can be avoided and will result in reduced production cost.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: September 23, 2014
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Masashi Miyazaki, Mitsuhiro Takayama, Tatsuro Sawatari