Abstract: A processing apparatus of the present invention processes for a wafer. The processing apparatus includes an XY stage which includes a wafer chuck which holds the wafer and an elevating device which rises relative to the wafer chuck to hold the wafer, and a wafer conveying robot hand which conveys the wafer from the XY stage at a wafer transfer position. The XY stage moves to change a direction at an angle between degree and degree via the wafer transfer position in a state where the elevating device rises relative to the wafer chuck. The wafer conveying robot hand has a shape which does not interfere with the XY stage which moves to change the direction at the angle when the wafer conveying hand is positioned at the wafer transfer position.

Abstract: A processing apparatus of the present invention processes for a wafer. The processing apparatus includes an XY stage which includes a wafer chuck which holds the wafer and an elevating device which rises relative to the wafer chuck to hold the wafer, and a wafer conveying robot hand which conveys the wafer from the XY stage at a wafer transfer position. The XY stage moves to change a direction at an angle between degree and degree via the wafer transfer position in a state where the elevating device rises relative to the wafer chuck. The wafer conveying robot hand has a shape which does not interfere with the XY stage which moves to change the direction at the angle when the wafer conveying hand is positioned at the wafer transfer position.

Abstract: A processing apparatus of the present invention processes for a wafer 9. The processing apparatus includes an XY stage 6 which includes a wafer chuck 8 which holds the wafer 9 and an elevating device which rises relative to the wafer chuck 8 to hold the wafer 9, and a wafer conveying robot hand 14 which conveys the wafer 9 from the XY stage 6 at a wafer transfer position 18. The XY stage 6 moves to change a direction at an angle between 30 degree and 120 degree via the wafer transfer position 18 in a state where the elevating device rises relative to the wafer chuck 8. The wafer conveying robot hand 14 has a shape which does not interfere with the XY stage 6 which moves to change the direction at the angle when the wafer conveying hand 14 is positioned at the wafer transfer position 18.

Abstract: A processing apparatus of the present invention processes for a wafer 9. The processing apparatus includes an XY stage 6 which includes a wafer chuck 8 which holds the wafer 9 and an elevating device which rises relative to the wafer chuck 8 to hold the wafer 9, and a wafer conveying robot hand 14 which conveys the wafer 9 from the XY stage 6 at a wafer transfer position 18. The XY stage 6 moves to change a direction at an angle between 30 degree and 120 degree via the wafer transfer position 18 in a state where the elevating device rises relative to the wafer chuck 8. The wafer conveying robot hand 14 has a shape which does not interfere with the XY stage 6 which moves to change the direction at the angle when the wafer conveying hand 14 is positioned at the wafer transfer position 18.

Abstract: A pod attachable to an outside surface of a grounded electromagnetic-shielded chamber. The chamber has a door and a flange portion, around the door, on the outside surface and contains a micro-device manufacturing apparatus. The pod includes walls configured to contain a substrate and having an opening, the walls including a flange portion configured to contact the flange portion of the chamber, and a lid configured to openably close the opening, the substrate being transferred between the pod and the chamber through the opening. Also included is an electromagnetic shield member. The electromagnetic shield member is arranged over the walls and on the flange portion of the walls. The electromagnetic shield member on the flange portion of the walls is configured to contact the grounded flange portion of the chamber while the pod is attached to the outside surface.

Abstract: A semiconductor manufacturing apparatus includes a leakage preventing device for preventing outward leakage of electromagnetic waves through an opening defined when a pod having a substrate accommodated therein is mounted on the semiconductor manufacturing apparatus. The leakage preventing device includes at least one electromagnetic wave shielding plate and is provided at the semiconductor manufacturing apparatus side. The apparatus also includes a first electromagnetic wave shielding plate, which is openable and closable so that an opening defined when a carrier in the standard mechanical interface pod is moved downwardly is closed by the plate, and a second electromagnetic wave shielding plate, which has an openable and closable slit provided between an indexer for moving the carrier in the standard mechanical interface pod downwardly and a conveyance robot for conveying the substrate.

Abstract: A substrate holding device includes a vacuum supplying device for supplying a vacuum to a holding surface to hold a substrate, a hollow member surrounding at least a portion of the holding surface and movable between a position in which the holding member protrudes from the holding surface and a position in which the hollow member does not protrude from the holding surface, and a moving mechanism for relatively moving between the hollow member and the holding surface.

