Patents by Inventor Mitsuo Nakahara

Mitsuo Nakahara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5250757
    Abstract: A printed wiring board for forming an electric connection to an external device. The printed wiring board comprises a base material, and at least one connecting terminal formed on the base material for forming an electrical connection to an external device. A solder resist layer is formed on at least a portion of the base material surface excluding a connecting terminal forming region. A conductive protective layer is formed over the connecting terminal forming region and covers the connecting terminal. The end portion of the solder resist layer is separated from the end portion of the conductive protecting layer. An overcoat layer is formed on the separating portion for bridging the end portion of the solder resist layer and the end portion of the conductive protecting layer.
    Type: Grant
    Filed: April 16, 1992
    Date of Patent: October 5, 1993
    Assignee: Nippon CMK Corp.
    Inventors: Shin Kawakami, Tatsuhiko Hayashida, Mitsuo Nakahara