Patents by Inventor Mitsuo Konno
Mitsuo Konno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6379126Abstract: The invention enhances a joined portion between a bearing holder and a stator core in a blower. In the blower including a stator core attached to the outer circumference of a bearing holder, a setscrew for impeding the stator core from being pulled out is interposed between the bearing holder and the stator core. The setscrew is used for fixing in place of adhesives which is used in conventional art, ensuring the joining between the bearing holder and the stator core as well as facilitating the disassembling work.Type: GrantFiled: May 16, 2000Date of Patent: April 30, 2002Assignee: Minebea Co., Ltd.Inventor: Mitsuo Konno
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Publication number: 20020044431Abstract: A reliable microchip controller board and a manufacturing method thereof suitable for mass production are provided. A board wherein a programmable microchip controller is mounted includes; terminals for writing a program into the microchip controller and a circuit pattern connecting an operating terminal to shared terminals which are disconnected. A non-programmed microchip controller is mounted on the board in a state where patterns are disconnected and then programmed. The disconnected portion is connected thereafter.Type: ApplicationFiled: July 25, 2001Publication date: April 18, 2002Applicant: MINEBEA CO., LTD.Inventor: Mitsuo Konno
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Patent number: 6366770Abstract: A high-frequency semiconductor device includes a microwave monolithic integrated circuit having first and second passive element sections each having at least one passive element as well as an FET. The FET has a gate connected to the first passive element section and a drain connected to the second passive element section. A bed configured as a plate of a conductive member is provided for mounting thereon the microwave monolithic integrated circuit. The bed has at least one opening or hole formed therethrough. The hole of the bed is provided at a specified position of the bed so as to underlie either one the first or second passive element section. With such an arrangement, it becomes possible to obtain enhanced performance.Type: GrantFiled: March 16, 1999Date of Patent: April 2, 2002Assignee: Kabushiki Kaisha ToshibaInventors: Toshiki Seshita, Mitsuo Konno
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Patent number: 6271611Abstract: The motor housing 27 and the bearing box 19 are formed separately, the motor housing 27 is provided with the central projection 2 for coupling the bearing box 19 with the motor housing 27 and the removal preventing stepped portions 20, 28 are provided on the bearing box 19 and the central projection 2. Thereby, without using any glue, the bearing box 19 is fixed and the assembly workability and productivity are increased. Further, by forming the bearing box 19 with the resin having a heat resistance, the use amount of the high priced resin of the separated bearing box 19 is lessened to make the cost thereof lowered and the heat deformation and deterioration small for maintaining the function of the axial flow fan motor and prolonging the life thereof.Type: GrantFiled: April 16, 1999Date of Patent: August 7, 2001Assignee: Minebea Co., Ltd.Inventors: Noboru Taniguchi, Mitsuo Konno
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Patent number: 6263193Abstract: A microwave transmitter/receiver module has a package that includes a high-frequency circuit board and an electromagnetically narrowed space. A semiconductor chip is mounted on the circuit board and is contained in the electromagnetically narrowed space. The electromagnetically narrowed space has a cutoff frequency that is higher than a carrier frequency for microwave communication. A receiver antenna pattern is formed on the top surface of the package and is electromagnetically connected to the semiconductor chip through a first slot. A transmitter antenna pattern is formed on the top surface of the package at a different position from the receiver antenna pattern and is electromagnetically connected to the semiconductor chip through a second slot. Since the antenna patterns are on the top surface of the package, the proper performance thereof is secured and the package is compact.Type: GrantFiled: March 20, 1998Date of Patent: July 17, 2001Assignee: Kabushiki Kaisha ToshibaInventors: Yuji Iseki, Keiichi Yamaguchi, Mitsuo Konno
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Patent number: 6130483Abstract: A semiconductor module has an MMIC chip flip-chip-mounted on a board. The MMIC chip has a ground line and bumps. The board has through holes and a ground electrode. These ground line, bumps, through holes, and ground electrode form a conductor continuum that defines a quasi-cavity. The module is designed so that the resonance frequency (fr) of the quasi-cavity is higher than the maximum operation frequency (fumax) of the MMIC chip. This prevents signal disturbance due to agreement between the resonance frequency (fr) and an operation frequency (fu) of the MMIC chip. If the MMIC chip is provided with bias circuits having MIM capacitors, the MIM capacitors are formed within the quasi-cavity. The quasi-cavity blocks magnetic fields generated by the MIM capacitors from leaking outside and badly affecting electronic parts arranged around the MMIC chip.Type: GrantFiled: March 5, 1998Date of Patent: October 10, 2000Assignee: Kabushiki Kaisha ToshibaInventors: Yasushi Shizuki, Mitsuo Konno
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Patent number: 5898909Abstract: Disclosed is an ultra high frequency radio communication apparatus having: a receiver antenna; a transmitter antenna; an IC chip being electrically connected to the receiver antenna and the transmitter antenna; a substrate on which the receiver antenna, the transmitter antenna and the IC chip are mounted; an input terminal for inputting to the IC chip a base band input signal; an output terminal for outputting a base band output signal from the IC chip; and a control signal terminal for inputting a control signal for controlling the IC chip to the IC chip. The IC chip is placed in a shielding space such that the cut-off frequency of the shielding space is higher than the frequency of a carrier signal for radio communication.Type: GrantFiled: September 27, 1996Date of Patent: April 27, 1999Assignee: Kabushiki Kaisha ToshibaInventors: Kunio Yoshihara, Kouhei Morizuka, Mitsuo Konno, Yasuo Ashizawa, Junko Akagi, Yasuhiro Kuriyama, Motoyasu Morinaga, Eiji Takagi, Yasushi Shizuki, Yuji Iseki, Takeshi Hanawa, Takeshi Miyagi
