Abstract: To improve the display quality of a vertical alignment liquid crystal display apparatus. The apparatus comprises two substrates, a first electrode extending in a first direction, a second electrode extending in a second direction intersecting the first direction, a crystal layer provided between the substrates, a pixel is configured where the two electrodes intersect, an electrode edge of the second electrode is of a shape that includes line segments obliquely crossed relative to the second direction and bend back, the pixel edges of the pixel are demarcated, including the line segments that are obliquely crossed, and the liquid crystal layer is disposed so that the angle of the alignment direction of the crystal molecules at the center and the direction perpendicular to the second direction is greater than 0°, and the alignment direction of the crystal molecules and the direction of obliquely crossed line segments don't become perpendicular.

Abstract: To improve the display quality of a vertical alignment liquid crystal display apparatus. The apparatus comprises two substrates, a first electrode extending in a first direction, a second electrode extending in a second direction intersecting the first direction, a crystal layer provided between the substrates, a pixel is configured where the two electrodes intersect, an electrode edge of the second electrode is of a shape that includes line segments obliquely crossed relative to the second direction and bend back, the pixel edges of the pixel are demarcated, including the line segments that are obliquely crossed, and the liquid crystal layer is disposed so that the angle of the alignment direction of the crystal molecules at the center and the direction perpendicular to the second direction is greater than 0°, and the alignment direction of the crystal molecules and the direction of obliquely crossed line segments don't become perpendicular.

Abstract: This invention provides a copper foil for a printed wiring board, which comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, said surface to be brought into contact with a substrate for a printed wiring board, and a chromate layer which is formed on a surface of the alloy layer (A). The copper foil for a printed wiring board has the following features: even if a printed wiring board is produced using a long-term stored copper foil, the interface between the copper foil and the substrate is only slightly corroded with chemicals; even if the copper foil contacts a varnish containing an organic acid, e.g., a varnish for an acrylic resin, in the formation of a copper-clad laminate, the bond strength is sufficient.

Abstract: A connection portion having a plurality of pads is provided on a test board. On the connection portion, a plurality of anisotropic conductive sheets, the sheet for the power source and the sheet for grounding are provided in an alternate manner. The connection portion and the semiconductor device are connected via the anisotropic conductive sheet, the sheet for the power source and the sheet for grounding. When the pin arrangement of the semiconductor device is changed, the sheet for the power source and the sheet for the grounding are changed.

Abstract: A connection portion having a plurality of pads is provided on a test board. On the connection portion, a plurality of anisotropic conductive sheets, the sheet for the power source and the sheet for grounding are provided in an alternate manner. The connection portion and the semiconductor device are connected via the anisotropic conductive sheet, the sheet for the power source and the sheet for grounding. When the pin arrangement of the semiconductor device is changed, the sheet for the power source and the sheet for the grounding are changed.

Abstract: A connection portion having a plurality of pads is provided on a test board. On the connection portion, a plurality of anisotropic conductive sheets, the sheet for the power source and the sheet for grounding are provided in an alternate manner. The connection portion and the semiconductor device are connected via the anisotropic conductive sheet, the sheet for the power source and the sheet for grounding. When the pin arrangement of the semiconductor device is changed, the sheet for the power source and the sheet for the grounding are changed.

Abstract: This invention provides a copper foil for a printed wiring board, which comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, said surface to be brought into contact with a substrate for a printed wiring board, and a chromate layer which is formed on a surface of the alloy layer (A,. The copper foil for a printed wiring board has the following features: even if a printed wiring board is produced using a long-term stored copper foil, the interface between the copper foil and the substrate is only slightly corroded with chemicals; even if the copper foil contacts a varnish containing an organic acid, e.g., a varnish for an acrylic resin, in the formation of a copper-clad laminate, the bond strength is sufficient. Even if a printed circuit board made by using the copper foil is placed in a high temperature environment, e.g.

