Patents by Inventor Mitsuhiro Yada
Mitsuhiro Yada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9181217Abstract: The present invention provides an industrially advantageous method for producing an optically active naphthalene compound useful as a therapeutic agent for dermatitis or the like. Specifically, the present invention provides a method for producing an optically active naphthalene compound [I], which comprises: a step of reacting a compound [a-1] and a compound [b-1] with each other in the presence of a base and a catalyst that is composed of a Pd compound and a tertiary phosphine ligand (step a); a step of asymmetrically hydrogenating a compound [c-1] in the presence of a hydrogen donor and a complex that is prepared from a ruthenium compound and a chiral ligand, or alternatively in the presence of an optically active oxazaborolidine compound (a CBS catalyst) and a boron hydride compound (step b); and a step of treating a compound [d-1] with a reducing agent (step c). (In the above formulae, Ra and Rb represent the same or different lower alkyl groups; and X1 represents a halogen atom.).Type: GrantFiled: August 24, 2012Date of Patent: November 10, 2015Assignee: MITSUBISHI TANABE PHARMA CORPORATIONInventors: Koji Matsuyama, Masanori Hatsuda, Masahiko Yoshinaga, Mitsuhiro Yada, Koichi Tanimoto
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Patent number: 9056850Abstract: The present invention is directed to a novel process for the preparation of compounds having inhibitory activity against sodium-dependent glucose transporter (SGLT) being present in the intestine or kidney.Type: GrantFiled: October 14, 2009Date of Patent: June 16, 2015Assignees: Janssen Pharmaceutica N.V., Mitsubishi Tanabe Pharma CorporationInventors: Walter Ferdinand Maria Filliers, Rudy Laurent Maria Broeckx, Patrick Hubert J. Nieste, Masanori Hatsuda, Masahiko Yoshinaga, Mitsuhiro Yada, Christopher Teleha
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Publication number: 20150152082Abstract: The present invention provides an industrially advantageous method for producing an optically active naphthalene compound useful as a therapeutic agent for dermatitis or the like. Specifically, the present invention provides a method for producing an optically active naphthalene compound [I], which comprises: a step of reacting a compound [a-1] and a compound [b-1] with each other in the presence of a base and a catalyst that is composed of a Pd compound and a tertiary phosphine ligand (step a); a step of asymmetrically hydrogenating a compound [c-1] in the presence of a hydrogen donor and a complex that is prepared from a ruthenium compound and a chiral ligand, or alternatively in the presence of an optically active oxazaborolidine compound (a CBS catalyst) and a boron hydride compound (step b); and a step of treating a compound [d-1] with a reducing agent (step c). (In the above formulae, Ra and Rb represent the same or different lower alkyl groups; and X1 represents a halogen atom.Type: ApplicationFiled: August 24, 2012Publication date: June 4, 2015Applicant: MITSUBISHI TANABE PHARMA CORPORATIONInventors: Koji Matsuyama, Masanori Hatsuda, Masahiko Yoshinaga, Mitsuhiro Yada, Koichi Tanimoto
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Publication number: 20100099883Abstract: The present invention is directed to a novel process for the preparation of compounds having inhibitory activity against sodium-dependent glucose transporter (SGLT) being present in the intestine or kidney.Type: ApplicationFiled: October 14, 2009Publication date: April 22, 2010Inventors: Walter Ferdinand Maria Fillers, Rudy Laurent Maria Broeckx, Patrick Hubert J. Nieste, Masanori Hatsuda, Masahiko Yoshinaga, Mitsuhiro Yada
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Patent number: 7585558Abstract: The present invention discloses: a composition comprising (A) an epoxy group-containing vinyl ester resin having, in the molecule, 0.8 to 0.3 equivalent of epoxy group and 0.2 to 0.7 equivalent of an ethylenically unsaturated group, (B) a radical-polymerizable monomer, (C) a curing agent, and (D) a carbon fiber impregnated with 0.5 to 5% by mass of (d) a vinyl ester resin as a sizing agent, obtained by an addition reaction of an epoxy resin and an ethylenically unsaturated carboxylic acid, and a carbon fiber-reinforced resin composite material produced by curing the above composition.Type: GrantFiled: January 28, 2004Date of Patent: September 8, 2009Assignees: Toho Tenax Co., Ltd., Showa Highpolymer Co., Ltd.Inventors: Yoshinori Suzuki, Yutaka Miura, Katsura Horikoshi, Mitsuhiro Yada
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Publication number: 20080108726Abstract: To provide a polycarboxylic acid resin which is obtained by reacting an epoxy resin (a) having two glycidyl groups with, e.g. itaconic acid (b) and ethylenic monocarboxylic acid (c) to obtain linear adduct polymer (A); and by reacting linear adduct polymer (A) with polybasic acid anhydride (d). According to the present invention, there are provided a polycarboxylic acid resin, its composition, and its cured product. The composition can facilely be dried upon preliminary heating and show an improved tack-free property, an excellent photo-curing property, an excellent development property in an aqueous alkali solution, and excellent physical properties such as electrical, mechanical, heat resistance, solvent resistance, adhesiveness, flexibility, etc.Type: ApplicationFiled: October 22, 2007Publication date: May 8, 2008Inventors: Shu Guo, Takuya Kikawa, Mitsuhiro Yada, Yoshikazu Hosoda
