Abstract: To obtain a neutron detector capable of measuring high dose neutrons with high neutron/gamma-ray discrimination ability and high efficiency. A scintillator 10 has a layered structure in which a phosphor layer 11 and a light transmission layer 12 are alternatelylaminatedin z direction. The phosphor layer 11 is made of a phosphor material emitting fluorescent light by absorbing neutrons, the material being, for example, a scintillator material used in neutron detectors having alreadybeen known. The light transmission layer 12 is made of a material highly transmitting fluorescent light emitted by the phosphor materialand only slightlyabsorbingneutrons. In the scintillator 10, when neutrons and gamma-ray photons enter it, luminescence intensity (pulse height) due to neutrons is significantly different from that due to gamma-ray photons. It makes it easy to discriminate between outputs due to the two kinds of radiations.

Abstract: An IC device 4 of the present invention includes a robot arm 6 for conveying IC devices D to a test head 2 for testing the IC devices. The test head 2 includes sockets 3 having placement surfaces 3a onto which the IC devices D are placed and for attaching the IC devices placed on the placement surfaces to the test head. The robot arm 6 includes a contact head 61 for holding the IC devices while the IC devices are conveyed and for pressing the IC devices onto the test head during testing, and a non-contact displacement meter 71 that moves in association with the movement of the contact head 61. The non-contact displacement meter 71 is mounted on the robot arm 6 so as to measure a distance by emitting a beam in a direction perpendicular to the placement surfaces 3a.

Abstract: An IC handler (4) of the present invention transfers an IC device (D) to a test head (2). The test head (2) is provided with a socket (3), which has a placing surface (3a) having the IC device (D) placed thereon, and which attaches the IC device (D) placed on the placing surface (3a) to the test head (2). The IC handler (4) is provided with a non-contact displacement meter (71) that is disposed by being spaced apart from the socket (3) in the direction perpendicular to the placing surface (3a). The non-contact displacement meter (71) measures a distance from the non-contact displacement meter (71) to the IC device (D) placed on the placing surface (3a) by emitting a laser beam toward the placing surface (3a) of the socket (3).

Abstract: An IC device 4 of the present invention includes a robot arm 6 for conveying IC devices D to a test head 2 for testing the IC devices. The test head 2 includes sockets 3 having placement surfaces 3a onto which the IC devices D are placed and for attaching the IC devices placed on the placement surfaces to the test head. The robot arm 6 includes a contact head 61 for holding the IC devices while the IC devices are conveyed and for pressing the IC devices onto the test head during testing, and a non-contact displacement meter 71 that moves in association with the movement of the contact head 61. The non-contact displacement meter 71 is mounted on the robot arm 6 so as to measure a distance by emitting a beam in a direction perpendicular to the placement surfaces 3a.

Abstract: An IC handler (4) of the present invention transfers an IC device (D) to a test head (2). The test head (2) is provided with a socket (3), which has a placing surface (3a) having the IC device (D) placed thereon, and which attaches the IC device (D) placed on the placing surface (3a) to the test head (2). The IC handler (4) is provided with a non-contact displacement meter (71) that is disposed by being spaced apart from the socket (3) in the direction perpendicular to the placing surface (3a). The non-contact displacement meter (71) measures a distance from the non-contact displacement meter (71) to the IC device (D) placed on the placing surface (3a) by emitting a laser beam toward the placing surface (3a) of the socket (3).

Abstract: An IC device conveying apparatus includes an IC device conveying shuttle, at least a pair of slide guide plates which are placed on the IC device conveying shuttle, and each of which has a plurality of slide guide holes, each of the plurality of slide guide holes being made in a direction inclined to a side of a corresponding slide guide plate, and a plurality of positioning members which guide the placed pair of slide guide plates such that the pair of slide guide plates slides in directions in which sides of the respective slide guide plates are separated from and come into contact with each other, the positioning members being secured to the IC device conveying shuttle and engaged with the plurality of slide guide holes, wherein each of the pair of slide guide plates comprises at least one IC device holding side on a side thereof facing a side of another slide guide plate, and an IC device is placed in an IC device holding space which is formed between at least a pair of the IC device holding sides of the

Abstract: An IC device conveying apparatus includes an IC device conveying shuttle, at least a pair of slide guide plates which are placed on the IC device conveying shuttle, and each of which has a plurality of slide guide holes, each of the plurality of slide guide holes being made in a direction inclined to a side of a corresponding slide guide plate, and a plurality of positioning members which guide the placed pair of slide guide plates such that the pair of slide guide plates slides in directions in which sides of the respective slide guide plates are separated from and come into contact with each other, the positioning members being secured to the IC device conveying shuttle and engaged with the plurality of slide guide holes, wherein each of the pair of slide guide plates comprises at least one IC device holding side on a side thereof facing a side of another slide guide plate, and an IC device is placed in an IC device holding space which is formed between at least a pair of the IC device holding sides of the

Abstract: A temperature control apparatus including a temperature control head kept in contact with an electronic device as a testing object thermally, an electric heater attached to the temperature control head, a refrigerant passage formed within the temperature control head so as to run through inside thereof, a compressor which compresses refrigerant coming out of the temperature control head, a temperature sensor which detects a temperature of refrigerant on an outlet side of the compressor, a condenser which condenses refrigerant coming out of the compressor, a returning portion which returns refrigerant condensed by the condenser to the temperature control head, and a control portion which bypasses the condensed refrigerant to the intake side of the compressor by a predetermined quantity corresponding to an output of the temperature sensor.

