Patents by Inventor Mitsuhiro Tsuchioka

Mitsuhiro Tsuchioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6719570
    Abstract: In a card-type portable device, a terminal board is provided in the terminal board mounting area of a circuit board. Terminal electrodes are provided on a surface of the terminal board. The terminal electrodes are arranged at a height position according to a device specification by setting the thickness of the terminal board such that the terminal electrodes are positioned at the specified height position even when the height position of the circuit board is freely set. Also, by placing the circuit board along the wall of the bottom of a casing, the space defined by the circuit board and the upper wall of the casing is increased. Accordingly, tall electronic components can be provided on the circuit board in the casing, while maintaining the specified thickness of the casing.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: April 13, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Mitsuhiro Tsuchioka
  • Publication number: 20020177335
    Abstract: In a card-type portable device, a terminal board is provided in the terminal board mounting area of a circuit board. Terminal electrodes are provided on a surface of the terminal board. The terminal electrodes are arranged at a height position according to a device specification by setting the thickness of the terminal board such that the terminal electrodes are positioned at the specified height position even when the height position of the circuit board is freely set. Also, by placing the circuit board along the wall of the bottom of a casing, the space defined by the circuit board and the upper wall of the casing is increased. Accordingly, tall electronic components can be provided on the circuit board in the casing, while maintaining the specified thickness of the casing.
    Type: Application
    Filed: May 22, 2002
    Publication date: November 28, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Mitsuhiro Tsuchioka
  • Patent number: 5874859
    Abstract: A high-frequency amplifying integrated-circuit device is provided in which variations of gain can be reduced and which can be manufactured at a low cost as compared with prior art devices. A high-frequency amplifying integrated-circuit device includes a semiconductor substrate; and a transistor which is formed on the semiconductor substrate and which has a plurality of first electrodes, a plurality of second electrodes, and at least one third electrode, a high-frequency signal input to the plurality of second electrodes being amplified by the transistor and output from the third electrode, wherein at least two first electrodes from among the plurality of first electrodes are each grounded via a capacitor, and the electrostatic capacitance values of the two capacitors are set at mutually different values.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: February 23, 1999
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobumitsu Amachi, Yasushi Yamamoto, Koichi Sakamoto, Mitsuhiro Tsuchioka