Patents by Inventor Mitsuo Ohdate

Mitsuo Ohdate has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing pressure contact semiconductor devices
    Patent number: 4803180
    Abstract: A semiconductor device includes a support member; a semiconductor element mounted on the support member; an elastic body which places the semiconductor element in pressure-contact with the support member; a cylindrical body for containing the semiconductor element and the elastic body, the lower end of the cylindrical body being fixed to the support member; and a plurality of curved projections produced so as to be in contact with the upper end of the elastic body by curving at least three points of the top end of the cylindrical body while pressure is applied to the semiconductor element through the elastic body.
    Type: Grant
    Filed: June 3, 1987
    Date of Patent: February 7, 1989
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Mitsuo Ohdate
  • Pressure contact semiconductor device
    Patent number: 4792844
    Abstract: A semiconductor device includes a support member; a semiconductor element mounted on the support member; an elastic body which places the semiconductor element in pressure-contact with the support member; a cylindrical body for containing the semiconductor element and the elastic body, the lower end of the cylindrical body being fixed to the support member; and a plurality of curved projections produced so as to be in contact with the upper end of the elastic body by curving at least three points of the top end of the cylindrical body while pressure is applied to the semiconductor element through the elastic body.
    Type: Grant
    Filed: July 20, 1987
    Date of Patent: December 20, 1988
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Mitsuo Ohdate
  • Explosion proof vibration resistant flat package semiconductor device
    Patent number: 4274106
    Abstract: Two opposite electrodes are disposed at both ends of a hollow, electrically insulating cylinder to sandwich a semiconductor element between them and connected to those ends through thin metallic annuli respectively. The semiconductor element is physically isolated from each of the metallic annuli either by an annular member interposed between a circumferential protrusion of each electrode and the hollow cylinder or by contacting directly the protrusion with the cylinder. The annulr member may be resilient or not elastically deformable.
    Type: Grant
    Filed: November 3, 1978
    Date of Patent: June 16, 1981
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Mitsuo Ohdate