Abstract: (Meth)acrylic acid ester, which contains one or more partial structures each represented by the following formula 1 in a molecule thereof, wherein the partial structure is a urethane structure which does not have a hydrogen atom directly bonded to a nitrogen atom of the following formula 1: where the nitrogen atom is not bonded to a hydrogen atom.

Abstract: Ink contains at least one of a compound represented by the following chemical formula 1, a compound represented by chemical formula 2, a compound represented by chemical formula 3, or a compound represented by chemical formula 4.

Abstract: A polymerizable compound is provided. The polymerizable compound has two or more polymerizable functional groups in a molecule thereof, wherein one of the two or more polymerizable functional groups of the polymerizable compound is an acrylamide group having the below-mentioned formula (1). The polymerizable compound can be preferably used for inkjet ink.

Abstract: A heat-sensitive adhesive material contains a substrate and a heat-sensitive adhesive layer that contains a thermoplastic resin and a solid plasticizer, and the heat-sensitive adhesive material is so configured as to be heated and applied to an adherend, wherein the heat-sensitive adhesive material exhibits such an adhesive strength to the adherend as to increase with time from immediately after applying the heat-sensitive adhesive material to the adherend.

Abstract: (Meth)acrylic acid ester, which contains one or more partial structures each represented by the following formula 1 in a molecule thereof, wherein the partial structure is a urethane structure which does not have a hydrogen atom directly bonded to a nitrogen atom of the following formula 1: where the nitrogen atom is not bonded to a hydrogen atom.

Abstract: Provided is a heat-sensitive adhesive agent that mainly comprises a thermoplastic resin and a heat-meltable substance capable of melting upon heating, and further comprises swellable mica.

Abstract: A heat resistance improver including a heat resistance improving component which has a benzotriazole skeleton having an electron attractive group and a reactive aliphatic hydroxyl group or a reactive aliphatic mercapto group, wherein the heat resistance improver is used in a reversible thermosensitive recording medium.

Abstract: A heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin and a thermofusible material, wherein the thermoplastic resin has a glass transition temperature of ?70° C. to ?30° C., and the thermofusible material comprises triphenylphosphine, and at least any one of tris(2,4-di-t-butylphenyl)phosphite and tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate]methane, or a heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin, a thermofusible material and a non-thermofusible material, wherein the thermofusible material contains triphenylphosphine.

Abstract: A thermosensitive adhesive composition including a thermosensitive plastic resin, a dispersing agent, a solid plasticizing agent and a eutectic agent represented by the following chemical structure (1): wherein X1 and X2 independently represent any one of a hydrogen atom, a halogen atom and an alkyl group, p and q independently represent an integer of from 1 to 5.

Abstract: In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is ?70° C. or higher and below 0° C.

Abstract: A heat resistance improver including a heat resistance improving component which has a benzotriazole skeleton having an electron attractive group and a reactive aliphatic hydroxyl group or a reactive aliphatic mercapto group, wherein the heat resistance improver is used in a reversible thermosensitive recording medium.

Abstract: A heat-sensitive adhesive material contains a substrate and a heat-sensitive adhesive layer that contains a thermoplastic resin and a solid plasticizer, and the heat-sensitive adhesive material is so configured as to be heated and applied to an adherend, wherein the heat-sensitive adhesive material exhibits such an adhesive strength to the adherend as to increase with time from immediately after applying the heat-sensitive adhesive material to the adherend.

Abstract: An object of the present invention is to provide a thermosensitive adhesive material which is superior in blocking resistance when not active and which has adequate adhesion in a wide temperature range to a target with little smoothness such as corrugated fiberboard. Specifically, the present invention relates to a thermosensitive adhesive material including a support, and a thermosensitive adhesive layer provided on one surface of the support, the thermosensitive adhesive layer containing as essential components a thermoplastic resin and a hot-melt material that melts when heated, wherein the thermoplastic resin contains as a main component a (meth)acrylic copolymer in which acrylonitrile, a monomer component, occupies 5% by mass to 20% by mass of all monomer components, and wherein the glass transition temperature of the copolymer is in the range of ?70° C. to ?30° C.

Abstract: A heat-sensitive adhesive material contains a substrate and a heat-sensitive adhesive layer that contains a thermoplastic resin and a solid plasticizer, and the heat-sensitive adhesive material is so configured as to be heated and applied to an adherend, wherein the heat-sensitive adhesive material exhibits such an adhesive strength to the adherend as to increase with time from immediately after applying the heat-sensitive adhesive material to the adherend.

Abstract: Provided is a heat-sensitive adhesive agent that mainly comprises a thermoplastic resin and a heat-meltable substance capable of melting upon heating, and further comprises swellable mica.

Abstract: A heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin and a thermofusible material, wherein the thermoplastic resin has a glass transition temperature of ?70° C. to ?30° C., and the thermofusible material comprises triphenylphosphine, and at least any one of tris(2,4-di-t-butylphenyl)phosphite and tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate]methane, or a heat-sensitive pressure-sensitive adhesive which contains at least a thermoplastic resin, a thermofusible material and a non-thermofusible material, wherein the thermofusible material contains triphenylphosphine.

Abstract: A thermosensitive adhesive composition including a thermosensitive plastic resin, a dispersing agent, a solid plasticizing agent and a eutectic agent represented by the following chemical structure (1): wherein X1 and X2 independently represent any one of a hydrogen atom, a halogen atom and an alkyl group, p and q independently represent an integer of from 1 to 5.

Abstract: A thermal recording material including a substrate; a thermal coloring layer which is located overlying the substrate and which includes a leuco dye and a developer for coloring the leuco dye upon application of heat; and a protective layer which is located overlying the thermal coloring layer and which includes a binder resin, a crosslinking agent and a filler, wherein the binder resin in the protective layer includes a polyvinyl alcohol having a silanol group, and the crosslinking agent includes a zirconium compound of lactic acid.

Abstract: A thermosensitive recording material comprising a thermosensitive layer provided on a substrate, and the thermosensitive layer comprises as main ingredients a leuco dye and a developer to make colored state of said leuco dye when heated, wherein the developer is an oligomer composition obtained from the reaction of a polyvalent isocyanate compound represented by following Formula (I) with an aromatic amine represented by following Formula (II); where X represents a try- or more-valent group, a represents an integer numeral of 3 or more, b and c represent respectively integer numerals in the range of 0 to 5 and they satisfy a relation of b+c=1 to 5, Z represents hydrogen atom, alkyl group, allyl group or aryl group, and the aryl group may include condensed ling structure thereof, and d represents an integer numeral in the range of 0 to 4.

Abstract: In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is ?70° C. or higher and below 0° C.