Patents by Inventor Mitsunao Sekiwa

Mitsunao Sekiwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7449097
    Abstract: The present invention provides an electrophoretic mobility measuring apparatus capable of conducting measurement with high sensitivity with optical attenuation reduced by incidence of light through the electrode face. This apparatus comprises a transparent electrode 63 forming a part of a cell wall of a cell 6 capable of confining a sample, and the other electrode 62 opposite to the transparent electrode 63. A voltage is applied across these electrodes 62, 63, and light is incident upon the inside of the cell 6 through the transparent electrode 63. The scattering light which scatters from a sample S at a predetermined angle ? with respect to the incident angle, is received through the transparent electrode 63. The Doppler displacement is then measured based on the difference in frequency between the incident light and the outgoing light.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: November 11, 2008
    Assignee: Otsuka Electronics Co., Ltd.
    Inventors: Mitsunao Sekiwa, Kazunori Tsutsui, Katsuhiro Morisawa, Takashi Fujimoto, Atsushi Toyoshima
  • Publication number: 20040251134
    Abstract: The present invention provides an electrophoretic mobility measuring apparatus capable of conducting measurement with high sensitivity with optical attenuation reduced by incidence of light through the electrode face. This apparatus comprises a transparent electrode 63 forming a part of a cell wall of a cell 6 capable of confining a sample, and the other electrode 62 opposite to the transparent electrode 63. A voltage is applied across these electrodes 62, 63, and light is incident upon the inside of the cell 6 through the transparent electrode 63. The scattering light which scatters from a sample S at a predetermined angle &thgr; with respect to the incident angle, is received through the transparent electrode 63. The Doppler displacement is then measured based on the difference in frequency between the incident light and the outgoing light.
    Type: Application
    Filed: February 24, 2004
    Publication date: December 16, 2004
    Inventors: Mitsunao Sekiwa, Kazunori Tsutsui, Katsuhiro Morisawa, Takashi Fujimoto, Atsushi Toyoshima
  • Patent number: 4922309
    Abstract: An optical waveguide having a detour is disposed at either or both of the light-receiving and light-emitting ends of a dispersion optical system in a spectroscope. Even though light being propagated through the optical waveguide has specified polarizing characteristics, the light is depolarized by passing through the optical waveguide and many times reflecting therein. Accordingly, unpolarized light not affected by the polarization selectivity of the dispersion optical system or the like can be emitted from the spectroscope.
    Type: Grant
    Filed: November 7, 1988
    Date of Patent: May 1, 1990
    Assignee: Otsuka Electronics Co., Ltd.
    Inventors: Mitsunao Sekiwa, Tomohiro Akada
  • Patent number: 4436006
    Abstract: A cutting method comprising using a main body in the form of a circular disk and a hard layer provided on one surface of the main body and having a thickness of 0.02 to 0.2 mm. The hard layer is made of cemented carbides, TiC TaC, Cr.sub.2 C.sub.3, Al.sub.2 O.sub.3 or the like, while the main body is made of a material, such as steel, non-ferrous metal or plastics, which is lower than the hard layer in abrasion resistance. The hard layer is formed along its outer periphery with a cutting edge which is self-sharpened when chipped.
    Type: Grant
    Filed: September 22, 1980
    Date of Patent: March 13, 1984
    Assignees: Matsushita Electric Industrial Co., Ltd., Mitsubishi Metal Corporation
    Inventors: Hiromichi Nakamura, Haruya Urano, Tatsuo Kojima, Mitsunao Sekiwa
  • Patent number: 4200018
    Abstract: First and second elongated support members for supporting a circuit board and for transporting the circuit board in one direction parallel to the lengthwise direction of the support members are provided on a frame, and a blade member is rotatably supported on the frame for rotation about its own axis in a plane parallel to the plane of the circuit board. While the circuit board is being transported with opposed edges of the circuit board guided along the support member, the blade member trims excessive length from wires extending from the circuit board.
    Type: Grant
    Filed: November 29, 1977
    Date of Patent: April 29, 1980
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Mitsunao Sekiwa