Patents by Inventor Mitsunao Homma

Mitsunao Homma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040112635
    Abstract: An electronic component comprises a substrate having a through hole formed in a thickness direction thereof; and a conductor, disposed in the through hole, for electrically connecting one side of the substrate to the other side thereof. The through hole has a major axis diameter and a minor axis diameter on at least one of one side and the other side of the substrate.
    Type: Application
    Filed: November 26, 2003
    Publication date: June 17, 2004
    Applicant: TDK CORPORATION
    Inventors: Satoshi Sasaki, Kazushi Tachimoto, Mitsunao Homma