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Publication number: 20060154039Abstract: The present invention discloses: a composition comprising (A) an epoxy group-containing vinyl ester resin having, in the molecule, 0.8 to 0.3 equivalent of epoxy group and 0.2 to 0.7 equivalent of an ethylenically unsaturated group, (B) a radical-polymerizable monomer, (C) a curing agent, and (D) a carbon fiber impregnated with 0.5 to 5% by mass of (d) a vinyl ester resin as a sizing agent, obtained by an addition reaction of an epoxy resin and an ethylenically unsaturated carboxylic acid, and a carbon fiber-reinforced resin composite material produced by curing the above composition.Type: ApplicationFiled: January 28, 2004Publication date: July 13, 2006Applicants: TOHO TENAX CO., LTD, SHOWA HIGHPLOYMER CO., LTD.Inventors: Yoshinori Suzuki, Yutaka Miura, Katsura Horikoshi, Mitsuhiro Yada
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Publication number: 20050261458Abstract: To provide a polycarboxylic acid resin which is obtained by reacting an epoxy resin (a) having two glycidyl groups with, e.g. itaconic acid (b) and ethylenic monocarboxylic acid (c) to obtain linear adduct polymer (A); and by reacting linear adduct polymer (A) with polybasic acid anhydride (d). According to the present invention, there are provided a polycarboxylic acid resin, its composition, and its cured product. The composition can facilely be dried upon preliminary heating and show an improved tack-free property, an excellent photo-curing property, an excellent development property in an aqueous alkali solution, and excellent physical properties such as electrical, mechanical, heat resistance, solvent resistance, adhesiveness, flexibility, etc.Type: ApplicationFiled: June 13, 2003Publication date: November 24, 2005Inventors: Shu Guo, Takuya Kikawa, Mitsuhiro Yada, Yoshikazu Hosoda
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Patent number: 6727042Abstract: A photosensitive resin composition according to the invention includes (A) a photosensitive resin, (B) an epoxy resin, (C) a photopolymerization initiator, and (D) a polymerizable unsaturated compound and/or a solvent, which photosensitive resin (A) is obtained by allowing an epoxy resin (a) to react with a compound (b) having one primary alcoholic hydroxyl group and one functional group selected from a carboxyl group and a secondary amino group per molecule and an unsaturated monobasic acid (c) to yield a reaction product (I) and allowing a saturated or unsaturated polybasic acid anhydride (d) to react with the reaction product (I). The photosensitive resin composition of the invention is used as a solder resist in printed circuit boards, can be satisfactorily developed in a dilute basic aqueous solution and can yield a cured film that is excellent in flexibility, water resistance, adhesion, solder heat resistance, electroless gold plating resistance and pressure cooker test (PCT) resistance.Type: GrantFiled: July 11, 2002Date of Patent: April 27, 2004Assignee: Showa Highpolymer Co., Ltd.Inventors: Toru Takagi, Mitsuhiro Yada, Takeshi Saitou
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Publication number: 20030087189Abstract: A photosensitive resin composition according to the invention includes (A) a photosensitive resin, (B) an epoxy resin, (C) a photopolymerization initiator, and (D) a polymerizable unsaturated compound and/or a solvent, which photosensitive resin (A) is obtained by allowing an epoxy resin (a) to react with a compound (b) having one primary alcoholic hydroxyl group and one functional group selected from a carboxyl group and a secondary amino group per molecule and an unsaturated monobasic acid (c) to yield a reaction product (I) and allowing a saturated or unsaturated polybasic acid anhydride (d) to react with the reaction product (I). The photosensitive resin composition of the invention is used as a solder resist in printed circuit boards, can be satisfactorily developed in a dilute basic aqueous solution and can yield a cured film that is excellent in flexibility, water resistance, adhesion, solder heat resistance, electroless gold plating resistance and pressure cooker test (PCT) resistance.Type: ApplicationFiled: July 11, 2002Publication date: May 8, 2003Inventors: Toru Takagi, Mitsuhiro Yada, Takeshi Saitou
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Patent number: 6017588Abstract: The present invention relates to a method for reinforcing a structure comprising the steps of forming a primer layer on the surface of a structure to be reinforced; forming if necessary a putty layer on the primer layer; applying an impregnating resin on the formed primer layer provided that the putty layer in case where the putty layer is formed on the primer layer, before, after or before and after cladding with the fiber sheets, to allow the resin to penetrate into the spaces in the fiber sheets; and curing the resin,the said primer, putty and impregnating resin comprising a resin composition which can cure at a temperature not more than 5.degree. C.Type: GrantFiled: February 25, 1998Date of Patent: January 25, 2000Assignee: Mitsubishi Chemical CorporationInventors: Takeshi Watanabe, Hiroaki Katano, Tsuneo Tanaka, Joji Shibata, Mitsuhiro Yada, Takeshi Nemoto