Patents by Inventor Mitsunobu Hayashi

Mitsunobu Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11046467
    Abstract: A packaging apparatus includes a controller configured to control operation of a first conveying unit, a second conveying unit, a first moving unit, and a second moving unit. When a film is loaded onto the first conveying unit and the second conveying unit, the controller causes a first clamp unit to clamp the film delivered from a delivering unit and causes a first feeder portion to convey the film. Simultaneously, while causing a second clamp unit to be released or the second clamp unit to intermittently clamp the film delivered from the delivering unit, the controller causes a second feeder portion to convey the film and also causes the second conveying unit to move in a direction separating from the first conveying unit and, when the second conveying unit reaches a predetermined position, causes the second clamp unit to clamp the film.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: June 29, 2021
    Assignee: Ishida Co., Ltd.
    Inventor: Mitsunobu Hayashi
  • Patent number: 10843839
    Abstract: A label-affixing machine affixes a label, which is conveyed by a label conveying body, to the back surface of a product being conveyed. The label-affixing machine includes a label holding unit configured to hold a label so that an adhesive surface of the label faces outward, a pressing mechanism configured to press a label conveying body, which is disposed on a side facing the label holding unit, against the adhesive surface of the held label by moving the label conveying body toward the label holding unit, and a controller that controls the drive of the label conveying body and the pressing mechanism to affix the label to the back surface of the product.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: November 24, 2020
    Assignee: Ishida Co., Ltd.
    Inventors: Hiromu Nishimura, Susumu Kimoto, Hiroaki Tokura, Mitsunobu Hayashi, Yuuki Tai
  • Patent number: 10710755
    Abstract: A packaging apparatus includes a controller configured to control operation of a first conveyance unit, a second conveyance unit, a first moving unit, a second moving unit, and a cutting unit. The controller, after causing the cutting unit to cut a film, causes at least either one of a first clamp unit and a second clamp unit to clamp the cut film and controls operation of at least either one of the first moving unit and the second moving unit so that the distance between the first conveyance unit and the second conveyance unit in a second direction changes.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: July 14, 2020
    Assignee: Ishida Co., Ltd.
    Inventor: Mitsunobu Hayashi
  • Publication number: 20190047738
    Abstract: A label-affixing machine affixes a label, which is conveyed by a label conveying body, to the back surface of a product being conveyed. The label-affixing machine includes a label holding unit configured to hold a label so that an adhesive surface of the label faces outward, a pressing mechanism configured to press a label conveying body, which is disposed on a side facing the label holding unit, against the adhesive surface of the held label by moving the label conveying body toward the label holding unit, and a controller that controls the drive of the label conveying body and the pressing mechanism to affix the label to the back surface of the product.
    Type: Application
    Filed: February 2, 2017
    Publication date: February 14, 2019
    Applicant: Ishida Co., Ltd.
    Inventors: Hiromu NISHIMURA, Susumu KIMOTO, Hiroaki TOKURA, Mitsunobu HAYASHI, Yuuki TAI
  • Publication number: 20170081068
    Abstract: A packaging apparatus includes a controller configured to control operation of a first conveyance unit, a second conveyance unit, a first moving unit, a second moving unit, and a cutting unit. The controller, after causing the cutting unit to cut a film, causes at least either one of a first clamp unit and a second clamp unit to clamp the cut film and controls operation of at least either one of the first moving unit and the second moving unit so that the distance between the first conveyance unit and the second conveyance unit in a second direction changes.
    Type: Application
    Filed: September 14, 2016
    Publication date: March 23, 2017
    Applicant: Ishida Co., Ltd.
    Inventor: Mitsunobu HAYASHI
  • Publication number: 20170081066
    Abstract: A packaging apparatus includes a controller configured to control operation of a first conveying unit, a second conveying unit, a first moving unit, and a second moving unit. When a film is loaded onto the first conveying unit and the second conveying unit, the controller causes a first clamp unit to clamp the film delivered from a delivering unit and causes a first feeder portion to convey the film. Simultaneously, while causing a second clamp unit to be released or the second clamp unit to intermittently clamp the film delivered from the delivering unit, the controller causes a second feeder portion to convey the film and also causes the second conveying unit to move in a direction separating from the first conveying unit and, when the second conveying unit reaches a predetermined position, causes the second clamp unit to clamp the film.
    Type: Application
    Filed: September 14, 2016
    Publication date: March 23, 2017
    Applicant: Ishida Co., Ltd.
    Inventor: Mitsunobu HAYASHI
  • Patent number: 4806511
    Abstract: A dielectric ceramic composition comprises adding CuO of 0.5-2 parts by weight to a composite of 100 parts by weight, said composite being expressed by[Pb.sub.1-x Ba.sub.x ][(Fe.sub.1/3 W.sub.2/3).sub.Y (Fe.sub.1/2 Nb.sub.1/2).sub.Z (Zn.sub.1/3 Nb.sub.2/3).sub.W ]O.sub.3 (1)wherein 0.05.ltoreq.X.ltoreq.0.20, 0.10.ltoreq.Y.ltoreq.0.20, 0.35.ltoreq.Z.ltoreq.0.45 0.40.ltoreq.W.ltoreq.0.50, and Y+Z+W=1. Therefore, it can be sintered particularly at low temperature and the temperature-changing ratio of its dielectric constant is small as well. It is thus suitable for laminated substrates and chip capacitors.
    Type: Grant
    Filed: April 29, 1988
    Date of Patent: February 21, 1989
    Assignee: Alps Electric Co., Ltd.
    Inventor: Mitsunobu Hayashi