Patents by Inventor Mitsuo Katou

Mitsuo Katou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6686658
    Abstract: In accordance with a press contact type semiconductor device, a metallic body having macroscopic vacancies inside is arranged between a main electrode of the semiconductor device and a main electrode plate, or between an intermediate electrode plate arranged on a respective main plane of the semiconductor element and a main electrode plate.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: February 3, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Hironori Kodama, Mitsuo Katou, Mamoru Sawahata
  • Publication number: 20030001258
    Abstract: In accordance with a press contact type semiconductor device, a metallic body having macroscopic vacancies in its portion is arranged between a main electrode of the semiconductor device and a main electrode plate, or between an intermediate electrode plate arranged on respective of main plane of the semiconductor element and a main electrode plate.
    Type: Application
    Filed: August 30, 2002
    Publication date: January 2, 2003
    Inventors: Hironori Kodama, Mitsuo Katou, Mamoru Sawahata
  • Patent number: 6495924
    Abstract: In accordance with a press contact type semiconductor device, a metallic body having macroscopic vacancies inside is arranged between a main electrode of the semiconductor device and a main electrode plate, or between an intermediate electrode plate arranged on a respective main plane of the semiconductor element and a main electrode plate.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: December 17, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Hironori Kodama, Mitsuo Katou, Mamoru Sawahata
  • Publication number: 20020005578
    Abstract: In accordance with a press contact type semiconductor device, a metallic body having macroscopic vacancies in its portion is arranged between a main electrode of the semiconductor device and a main electrode plate, or between an intermediate electrode plate arranged on respective of main plane of the semiconductor element and a main electrode plate.
    Type: Application
    Filed: January 22, 1999
    Publication date: January 17, 2002
    Inventors: HIRONORI KODAMA, MITSUO KATOU, MAMORU SAWAHATA