Patents by Inventor Mitsuo Honma

Mitsuo Honma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090266531
    Abstract: The invention seeks to provide a heat sink capable of sufficiently lessening the mounting dimensions of coil-shaped heat exchanging fin to offer a wide versatility and a suitable method for manufacturing the heat sink. The heat sink according to the invention comprises a heat exchanging substrate 1 made by forming material having high thermal conductivity into a cylindrical shape, and a heat exchanging fin 2 having coil elements, which is formed by winding a metal wire having high thermal conductivity into a coil and flattening the coil-shaped metal wire in whole with bringing the coil elements in contact with the adjacent ones in their mutually displaced state. The coil fin is secured on the outer surface of the heat exchanging substrate in their wound state.
    Type: Application
    Filed: March 30, 2006
    Publication date: October 29, 2009
    Inventor: Mitsuo Honma
  • Publication number: 20090195990
    Abstract: The present invention seeks to provide a novel heat sink capable of being effectively produced at a low cost and having excellent heat dissipation performance. The heat sink comprises fins 11 of a metal wire coil formed of coil elements 11a and 11b made by winding a flat metal wire. The fins 11 are disposed on a heat conductive base plate 10 with flat surfaces 111 of the fins arranged perpendicular to the base plate 10.
    Type: Application
    Filed: January 7, 2005
    Publication date: August 6, 2009
    Inventor: Mitsuo Honma
  • Publication number: 20070223195
    Abstract: This invention seeks to provide a method for manufacturing a heat sink capable of enhancing the fixing strength and heat conductivity between a radiating substrate and radiating fins. The heat sink 100 comprises radiating fins 2 formed by winding a metal wire having high thermal conductivity in a coil shape, which is secured on a flat radiating substrate 1 formed of a flat plate having high thermal conductivity. The radiating fins 2 are formed by flattening the radiating fins so as to bring flattened loops of the coiled radiating fins of metal wire into close contact with one another and securing the flattened side edge portions of the radiating fins 2 onto the radiating substrate 1 by soldering.
    Type: Application
    Filed: March 31, 2005
    Publication date: September 27, 2007
    Inventor: Mitsuo Honma