Patents by Inventor Mitsuki Nagato

Mitsuki Nagato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Socket unit for package having pins and pads
    Patent number: 5057904
    Abstract: A package and socket unit for testing a pin grid array package which includes a package having a plurality of pads electrically connected to pins and surrounding an area in which the pins are arranged, and a socket having contacts adapted to be electrically connected to the pads and provided with a chamber in which the pins are received without contact between the walls and the bottom of the chamber. The unit also may include a carrier for holding the package in the socket.
    Type: Grant
    Filed: March 7, 1989
    Date of Patent: October 15, 1991
    Assignee: Fujitsu Limited
    Inventors: Mitsuki Nagato, Thutomu Yoshizaki