Abstract: A training device for training a limb includes target parts to be touched with the limb and a force generator that generates a lifting force acting upward on the limb by electricity in a manner allowing the limb to move upward and downward.

Abstract: A training device is for training a limb. The training device includes switches that are manipulated with the limb and a load reliever that generates a counter force against the weight of the limb in a manner allowing the limb to move upward and downward.

Abstract: In the wafer position teaching method for a wafer carrying system, a teaching tool is mounted at a position of the container or the processing equipment where the semiconductor wafer is to be set. The teaching tool is sensed by a sensor provided at a wafer gripping portion of the robot. Prior to sensing the teaching tool by the sensor, external teaching tools mounted on a front external wall of the processing equipment are sensed by the sensor to roughly estimate the position of the teaching tool. Based on the estimated position, the sensor approaches and senses the teaching tool to obtain the position of the semiconductor wafer. Thus, the wafer position can be taught precisely and automatically without causing interference, even when the frontage of processing equipment is narrow.

Abstract: An object is to provide a method for teaching the position of a semiconductor wafer automatically and accurately without relying on the sight of an operator as well as a teaching jig that is used for the above method. To this end, in the invention, a teaching jig 11 is detected by a first transmission-type sensor 6 that is provided at the tips of a wafer gripping portion 5 of a robot. The teaching jig 11 is composed of a large disc portion 12 that is the same in outer diameter as a semiconductor wafer and a small disc portion 13 that is concentric with the large disc portion 12. The teaching jig 21 is detected by a second transmission-type sensor 18 that is provided on the wafer gripping portion 5. The second transmission-type sensor 18 is mounted on a sensor jig 15 so as to be detachable form the wafer gripping portion 5.

Abstract: In the wafer position teaching method for a wafer carrying system, a teaching tool is mounted at a position of the container or the processing equipment where the semiconductor wafer is to be set. The teaching tool is sensed by a sensor provided at a wafer gripping portion of the robot. Prior to sensing the teaching tool by the sensor, external teaching tools mounted on a front external wall of the processing equipment are sensed by the sensor to roughly estimate the position of the teaching tool. Based on the estimated position, the sensor approaches and senses the teaching tool to obtain the position of the semiconductor wafer. Thus, the wafer position can be taught precisely and automatically without causing interference, even when the frontage of processing equipment is narrow.

Abstract: In some preferred embodiments of the present invention, a method of performing calibration of an optical axis of a sensor installed on a hand of an arm of a robot by obtaining misalignment of the optical axis of the sensor relative to the hand or by obtaining misalignment of the hand relative to the arm is provided. A method of performing calibration by detecting a teaching tool 11 disposed at a semiconductor wafer placing position of a storage container or a carrying device by a sensor 6 installed on a hand 5 of a robot 1 to teach the position of the semiconductor wafer to the robot 1 includes a step of placing the teaching tool 11 at specified position with the robot 1, a step of predicting the position of the teaching tool 11 detecting the teaching tool 11 with the sensor 6, and a step of obtaining a difference between the position of the teaching tool 11 and the predicted value.

Abstract: In some preferred embodiments of the present invention, a method of performing calibration of an optical axis of a sensor installed on a hand of an arm of a robot by obtaining misalignment of the optical axis of the sensor relative to the hand or by obtaining misalignment of the hand relative to the arm is provided. A method of performing calibration by detecting a teaching tool 11 disposed at a semiconductor wafer placing position of a storage container or a carrying device by a sensor 6 installed on a hand 5 of a robot 1 to teach the position of the semiconductor wafer to the robot 1 includes a step of placing the teaching tool 11 at specified position with the robot 1, a step of predicting the position of the teaching tool 11 detecting the teaching tool 11 with the sensor 6, and a step of obtaining a difference between the position of the teaching tool 11 and the predicted value.

Abstract: An object is to provide a method for teaching the position of a semiconductor wafer automatically and accurately without relying on the sight of an operator as well as a teaching jig that is used for the above method. To this end, in the invention, a teaching jig 11 is detected by a first transmission-type sensor 6 that is provided at the tips of a wafer gripping portion 5 of a robot. The teaching jig 11 is composed of a large disc portion 12 that is the same in outer diameter as a semiconductor wafer and a small disc portion 13 that is concentric with the large disc portion 12. The teaching jig 21 is detected by a second transmission-type sensor 18 that is provided on the wafer gripping portion 5. The second transmission-type sensor 18 is mounted on a sensor jig 15 so as to be detachable form the wafer gripping portion 5.

Abstract: A blank layout method for planning a product layout having a good yield for plate-glass cutters cutting a plurality of rectangular product plates from a rectangular glass blank is disclosed. When a product plate is laid out on a residual blank space of a glass blank, a plurality of candidate layout plans are prepared, and the same processing is recursively repeated for residual blank spaces in each of the candidate layout plans. The final yields of the candidate layout plans when no more products can be laid out are compared to select a candidate layout plan having the highest yield.