Abstract: This invention provides a copper foil for a printed wiring board, which comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, said surface to be brought into contact with a substrate for a printed wiring board, and a chromate layer which is formed on a surface of the alloy layer (A,. The copper foil for a printed wiring board has the following features: even if a printed wiring board is produced using a long-term stored copper foil, the interface between the copper foil and the substrate is only slightly corroded with chemicals; even if the copper foil contacts a varnish containing an organic acid, e.g., a varnish for an acrylic resin, in the formation of a copper-clad laminate, the bond strength is sufficient. Even if a printed circuit board made by using the copper foil is placed in a high temperature environment, e.g.

Abstract: A connection portion having a plurality of pads is provided on a test board. On the connection portion, a plurality of anisotropic conductive sheets, the sheet for the power source and the sheet for grounding are provided in an alternate manner. The connection portion and the semiconductor device are connected via the anisotropic conductive sheet, the sheet for the power source and the sheet for grounding. When the pin arrangement of the semiconductor device is changed, the sheet for the power source and the sheet for the grounding are changed.

Abstract: A 1,2,3,4-tetrahydroquinoxalinedione derivative represented by the following formula (I) or salt thereof, an NMDA-glycine receptor and/or AMPA receptor antagonist or kainic acid neurotoxicity inhibitor containing the derivative or salt. In addition, a pharmaceutical composition comprising said compound and a pharmaceutically acceptable carrier: ##STR1## wherein the substituents are as described in the specification.

Abstract: A method of washing a glass surface, such as, for example, a windshield or other vehicle window includes adjusting emission of a washing liquid relative to a wiper stroke cycle. The washing liquid is emitted from a plurality of positions arranged on a swinging wiper in a direction towards a forward-wiping side thereof, along the longitudinal direction of a blade rubber of the wiper. During a wiper stroke cycle, the washing liquid is emitted at least over a range of wiper travel extending from a forward swing starting point to a predetermined intermediate point located before a turning point of the stroke cycle where the forward swing ends and a backward return swing is commenced. In a further embodiment, a rate at which the washing liquid is emitted at the various emission points along the length of the blade rubber increases with an increase in the distance of a particular emission point as measured from the center of swinging rotation of the wiper.

Abstract: In order to provide a wiper-cooperative washing apparatus which adjusts the jetting rate and jetting timing of a washing liquid, thereby preventing waste of the washing liquid, an attachment nozzle pipe 7 for washing a glass surface W of a vehicle is removably attached to a wiper blade 1c, the attachment nozzle pipe 7 has nozzle openings 7d2, 7e2 and 7j from which the washing liquid is jetted toward the forward-wiping side of a blade rubber 1d, when a washer switch 6 is turned on, an arm 1a supporting the wiper blade 1c is swung forward and backward a predetermined number of times, during every forward swing of the arm 1a, a washer pump 2 is kept operating until 55% to 75% of one forward wiping stroke is completed, thereby adjusting the jetting rate of the washing liquid.

Abstract: A morpholine derivative represented by formula (I) or a pharmaceutically acceptable salt thereof: ##STR1## wherein R.sup.1 and R.sup.3, which may be the same or different, each represent a hydrogen atom or a lower alkyl group; R.sup.2 represents a halogen atom; and the dotted line indicates an optional double bond. These compounds exhibit a selective 5-HT reuptake inhibitory activity and a selective 5-HT.sub.2 receptor antagonistic activity and useful as a therapeutic agent for depression, anxiety, etc. with reduced side effects.

Abstract: (-)-(S)-2,8-Dimethyl-3-methylene-1-oxa-8-azaspiro[4.5]decane L-tartrate having the following structural formula: ##STR1## The compound exhibits a selective affinity for the muscarinic acetylcholine receptor and has a storage stability superior to that of other salts.

Abstract: An IC device wherein a source of IC device type-distinguishing data is provided on an IC chip, and a section for drawing out the IC device type-distinguishing data is connected to said source of IC device type-distinguishing data formed on said IC chip.