Patents by Inventor Mitsuhito Kanatake

Mitsuhito Kanatake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230275108
    Abstract: A solid-state imaging apparatus is provided that, in a configuration including a mold resin portion formed around an image sensor and cover glass, enables potential burrs of the mold resin on a cover glass surface to be prevented without the need for a dedicated mold, the cover glass having a light blocking effect, and a method for manufacturing the solid-state imaging apparatus and electronic equipment are also provided. The solid-state imaging apparatus includes a substrate, an image sensor provided on the substrate, a transparent member provided on the image sensor via a support portion, and a mold resin portion formed around the image sensor and the transparent member on the substrate, and a front surface, a side surface, or a back surface of the transparent member is provided with a groove portion in a region outside a light receiving area of the image sensor.
    Type: Application
    Filed: July 26, 2021
    Publication date: August 31, 2023
    Inventors: YASUSHI OTSUKA, WENSHUANG DONG, SHUMPEI AOKI, MITSUHITO KANATAKE
  • Publication number: 20220254824
    Abstract: To arrange a protective material horizontally with respect to a substrate plane without the protective material coming into contact with wires in a wire-bonded semiconductor package. The semiconductor package includes a protective material, a substrate, bumps, and a semiconductor chip. The bumps are provided on a chip plane of the semiconductor chip and are connected to the substrate via wires. The semiconductor chip is laminated on the substrate. A support is provided on the chip plane to support the protective material at a position where the height from the chip plane of the semiconductor chip is higher than the bumps.
    Type: Application
    Filed: February 26, 2020
    Publication date: August 11, 2022
    Inventor: MITSUHITO KANATAKE
  • Publication number: 20210233949
    Abstract: Deformation of a semiconductor chip is to be prevented in a semiconductor device in which a heat releasing plate and a circuit board are disposed. The semiconductor device includes the semiconductor chip, the circuit board, the heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.
    Type: Application
    Filed: June 21, 2019
    Publication date: July 29, 2021
    Inventors: DAISUKE CHINO, HIROYUKI SHIGETA, SHIGEKAZU ISHII, KOYO HOSOKAWA, HIROHISA YASUKAWA, MITSUHITO KANATAKE, KOSUKE HAREYAMA, YUTAKA OOTAKI, KIYOHISA SAKAI, ATSUSHI TSUKADA, HIROTAKA KOBAYASHI, NINAO SATO, YUKI YAMANE
  • Patent number: 8288183
    Abstract: An optically coupled device includes a light emitting element and a light receiving element which are electrically isolated from each other, and an optical waveguide allowing therethrough transmission of light from the light emitting element to the light receiving element, wherein the optical waveguide is covered with an encapsulation resin containing a light reflective inorganic particle which is typically composed of titanium oxide, the light emitting element and the light receiving element are respectively provided on a base (for example, package terminals), and the entire portion of the outer surface of the optical waveguide, brought into contact with none of the light emitting element, the light receiving element and the base, is covered with the encapsulation resin.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: October 16, 2012
    Assignee: Renesas Electronics Corporation
    Inventor: Mitsuhito Kanatake
  • Publication number: 20120104636
    Abstract: An optically coupled device includes a light emitting element and a light receiving element which are electrically isolated from each other, and an optical waveguide allowing therethrough transmission of light from the light emitting element to the light receiving element, wherein the optical waveguide is covered with an encapsulation resin containing a light reflective inorganic particle which is typically composed of titanium oxide, the light emitting element and the light receiving element are respectively provided on a base (for example, package terminals), and the entire portion of the outer surface of the optical waveguide, brought into contact with none of the light emitting element, the light receiving element and the base, is covered with the encapsulation resin.
    Type: Application
    Filed: December 30, 2011
    Publication date: May 3, 2012
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventor: Mitsuhito KANATAKE
  • Patent number: 8143637
    Abstract: An optically coupled device includes a light emitting element and a light receiving element which are electrically isolated from each other, and an optical waveguide allowing therethrough transmission of light from the light emitting element to the light receiving element, wherein the optical waveguide is covered with an encapsulation resin containing a light reflective inorganic particle which is typically composed of titanium oxide, the light emitting element and the light receiving element are respectively provided on a base (for example, package terminals), and the entire portion of the outer surface of the optical waveguide, brought into contact with none of the light emitting element, the light receiving element and the base, is covered with the encapsulation resin.
    Type: Grant
    Filed: January 6, 2010
    Date of Patent: March 27, 2012
    Assignee: Renesas Electronics Corporation
    Inventor: Mitsuhito Kanatake
  • Publication number: 20100171127
    Abstract: An optically coupled device includes a light emitting element and a light receiving element which are electrically isolated from each other, and an optical waveguide allowing therethrough transmission of light from the light emitting element to the light receiving element, wherein the optical waveguide is covered with an encapsulation resin containing a light reflective inorganic particle which is typically composed of titanium oxide, the light emitting element and the light receiving element are respectively provided on a base (for example, package terminals), and the entire portion of the outer surface of the optical waveguide, brought into contact with none of the light emitting element, the light receiving element and the base, is covered with the encapsulation resin.
    Type: Application
    Filed: January 6, 2010
    Publication date: July 8, 2010
    Applicant: NEC ELECTRONICS CORPORATION
    Inventor: Mitsuhito KANATAKE
  • Publication number: 20080042080
    Abstract: Provided is a photocoupling device including: a first photocoupling unit including a first light-receiving element and a first light-emitting element that are arranged to oppose each other; a second photocoupling unit including a second light-receiving element and a second light-emitting element that are arranged to oppose each other; and a lead frame including a first land portion for giving electric connection to the first light-receiving element and the first light-emitting element, and a second land portion for giving electric connection to the second light-receiving element and the second light-emitting element, in which the second photocoupling unit is mounted immediately above the first photocoupling unit mounted on the lead frame.
    Type: Application
    Filed: August 20, 2007
    Publication date: February 21, 2008
    Applicant: NEC Electronics Corporation
    Inventor: Mitsuhito Kanatake
  • Patent number: 7060530
    Abstract: A semiconductor package has a base member made of a wiring board or a lead frame, a wall member fixed onto the base member to define a cavity, and a cured-resin cap member for encapsulating a semiconductor chip in the cavity. The curable-resin cap member is fixed onto the wall member by the curing process for the curable-resin cap member.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: June 13, 2006
    Assignee: NEC Compound Semiconductor Devices, Ltd.
    Inventor: Mitsuhito Kanatake
  • Publication number: 20020190266
    Abstract: A semiconductor package has a base member made of a wiring board or a lead frame, a wall member fixed onto the base member to define a cavity, and a cured-resin cap member for encapsulating a semiconductor chip in the cavity. The curable-resin cap member is fixed onto the wall member by the curing process for the curable-resin cap member.
    Type: Application
    Filed: June 12, 2002
    Publication date: December 19, 2002
    Applicant: NEC Compound Semiconductor Devices, Ltd.
    Inventor: Mitsuhito Kanatake
  • Publication number: 20020020923
    Abstract: In the present invention, a semiconductor device is provided having a semiconductor chip mounted on a chip mounting part of a lead frame, a resin receiver provided on the side of the rear surface of the chip mounting part, primary sealing resin that seals the semiconductor chip in a range in which the resin receiver is provided so that space is formed between the semiconductor chip and the resin receiver and secondary sealing resin that wraps the primary sealing resin together with the resin receiver and forms double sealed structure.
    Type: Application
    Filed: August 7, 2001
    Publication date: February 21, 2002
    Applicant: NEC CORPORATION
    Inventor: Mitsuhito Kanatake