Patents by Inventor Mitsuo Arai

Mitsuo Arai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10527669
    Abstract: An IC device 4 of the present invention includes a robot arm 6 for conveying IC devices D to a test head 2 for testing the IC devices. The test head 2 includes sockets 3 having placement surfaces 3a onto which the IC devices D are placed and for attaching the IC devices placed on the placement surfaces to the test head. The robot arm 6 includes a contact head 61 for holding the IC devices while the IC devices are conveyed and for pressing the IC devices onto the test head during testing, and a non-contact displacement meter 71 that moves in association with the movement of the contact head 61. The non-contact displacement meter 71 is mounted on the robot arm 6 so as to measure a distance by emitting a beam in a direction perpendicular to the placement surfaces 3a.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: January 7, 2020
    Assignee: HappyJapan, Inc.
    Inventors: Shouhei Matsumoto, Shinichi Hasebe, Mitsuo Koizumi, Yoshinori Arai, Masayoshi Yokoo, Keitaro Harada
  • Patent number: 5868545
    Abstract: A method for stocking a plurality of containers in a stocking device and feeding one container at a time to a robot includes the steps of separately supporting each container in a vertically moveable frame and moving the frame to align a selected container at a drawing position. The selected container is withdrawn from the frame and a lid of a pallet on the withdrawn frame is removed. The articles are then supplied to the robot.
    Type: Grant
    Filed: June 4, 1996
    Date of Patent: February 9, 1999
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shozo Kasai, Takeo Tanita, Masateru Yasuhara, Yusaku Azuma, Toshihiro Yamamoto, Norio Nikaido, Ryohei Inaba, Mitsuo Arai
  • Patent number: 5697777
    Abstract: A curing device for drying bonding material used for bonding, for example, chips to a lead frame for semiconductor devices including a workpiece heating chamber casing having heating blocks for heat-drying the bonding material and a gas supply chamber casing provided above the workpiece heating chamber casing so as to cover the heating chamber casing and to supply a high-temperature gas to the surfaces of the heating blocks, and the gas supply chamber casing is constructed so that it can be opened and closed with respect to the workpiece heating chamber casing, assuring easy access to the inside of the heating chamber casing for various works such as cleaning of the heating blocks, etc.
    Type: Grant
    Filed: September 1, 1995
    Date of Patent: December 16, 1997
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Mitsuo Arai, Toshiharu Suganuma
  • Patent number: 5653586
    Abstract: A curing device for drying bonding material used for bonding, for example, chips to a lead frame for semiconductor devices including reciprocatory motion drive pulleys provided on the drive shafts of a conveyor. A plurality of wire ropes are installed on the pulleys, and end fittings are attached to the ropes so as to be fitted to the reciprocatory motion drive pulleys. Thus, the positional relationship between the wire ropes and the reciprocatory motion drive pulleys are not changed, and the workpieces are correctly carried by the wire ropes onto heating blocks of the curing device.
    Type: Grant
    Filed: November 21, 1995
    Date of Patent: August 5, 1997
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Mitsuo Arai, Toshiharu Suganuma
  • Patent number: 5632617
    Abstract: A curing apparatus for drying bonding material that is used for bonding, for example, chips to a lead frame for semiconductor devices including a plurality of heating blocks which are spacedly installed in a conveying direction of workpieces and each of the heating blocks is provided with heat-insulating plates on its lower surface, both side surfaces and both end surfaces so as to facilitate temperature control of each of the heating blocks.
    Type: Grant
    Filed: November 21, 1995
    Date of Patent: May 27, 1997
    Assignee: Kabushiki Kaisha Shinkawa
    Inventor: Mitsuo Arai
  • Patent number: 5503516
    Abstract: A method for feeding articles to a robot comprises the steps of temporarily storing a plurality of containers in a temporary storing device including a rest on which the plurality of containers are stacked and a separator for simultaneously separating the stacked containers from each other, stocking a plurality of containers supplied from the temporary storing device in a stocker, and feeding the stocked containers to the robot one-by-one.
    Type: Grant
    Filed: July 18, 1994
    Date of Patent: April 2, 1996
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shozo Kasai, Takeo Tanita, Masateru Yasuhara, Yusaku Azuma, Toshihiro Yamamoto, Norio Nikaido, Ryohei Inaba, Mitsuo Arai
  • Patent number: 5380138
    Abstract: An article feeding apparatus which feeds articles from a feed source to a section to be subjected to feeding includes a stocker for stocking a plurality of pallets retaining a plurality of articles in units of types of articles, with the stocker being capable of moving one pallet to a predetermined position, and a take-out unit for taking the pallet moved to the predetermined position outside the stocker in order to transfer articles to the section to be subjected to feeding. In addition, a buffer receives replacement of the pallets retaining the articles from external equipment and temporarily stores the plurality of pallets, and a replacing unit replaces the pallets in the stocker with the pallets in the buffer in accordance with a decrease in number of articles in the pallet in the stocker to a predetermined value as the articles are fed to the feeding section.
