Abstract: The invention relates to a process for producing a fuel absorbent, which comprises the steps of: dissolving an organic polymer having a function of trapping fuel in a solvent to produce a polymer solution; adding a crosslinking agent to said polymer solution to allow said organic polymer to react in the presence of said crosslinking agent; and collecting, after the completion of the crosslinking reaction, the resultant fine polymer gel particles. The invention also relates to a porous fuel absorbent produced by the above process comprised of fine cross-linked organic polymer formed into particles. The above fuel absorbent along with the coatings and a carrier may be used to control fuel evaporation loss in automobile canisters or boiler fuel tanks.

Abstract: Epoxy resin compositions including an epoxy resin, a hardener and an additive for forming a rust preventing film are provided. The additive is at least one selected from dithiophosphoric acids, dithiophosphoric acid derivatives, metal salts of dithiocarbamic acids and oxidized waxes. The composition may also include a secondary additive such as an organosilicon compound, an organoaluminum compound or an organotitanium compound for dithiophosphoric acid and/or dithiophosphoric acid derivative; an alkylarylsilsesquioxane silicone compound for a metal salt of dithiocarbamic acid; an alkylarylsilsesquioxane silicone compound, an organoaluminum compound, an organotitanium compound or an organotin compound for an oxidized wax. These epoxy resin compositions, when used as encapsulating materials, prevent moisture and impurities from penetrating into the surface of an encapsulated product because of the rust preventing film existing between the composition and the encapsulated product.

Abstract: Epoxy resin compositions including an epoxy resin, a hardener and an additive containing a rust preventing film forming component are provided. The additive is lanolin and/or a lanolin derivative. Optionally, the composition also includes a secondary additive selected from organosilicon compounds, organoaluminum compounds, organotitantium compounds, organotin compounds, liquid rubber having functional groups at both ends of the molecule, petroleum lubricating oils or Japan wax. These epoxy resin compositions, when used as encapsulating materials, prevent moisture and impurities from invading the surface of the device.