Patents by Inventor Mitsuo Katoo

Mitsuo Katoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealed-type liquid cooling device with expandable bellow for semiconductor chips
    Patent number: 4740866
    Abstract: A semiconductor module cooling structure comprises a housing having a passage through which a cooling fluid flows; a cooling block to which the cooling fluid is supplied from the housing and which has an electrical insulating layer at the bottom portion and is combined with a semiconductor chip through the electrical insulating layer; and a bellows which is connected between the housing and the cooling block. The cooling fluid is supplied to the cooling block through the bellows. The bellows is formed in a manner such that a plurality of substantially plane ring-like metal plates are laminated, pressed, diffused, joined, and thereafter stretched and molded.
    Type: Grant
    Filed: March 25, 1986
    Date of Patent: April 26, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Ryoichi Kajiwara, Takao Funamoto, Mitsuo Katoo, Tomohiko Shida, Takeshi Matsuzaka, Hiroshi Wachi, Kazuya Takahashi