    Type: Grant
    Filed: October 25, 1993
    Date of Patent: January 10, 1995
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shozo Kasai, Takeo Tanita, Masateru Yasuhara, Yusaku Azuma, Toshihiro Yamamoto, Norio Nikaido, Ryohei Inaba, Mitsuo Arai
  • Patent number: 5267853
    Abstract: A curing device, which hardens on heater blocks a paste used for die-bonding the chips to lead frames, including frame supporting wires, wire slacking preventing collars and frame conveying wires. The frame supporting wires are installed above the heater blocks and parallel to the feeding direction of the lead frames, and the wire slacking preventing collars are mounted on the frame supporting wires so that a constant space is retained between the frame supporting wires and the heater blocks. The lead frames are fed and placed on the frame supporting wires when the frame conveying wires, which are movable vertically, is moved down, so that the pastes is heated by the heater blocks.
    Type: Grant
    Filed: October 13, 1992
    Date of Patent: December 7, 1993
    Assignee: Kabushiki Kaisha Shinkawa
    Inventor: Mitsuo Arai
  • Patent number: 5232331
    Abstract: A method for stocking a plurality of containers in a stocking device and feeding one container at a time to a robot includes the steps of separately supporting each container in a vertically moveable frame and moving the frame to align a selected container at a drawing position. The selected container is withdrawn from the frame and a lid of a pallet on the withdrawn frame is removed. The articles are then supplied to the robot.
    Type: Grant
    Filed: March 13, 1991
    Date of Patent: August 3, 1993
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shozo Kasai, Takeo Tanita, Masateru Yasuhara, Yusaku Azuma, Toshihiro Yamamoto, Norio Nikaido, Ryohei Inaba, Mitsuo Arai
  • Patent number: 5217725
    Abstract: An injection molding apparatus uses motors to effect measuring and kneading of a material to be molded and injection driving. The amount of movement of a rotary shaft or rectilinearly moving means connected to a screw is detected by a sensor, and the driving of the volume measuring motor and the injection motor is effected by the output of the sensor.
    Type: Grant
    Filed: December 10, 1991
    Date of Patent: June 8, 1993
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ryohei Inaba, Masaaki Kumamura, Shojiro Danmoto, Mitsuo Arai, Yozo Tobo, Hirofumi Sugawara, Tadanobu Miyazaki
  • Patent number: 5154604
    Abstract: A curing apparatus used in manufacturing semiconductor devices including high-temperature gas chamber and heating chamber communicated with slits formed in a partition plate installed between the two chambers. Gas diffusion plates are installed in the gas chamber at right angles against the flow of gas so that the diffused and uniform high-temperature gas passes through slits and blown onto workpieces placed directly beneath the slits.
    Type: Grant
    Filed: March 5, 1992
    Date of Patent: October 13, 1992
    Assignee: Kabushiki Kaisha Shinkawa
    Inventor: Mitsuo Arai
  • Patent number: 5143736
    Abstract: An injection molding apparatus includes a screw housed in a heating cylinder, a rotator for rotating the screw, a linear mover for moving the screw linearly, a motor for driving the rotator, a driver for driving the linear mover, and a base member for supporting the screw, the rotator, the linear mover, the motor and the driver. The screw, the linear mover and the rotator are supported by the base member along a vertical line against the ground. In the injection molding apparatus is a nozzle touch mechanism which includes a support member mounted on the base member, and a member for mounting a die member mounted on the support member to support the die member. The die member is mounted by the member for mounting the die member so that a molding material entrance port of the die member engages an injection port of the heating cylinder.
    Type: Grant
    Filed: June 1, 1990
    Date of Patent: September 1, 1992
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masaaki Kumamura, Ryohei Inaba, Shojiro Danmoto, Mitsuo Arai
  • Patent number: 5110522
    Abstract: An injection molding method uses motors to effect measuring and kneading of a material to be molded and injection driving. The amount of movement of a rotary shaft or rectilinearly moving means connected to a screw is detected by a sensor, and the driving of the volume measuring motor and the injection motor is effected by the output of the sensor.
    Type: Grant
    Filed: April 26, 1990
    Date of Patent: May 5, 1992
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ryohei Inaba, Masaaki Kumamura, Shojiro Danmoto, Mitsuo Arai, Yozo Tobo, Hirofumi Sugawara, Tadanobu Miyazaki
  • Patent number: 5092460
    Abstract: A fastening apparatus uses fastening members such as screws held on a tape and supplied to the fastening position of a bit. The fastening members are separated from the tape by the bit after the posture of the tape is held in a predetermined state, whereby the fastening apparatus can keep a posture for the fastening operation even after the fastening members are separated from the tape.
    Type: Grant
    Filed: February 23, 1989
    Date of Patent: March 3, 1992
    Assignee: Canon Kabushiki Kaisha
    Inventors: Osamu Satoh, Sachio Umetu, Mitsuo Arai
  • Patent number: 5092753
    Abstract: An injection screw disposed in a heating cylinder is connected to a rotary driving force receiving mechanism, a linear driving force receiving mechanism, and a back pressurizing mechanism. The rotary driving force of an electric motor is transmitted to the rotary driving force receiving mechanism and the linear driving force receiving mechanism through clutches, which are controlled according to sensors for detecting the position of the screw or the linear driving force receiving mechanism.
    Type: Grant
    Filed: April 26, 1990
    Date of Patent: March 3, 1992
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masaaki Kumamura, Ryohei Inaba, Shojiro Danmoto, Mitsuo Arai, Yozo Tobo, Tadanobu Miyazaki