Abstract: A temperature control apparatus includes a socket holder which is provided on a tester head and holds a socket to mount an IC chip. A socket cover has an opening to pass the end of a handler pusher for holding the IC chip on testing. The socket cover forms a closed space around the IC chip in a state that the IC chip is pressed to the socket by the pusher. A gas supplying unit externally supplies the closed space with gas of a predetermined temperature.

Abstract: A temperature control apparatus including a temperature control head kept in contact with an electronic device as a testing object thermally, an electric heater attached to the temperature control head, a refrigerant passage formed within the temperature control head so as to run through inside thereof, a compressor which compresses refrigerant coming out of the temperature control head, a temperature sensor which detects a temperature of refrigerant on an outlet side of the compressor, a condenser which condenses refrigerant coming out of the compressor, a returning portion which returns refrigerant condensed by the condenser to the temperature control head, and a control portion which bypasses the condensed refrigerant to the intake side of the compressor by a predetermined quantity corresponding to an output of the temperature sensor.

Abstract: A temperature control apparatus including a temperature control head kept in contact with an electronic device as a testing object thermally, an electric heater attached to the temperature control head, a refrigerant passage formed within the temperature control head so as to run through inside thereof, a compressor which compresses refrigerant coming out of the temperature control head, a temperature sensor which detects a temperature of refrigerant on an outlet side of the compressor, a condenser which condenses refrigerant coming out of the compressor, a returning portion which returns refrigerant condensed by the condenser to the temperature control head, and a control portion which bypasses the condensed refrigerant to the intake side of the compressor by a predetermined quantity corresponding to an output of the temperature sensor.

Abstract: A temperature control apparatus including a temperature control head kept in contact with an electronic device as a testing object thermally, an electric heater attached to the temperature control head, a refrigerant passage formed within the temperature control head so as to run through inside thereof, a compressor which compresses refrigerant coming out of the temperature control head, a temperature sensor which detects a temperature of refrigerant on an outlet side of the compressor, a condenser which condenses refrigerant coming out of the compressor, a returning portion which returns refrigerant condensed by the condenser to the temperature control head, and a control portion which bypasses the condensed refrigerant to the intake side of the compressor by a predetermined quantity corresponding to an output of the temperature sensor.

Abstract: A pusher of an IC chip handler has a pusher frame which is attached to a pusher main body to be driven by the IC chip handler and a plurality of pusher heads attached to the pusher frame. Each of the pusher heads comprises a holder which is held by the pusher frame. At least one spring post is freely protruded outward from the inside of the holder, and a compression spring has one end arranged under pressure to a spring receiving portion of the spring post. A spring push plate arranges the compression spring to the spring receiving portion of the spring post under pressure, and an adjusting member adjusts a compression force of the compression spring. A device holding unit is attached to an end of the spring post protruded outside of the holder.

Abstract: A pusher of an IC chip handler has a pusher frame which is attached to a pusher main body to be driven by the IC chip handler and a plurality of pusher heads attached to the pusher frame. Each of the pusher heads comprises a holder which is held by the pusher frame. At least one spring post is freely protruded outward from the inside of the holder, and a compression spring has one end arranged under pressure to a spring receiving portion of the spring post. A spring push plate arranges the compression spring to the spring receiving portion of the spring post under pressure, and an adjusting member adjusts a compression force of the compression spring. A device holding unit is attached to an end of the spring post protruded outside of the holder.

Abstract: A temperature control apparatus comprising a socket holder which is provided on a tester head and holds a socket to mount an IC chip, a socket cover which has an opening to pass the end of a handler pusher for holding the IC chip on testing, and forms a closed space around the IC chip in a state that the IC chip is pressed to the socket by the pusher, and a gas supplying unit which externally supplies the closed space with gas of a predetermined temperature.

Abstract: Radioactive stents used in angioplasty on sclerotic coronary arteries without the risk of restenosis can be produced by ion injecting 133Xe into the surfaces of stents as a nuclide that has a shorter half-life and emits a smaller maximum energy of &bgr;-rays than 32p Uniform ion injection is accomplished using an apparatus capable of uniform irradiation of the stents with 133Xe ion beams. The source of 133Xe is a nuclear fission product generated from 235U in the fuel rods in nuclear reactor.