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Patent number: 5384486Abstract: An integrated circuit device has a substrate, a plurality of circuit elements or units arranged on the substrate and having terminals, a plurality of signal lines connected between the terminals of the circuit elements or units, or between the terminals and external connection terminals, and an alternating current ground line provided close to the signal lines to determine a transmission characteristic of the signal lines, the alternating current ground line including a high-potential direct current power source line and a low-potential direct current power source line, the high-potential direct current power source line and the low-potential direct current power source line being vertically separated by a dielectric layer.Type: GrantFiled: February 26, 1993Date of Patent: January 24, 1995Assignee: Kabushiki Kaisha ToshibaInventor: Mitsuo Konno
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Patent number: 5243421Abstract: A wide television receiver which converts a video input signal having an aspect ratio 4:3 or 16:9 into a display format permitting selecting of display with horizontal compression, without horizontal compression, with vertical magnification, or without vertical magnification to present the display on a wide display having an aspect ratio 16:9.Type: GrantFiled: October 7, 1991Date of Patent: September 7, 1993Assignee: Hitachi, Ltd.Inventors: Tatsuo Nagata, Shigeru Hirahata, Kenji Katsumata, Shinobu Torikoshi, Mitsuo Konno
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Patent number: 5185650Abstract: A high-speed semiconductor integrated circuit device has a main circuit section formed on a substrate, and a capacitance section formed on the substrate to surround the main circuit section. The capacitance section is made up of two conductive layers, an upper layer being insulatively disposed above a lower layer. These layers are applied with a power source voltage and a ground voltage, respectively. High-speed signal lines insulatively traverse the capacitance section and are connected to the main circuit section. The capacitance section is disconnected in the region where each signal transmission line passes, and defines a micro-strip type signal transmission line path structure. A "ladder"-shaped connection pattern is provided at each disconnected portion of the capacitance section, for electrically connecting a conductive layer arranged on one side of the disconnected portion to the corresponding layer arranged on the other side of the disconnected portion.Type: GrantFiled: April 1, 1992Date of Patent: February 9, 1993Assignee: Kabushiki Kaisha ToshibaInventors: Hirotsugu Wakimoto, Mitsuo Konno, Kunio Yoshihara
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Patent number: 5063278Abstract: A welding electric current is suppled to a tiltable resistance welding gun having a pair of electrodes which grip a workpiece while effecting resistance welding thereon. A power receiver terminal on the resistance welding gun and a power supply unit are connected to each other when the electrodes grip the workpiece therebetween, and the welding current is supplied from the power supply unit to the power receiver terminal. When the electrodes are separated from the workpiece, the power receiver terminal and the power supply unit are disconnected from each other.Type: GrantFiled: June 20, 1989Date of Patent: November 5, 1991Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Mitsuo Konno, Hisashi Noro, Naotero Katsura
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Patent number: 5050631Abstract: A fluid diverging system provides a passageway for supplying a fluid from a single supply source to a plurality of sections requiring the use of the fluid and for discharging the fluid from these sections to a single discharge portion. The fluid diverging system includes a plurality of fluid diverging blocks separably connected to one another longitudinally in a row. Each of the blocks has a through-hole longitudinally passed therethrough, and a communication passage communicating with the through-hole and capable of being connected to external fluid transfer means. Joint means connecting these blocks enable a fluid-tight communication of these blocks with one another. This makes it possible to use the fluid diverging system in an optical form only by increasing or decreasing the number of the fluid diverging blocks in accordance with an increase or decrease in number of the section requiring the use of the fluid.Type: GrantFiled: January 9, 1991Date of Patent: September 24, 1991Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Mitsuo Konno, Masaki Kawada, Mamoru Machida, Hisashi Noro
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Patent number: 4504718Abstract: A microwave heating apparatus comprises a solid state oscillating circuit, a pre-amplifier module for amplifying the output of the oscillating circuit, a plurality of amplifier modules for amplifying the output of the pre-amplifier module, a first power supply source for energizing the solid state oscillating circuit and a second power supply source for energizing all of the amplifier modules. Such an apparatus further comprises a delay circuit for activating the first power supply source after the second power supply source has been activated and the amplifier modules have been in a stable state.Type: GrantFiled: September 20, 1983Date of Patent: March 12, 1985Assignee: Tokyo Shibaura Denki Kabushiki KaishaInventors: Hisashi Okatsuka, Koichi Taniguchi, Mitsuo Konno, Ryuho Narita
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Patent number: 4410782Abstract: A fluid pressure operated spot welding apparatus is disclosed, in which one of a pair of electrode arms initially is moved from a closed position of the electrodes in a rectilinear path perpendicular to the other electrode, and subsequently is swung in an arcuate path to a retracted position in which the said one electrode is positioned rearwardly and remote from the said other electrode, the apparatus also providing for the substitution of alternative workpiece supports in a readily interchangeable manner.Type: GrantFiled: February 20, 1981Date of Patent: October 18, 1983Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Mitsuo Konno, Ryo Niikawa, Kenzo Sato