Patents by Inventor Mitsunori Hayashi

Mitsunori Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Induction heating device, radioactive waste melting process device equipped with said induction heating device, and radioactive waste melting and solidification process device
    Patent number: 11570856
    Abstract: Provided is an induction heating device with which discharging can be easily avoided even when a large electric current is used. The induction heating device comprises a high-frequency power supply provided with a connection portion for an alternating-current power supply, and a heating coil portion connected to the high-frequency power supply. In the heating coil portion, a plurality of coils include n coils surrounding a cavity portion in a plane, wherein the plurality of coils are mutually connected in series via one of a plurality of capacitors.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: January 31, 2023
    Assignee: DENKI KOGYO COMPANY, LIMITED
    Inventors: Yohei Awata, Keiichi Kubo, Mitsunori Hayashi, Tetsuo Fusato
  • INDUCTION HEATING DEVICE, RADIOACTIVE WASTE MELTING PROCESS DEVICE EQUIPPED WITH SAID INDUCTION HEATING DEVICE, AND RADIOACTIVE WASTE MELTING AND SOLIDIFICATION PROCESS DEVICE
    Publication number: 20210092804
    Abstract: Provided is an induction heating device with which discharging can be easily avoided even when a large electric current is used. The induction heating device comprises a high-frequency power supply provided with a connection portion for an alternating-current power supply, and a heating coil portion connected to the high-frequency power supply. In the heating coil portion, a plurality of coils include n coils surrounding a cavity portion in a plane, wherein the plurality of coils are mutually connected in series via one of a plurality of capacitors.
    Type: Application
    Filed: July 2, 2018
    Publication date: March 25, 2021
    Applicant: DENKI KOGYO COMPANY, LIMITED
    Inventors: Yohei AWATA, Keiichi KUBO, Mitsunori HAYASHI, Tetsuo FUSATO
  • Substrate earthing mechanism for use in charged-particle beam writing apparatus
    Patent number: 7922501
    Abstract: A substrate earthing mechanism includes a plate-like spring extending toward a substrate in a direction parallel to a surface of the substrate, and a contact portion coupled to a tip end of the plate-like spring for coming into contact with the substrate to thereby provide electrical conduction therebetween. The plate spring and the contact portion are laid out so that a contact position at which the contact portion is in contact with the substrate and a layout position of the plate-like spring are substantially the same in position as each other in a direction at right angles to the substrate surface in the state that the plate spring is out of its elastic deformation.
    Type: Grant
    Filed: March 28, 2007
    Date of Patent: April 12, 2011
    Assignee: NuFlare Technology, Inc.
    Inventors: Yoshiro Yamanaka, Hideo Saito, Mitsunori Hayashi
  • SUBSTRATE EARTHING MECHANISM FOR USE IN CHARGED-PARTICLE BEAM WRITING APPARATUS
    Publication number: 20070228525
    Abstract: A substrate earthing mechanism includes a plate-like spring extending toward a substrate in a direction parallel to a surface of the substrate, and a contact portion coupled to a tip end of the plate-like spring for coming into contact with the substrate to thereby provide electrical conduction therebetween. The plate spring and the contact portion are laid out so that a contact position at which the contact portion is in contact with the substrate and a layout position of the plate-like spring are substantially the same in position as each other in a direction at right angles to the substrate surface in the state that the plate spring is out of its elastic deformation.
    Type: Application
    Filed: March 28, 2007
    Publication date: October 4, 2007
    Applicant: NuFlare Technology, Inc.
    Inventors: Yoshiro Yamanaka, Hideo Saito, Mitsunori Hayashi