Abstract: A semiconductor device of a high degree of integration capable of bringing about required functions within a short period of delivery time. A stacked chip 4 is constituted by bonding together pads 8a, 8b, . . . of a first chip 8 and pads 6a, 6b, . . . of a second chip 6. The first chip 8 is formed with an FPGA (field programmable gate array) and the second chip 6 is formed with a CPU (central processing unit) . An LSI 2 is used for example as a controller for controlling external devices. In that case, the FPGA is used as an interface circuit interconnecting the CPU and the external devices. A required interface circuit corresponding to the external devices is obtained by changing the program of the FPGA. This type of controller required to save space to a great extent may be made compact by the use of the stacked chip 4.

Abstract: A semiconductor device of a high degree of integration capable of bringing about required functions within a short period of delivery time. A stacked chip 4 is constituted by bonding together pads 8a, 8b, . . . of a first chip 8 and pads 6a, 6b, . . . of a second chip 6. The first chip 8 is formed with an FPGA (field programmable gate array) and the second chip 6 is formed with a CPU (central processing unit). An LSI 2 is used for example as a controller for controlling external devices. In that case, the FPGA is used as an interface circuit interconnecting the CPU and the external devices. A required interface circuit corresponding to the external devices is obtained by changing the program of the FPGA. This type of controller required to save space to a great extent may be made compact by the use of the stacked chip 4.