Abstract: A side-emission type light-emitting diode including: a first substrate having a concavity formed in one of side surfaces of the first substrate, the concavity including an inner surface which is configured to be a first reflecting surface; an LED-element-mounting board of thin plate shape, arranged on the lower surface of the first substrate, the board configured to close the concavity at the lower surface of the first substrate; an LED element mounted on the board and arranged in the concavity; and a light-transmitting resin filled in the concavity and configured to seal the LED element.

Abstract: A light emitting apparatus including a substrate, at least one light emitting diode chip mounted on the substrate, a light-transmitting member disposed on the substrate to form a space between the light-transmitting member and the substrate, and a resin disposed in the space to seal the light emitting diode chip, the light-transmitting member including at least one resin-injection inlet and at least one air vent, the space being filled with the resin injected into the space through the resin-injection inlet.

Abstract: A light emitting diode unit including a base (100) made of anodized aluminum and a printed board (101) attached to the base (100) and the printed board (101) including a predetermined conductive pattern (102) and an opening (101a) having an area for die-bonding at least one LED chip (113) to the base (100) through a transparent paste, an upper electrode of the at least one LED chip being wire-bonded to a conductive pattern (102) provided on the printed board (101) through a gold line (110), and a lens member (105) including at least two sealing resin-injection holes (106c) and being attached to the printed board (101) to form a space surrounding the at least one LED chip on the base, and the space being filled with the sealing resin by way of the resin-injection holes (106c) to seal the at least one LED chip.

Abstract: A multifunctional-type backlight unit, including a light guiding plate having a first incident/exit surface and a second incident/exit surface which are capable of receiving and emitting light, a light emitting device disposed to face the first incident/exit surface and configured to supply light to the first incident/exit surface, and a light receiving device disposed to face the first incident/exit surface and configured to receive light emitted from the first incident/exit surface, the light guiding plate being configured so that the light emitted from the light emitting device enters the light guiding plate, passes through the light guiding plate, and is emitted from the second incident/exit surface, and the light guiding plate being configured so that the light which enters the second incident/exit surface, passes through the light guiding plate emits from the first incident/exit surface is received by the light receiving device.

Abstract: A side-emission type light-emitting diode including: a first substrate having a concave formed in one of side surfaces of the first substrate, the concave including an inner surface which is configured to be a first reflecting surface; an LED-element-mounting board of thin plate shape, arranged on the lower surface of the first substrate, the board configured to close the concave at the lower surface of the first substrate; an LED element mounted on the board and arranged in the concave; and a light-transmitting resin filled in the concave and configured to seal the LED element.

Abstract: An LED unit including a frame (17) and a plurality of LED elements (11, 12, 13) which emit three primary colors of light and are sealed in the frame (17), readable characteristic data such as drive conditions, characteristics of each of the plurality of LED elements (11, 12, 13) being displayed on a surface of the frame.

Abstract: A light emitting apparatus including a board (2), at least one LED element (3) mounted on the board (2), a first resinous sealing member (4) to seal the LED element (3) and having a linear coefficient of expansion, and a second resinous sealing member (5) to cover the first resinous sealing member (4) and having a linear coefficient of expansion, the first resinous sealing member (4) containing a functional additive comprising at least one of a fluorescent material, an inorganic filler, and a diffusing agent, the linear coefficient of expansion of the first resinous sealing member (4) being set to be substantially identical with the linear coefficient of expansion of the second resinous sealing member (5).

Abstract: The present invention provides a surface mount electronic module that is compatible with high-temperature processing in a reflow furnace or the like. This electronic module comprises a housing, an electronic device that comprises a printed circuit board and electronic components electrically connected to the printed circuit board and mounted within the housings, and a lead-frame comprising leads each having an inner end electrically connected to the printed circuit board within the housing and an outer end protruding from the housing. The inner ends of the leads are elastically pressed against said printed circuit board to thereby form an electrical connection with the printed circuit board.

Abstract: A light emitting apparatus including a substrate, at least one light emitting diode chip mounted on the substrate, a light-transmitting member disposed on the substrate to form a space between the light-transmitting member and the substrate, and a resin disposed in the space to seal the light emitting diode chip, the light-transmitting member including at least one resin-injection inlet and at least one air vent, the space being filled with the resin injected into the space through the resin-injection inlet.

Abstract: A light emitting diode unit including a base (100) made of anodized aluminum and a printed board (101) attached to the base (100) and the printed board (101) including a predetermined conductive pattern (102) and an opening (101a) having an area for die-bonding at least one LED chip (113) to the base (100) through a transparent paste, an upper electrode of the at least one LED chip being wire-bonded to a conductive pattern (102) provided on the printed board (101) through a gold line (110), and a lens member (105) including at least two sealing resin-injection holes (106c) and being attached to the printed board (101) to form a space surrounding the at least one LED chip on the base, and the space being filled with the sealing resin by way of the resin-injection holes (106c) to seal the at least one LED chip.

Abstract: A light emitting diode, capable of accomplishing enlargement of emitted range of light and equalization of brightness of emitted light has a substrate (22), electrodes (23a, 23b), a light emitting element (24) mounted on the substrate (22) and connected electrically with the electrodes (23a, 23b), a resinous cover (26) for sealing the light emitting element (24) and electrodes (23a, 23b) and an uneven shaped light scattering part (30) provided on the surface of the cover.

Abstract: A multifunctional-type backlight unit, including a light guiding plate having a first incident/exit surface and a second incident/exit surface which are capable of receiving and emitting light, a light emitting device disposed to face the first incident/exit surface and configured to supply light to the first incident/exit surface, and a light receiving device disposed to face the first incident/exit surface and configured to receive light emitted from the first incident/exit surface, the light guiding plate being configured so that the light emitted from the light emitting device enters the light guiding plate, passes through the light guiding plate, and is emitted from the second incident/exit surface, and the light guiding plate being configured so that the light which enters the second incident/exit surface, passes through the light guiding plate emits from the first incident/exit surface is received by the light receiving device.

Abstract: A light emitting apparatus including one diode package, the diode package including a plurality of LED chips connected in parallel with an anode side common electrode and a cathode side common electrode, the plurality of LED chips being set so that a voltage is applied to each of the LED chips in a forward direction.

Abstract: The present invention provides a surface mount electronic module that is compatible with high-temperature processing in a reflow furnace or the like. This electronic module comprises a housing, an electronic device that comprises a printed circuit board and electronic components electrically connected to the printed circuit board and mounted within the housings, and a lead-frame comprising leads each having an inner end electrically connected to the printed circuit board within the housing and an outer end protruding from the housing. The inner ends of the leads are elastically pressed against said printed circuit board to thereby form an electrical connection with the printed circuit board.

Abstract: Disclosed is a light emitting diode capable of accomplishing enlargement of emitted range of light and equalization of brightness of emitted light.