Patents by Inventor Mitsuo Eziri

Mitsuo Eziri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6753300
    Abstract: A lubricant sheet for making a hole used for a printed circuit board, comprising an organic substance layer having a thickness of 0.02 to 3.0 mm and formed of a mixture (a) or a mixture (b) and a metal foil having a thickness of 0.05 to 0.5 mm, said organic substance layer being formed on one surface of said metal foil, said mixture (a) being a mixture containing polyether ester (I), a solid water-soluble lubricant (II) and polyethylene glycol (III) having a number average molecular weight of 200 to 600, and said mixture (b) being a mixture containing said polyether ester (I), said solid water-soluble lubricant (II) and a liquid water-soluble lubricant (IV), and a method of making a hole which uses the lubricant sheet.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: June 22, 2004
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Mitsuo Eziri, Shinya Komatsu, Masaru Taguchi, Norio Nagai
  • Publication number: 20020051684
    Abstract: A lubricant sheet for making a hole used for a printed circuit board, comprising an organic substance layer having a thickness of 0.02 to 3.0 mm and formed of a mixture (a) or a mixture (b) and a metal foil having a thickness of 0.05 to 0.
    Type: Application
    Filed: September 4, 2001
    Publication date: May 2, 2002
    Inventors: Mitsuo Eziri, Shinya Komatsu, Masaru Taguchi, Norio Nagai
  • Patent number: 4904760
    Abstract: A thermosetting resin composition polyfunctional cyanate ester resin composition comprising:(I) a cyanate ester compound selected from the group consisting of a polyfunctional cyanate ester having at least two cyanate esters in its molecule, a prepolymer of such a cyanate ester and mixtures thereof; and(II) at least one non-branched aromatic compound in an amount of 5-40% by weight of the total resin composition, said aromatic compound having a number-average molecular weight of 178-800, an average number of aromatic nuclei of 2-6, and a boiling point of more than 300.degree. C., and in which the portion having aromatic nuclei of 2-6 constitutes more than 50% is disclosed.
    Type: Grant
    Filed: April 26, 1988
    Date of Patent: February 27, 1990
    Assignee: Mitsubishi Gas Chemical Co., Inc.
    Inventors: Morio Gaku, Hidenori Kimbara, Mitsuo Eziri, Masakazu Motegi, Yousuke Funamoto