Abstract: A substrate holding apparatus in which first and second vacuum clamping devices each have a holding surface for holding a portion of a substrate, a first driving device for rotating the first vacuum clamping device relative to the second vacuum clamping device, and a second driving device for reciprocally moving the first vacuum clamping device between a position in which it protrudes by a predetermined amount from the holding surface of the second vacuum clamping device and a position in which it does not protrude from that holding surface. Also disclosed is a substrate holding device in which a vacuum clamping device creates a vacuum clamp force on the holding surface thereof, a cylindrical delivering member surrounds at least a portion of the holding surface and is reciprocally movable between a position in which it protrudes by a predetermined amount from the holding surface and a position in which it does not protrude from the holding surface, and a driving device for moving the delivering member.

Abstract: A substrate conveying system includes an attracting device for attracting a substrate with reduced pressure, a moving device for relatively moving the substrate relative to the attracting device, and a detecting device for detecting the pressure of the attracting device during the relative movement of the substrate to thereby obtain positional information related to the substrate.

Abstract: A substrate holding system includes a holding mechanism for holding a substrate through vacuum attraction, a vacuum evacuating device for supplying a vacuum to the holding mechanism, a first voltage source for supplying electric power to the vacuum evacuating device, a second voltage source, separate from the first voltage source, for supplying electric power to the vacuum evacuating device, and a controller for energizing the vacuum evacuating device at a higher evacuation capacity level, when the first voltage source is in operable order, and for energizing the vacuum evacuating device at a lower evacuation capacity level, when the second voltage source supplies electric power to the vacuum evacuating device, and the first voltage source is not in operable order.

Abstract: A substrate holding apparatus includes a pump, serving as a suction source, a conveying chuck for holding a wafer substrate by suction, a connection arrangement, including parallel lines intermediate the connection arrangement, for conneting the pump to the chuck, and a valve arrangement including at least one valve provided in at least one of the parallel lines. By selecting one of the parallel lines by controlling opening/closing of these valves, the conductance of the connection line is adjusted, whereby the optimum suction pressure for the chuck is set.

Abstract: A wafer holding device of the vacuum attraction type includes a structural member having a protrusion for supporting a wafer and elastic members made of a material having an elasticity modulus smaller than that of the wafer and that of the structural member. The elastic members are distributed on a wafer attraction plane of the structural member.

Abstract: A wafer table includes a wafer holding surface for holding a wafer by attraction; a flow passageway through which a temperature adjusting medium flows to remove any heat in the wafer table; a temperature measuring system for measuring the temperature of the wafer held by the wafer holding surface; a temperature adjusting system disposed between the wafer holding surface and the flow passageway; a temperature setting system for setting a temperature related to the wafer held by the wafer holding surface; a flow rate controlling system for controlling the flow rate of the temperature adjusting medium to be circulated through the flow passageway; and a temperature controlling system for controlling the operation of the temperature adjusting system related to heat, on the basis of a value set by the temperature setting system and a value measured by the temperature measuring system.

Abstract: A vacuum attraction type substrate holding system includes a vacuum source; a distributor for distributing a vacuum from the vacuum source into plural vacuum lines; a plurality of vacuum attraction type substrate holding portions corresponding to the vacuum lines, respectively, each of the substrate holding portions having a valve which is openable and closable for control of the supply of vacuum to the corresponding substrate holding portions, wherein the opening or closing of each valve is influential to control attraction or release of a substrate to or from a corresponding substrate holding portion; and a plurality of restriction valves each being disposed between the distributor and corresponding one of the valves, for serving as a resistance to a gas flowing from the corresponding valve.

Abstract: A vacuum-attraction holding device includes a holding base having an attracting surface, for holding a substrate thereon; a suction passageway formed in the base, for supplying a vacuum to the holding base to attract the substrate to the attracting surface; and a pressure sensor provided in the base and being communicated with the suction passageway.

Abstract: A device for holding a substrate includes a holding system for holding a substrate by attraction and a guard system for preventing dropping of the substrate held by the holding system, the guard system being out of contact with the substrate as the same is held by the holding system.