Abstract: An air cooling equipment for use in electronic systems having a plurality of wiring boards with a plurality of heat-generating electronic components mounted thereon is disclosed. The air cooling equipment uses two blowers positioned on top and bottom of the unit and introduces cooling air in two directions into the housing. The blowers may be positioned at sides of the housing and air is directed around and through the zone where the wiring boards are disposed.

Abstract: For uniform distribution of power to integrated circuit chips arranged on a substrate, a multichip package comprises a plurality of power feed contact pads on an outer portion of the substrate for coupling to an external power source and a pair of power feed pins on an inner portion of the substrate for coupling to the external power source. A conductive means is provided on the substrate for distributing power from the power feed contact pads and the power feed pins to the integrated circuit chips.

Abstract: A mounting structure for electronic circuit modules includes electronic circuit modules each having a back panel, heat-generating electronic components each having a heat sink for heat radiation and mounted on one surface of the back panel, and first connectors mounted on the other surface of the back panel. A frame has first holes and a hollow inside structure for mounting the electronic circuit modules. Cable assemblies having second connectors at their ends pass through one of the first holes to connect with the first connectors within the frame. The electronic circuit modules are mounted onto the frame. The modules may be mounted onto the frame by second holes penetrating the back panel and guide pins formed on the frame in one-to-one correspondence with the second holes. A heat radiating structure may include openings opposed to the heat sinks in one-to-one correspondence, and fans for sucking air from the vicinity of the heat sinks into the inside of the heat radiating structure through the openings.