Patents by Inventor Mitsuhiro Taniguchi

Mitsuhiro Taniguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5468076
    Abstract: In forming a desired print gap between a sheet of paper fed on a platen and a print head by driving a moving mechanism for changing a space between the platen and the print head, a condition where the space between the platen and the print head becomes smaller than a predetermined value is detected, and in this case the space between the platen and the print head is increased by a driving portion for driving the moving mechanism. Accordingly, when a thin paper is used as the sheet of paper, cutting, wrinkling, etc. of the thin paper can be prevented.
    Type: Grant
    Filed: June 24, 1994
    Date of Patent: November 21, 1995
    Assignee: Kabushiki Kaisha Tec
    Inventors: Takahisa Hirano, Masanori Takai, Mitsuhiro Taniguchi
  • Patent number: 5070035
    Abstract: A method for producing a semiconductor device according to the present invention comprises the following steps. A PxOy (x>0, y>0) insulating layer is formed on III-V group compound semiconductor substrate including indium and/or phosphorus. Then the substrate is subjected to heat treatment, and finally an electrode metal layer is formed on the insulating layer. This method ensures to increase the barrier height of MES type diode and the forward current-voltage characteristics of Schottky diode. Further, another method of the present invention comprises the following steps. An aluminum or indium layer is formed on III-V group compound semiconductor substrate including indium or phosphorus. The substrate is subjected to a first heat treatment. Then an insulating layer composed of phosphoric oxide PxOy (x>0, y>0) is formed on the aluminum or indium layer. Further, the substrate is subjected to a second heat treatment, and finally an electrode metal layer is formed on the insulating layer.
    Type: Grant
    Filed: August 21, 1989
    Date of Patent: December 3, 1991
    Assignee: Nippon Mining Co., Ltd.
    Inventors: Kazuo Hattori, Mitsuhiro Taniguchi