Patents by Inventor Mitsunao Shibasaki

Mitsunao Shibasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6387182
    Abstract: A substrate processing apparatus forms a thin film of high-dielectric or ferroelectric such as barium/strontium titanates, or a copper film for wiring on a substrate, and has a gas ejection head for individually introducing at least two gases including a material gas and ejecting the gases toward a substrate to be processed. The gas ejection head has at least two gas passageways for individually introducing the two gases, and at least two temperature control devices for individually controlling temperatures of the gases flowing through the gas passageways.
    Type: Grant
    Filed: March 2, 2000
    Date of Patent: May 14, 2002
    Assignee: Ebara Corporation
    Inventors: Kuniaki Horie, Yukio Fukunaga, Naoaki Ogure, Tsutomu Nakada, Masahito Abe, Mitsunao Shibasaki, Hidenao Suzuki, Yuji Araki, Kiwamu Tsukamoto
  • Patent number: 6176929
    Abstract: A compact thin-film deposition apparatus can promote a stable growth of a high quality thin-film product of uniform quality. The apparatus comprises a vacuum-tight deposition chamber enclosing a substrate holding device for holding a substrate. An elevator device for moving the substrate holding device and a gas showering head for flowing a film forming gas towards the substrate are provided. A transport opening and an exhaust opening are provided on a wall section of the deposition chamber at a height corresponding to the transport position and the deposition position, respectively. The deposition chamber is provided with a flow guiding member, and the flow guiding member comprises a cylindrical member to surround an elevating path of the substrate holding device and a first ring member to vertically divide a chamber space at a height between the exhaust opening and the transport opening.
    Type: Grant
    Filed: July 17, 1998
    Date of Patent: January 23, 2001
    Assignee: Ebara Corporation
    Inventors: Yukio Fukunaga, Hiroyuki Shinozaki, Kiwamu Tsukamoto, Mitsunao Shibasaki, Kuniaki Horie, Hiroyuki Ueyama, Takeshi Murakami
  • Patent number: 5950646
    Abstract: A vapor feed supply system including a vaporizer device and a method of cleaning a vapor flow region employing such a vaporizer device enables thorough cleaning of the system, without having to degrade the overall system vacuum in the process of cleaning the vaporizer device. The method includes defining a cleaning fluid passage having a predetermined withstand pressure by isolating a cleaning region of the vapor flow region, and flowing a cleaning fluid into the cleaning fluid passage under a pressure so as to enable the cleaning fluid to remain in a liquid state at a cleaning temperature of the cleaning region.
    Type: Grant
    Filed: January 8, 1998
    Date of Patent: September 14, 1999
    Assignee: Ebara Corporation
    Inventors: Kuniaki Horie, Hidenao Suzuki, Tsutomu Nakada, Takeshi Murakami, Yukio Fukunaga, Masahito Abe, Hiroyuki Shinozaki, Kiwamu Tsukamoto, Mitsunao Shibasaki, Yuji Araki, Hiroyuki Ueyama
  • Patent number: 5904301
    Abstract: A spraying device for conveniently spraying a plurality of cleaning liquids, e.g., a chemical solution and pure water, over a workpiece, includes sprayer body defining therein a plurality of fluid passages. The fluid passages are separate from each other, and each of the fluid passages is communicated to a respective nozzle portion having a nozzle outlet at a nozzle surface defined on an outer surface of the sprayer body. The nozzle portions communicating each of the different fluid passages have substantially the same distribution in the nozzle surface.
    Type: Grant
    Filed: March 24, 1997
    Date of Patent: May 18, 1999
    Assignee: Ebara Corporation
    Inventors: Masaaki Kajiyama, Mitsunao Shibasaki
  • Patent number: 5829156
    Abstract: A spin dryer apparatus substrate such as a wafer can dry without degrading the cleanliness on both front and back sides of the wafer and without unnecessary cost increases. The spin dryer apparatus includes a holder section for holding a substrate in a substantially horizontal plane and defining a back space located beneath a back surface of the substrate, a driving section for rotating the holder section in the substantially horizontal plane, and a gas supply mechanism for supplying a clean gas into the back space. It is possible to avoid contamination of the back side of the substrate by preventing an ascending gas flow from approaching the substrate.
    Type: Grant
    Filed: March 19, 1997
    Date of Patent: November 3, 1998
    Assignee: Ebara Corporation
    Inventors: Mitsunao Shibasaki, Naoaki Ogure