Patents by Inventor Mitsuo Sekiya

Mitsuo Sekiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for grinding the surface of a semiconductor wafer
    Patent number: 4947598
    Abstract: A dresser made of bonded alundum-type abrasive is ground by a rotating blade made of bonded super abrasive to dress the blade. The surface of a semiconductor wafer is ground by the rotating dressed blade to convert it into a matte-finished surface substantially free from saw marks.
    Type: Grant
    Filed: April 19, 1983
    Date of Patent: August 14, 1990
    Assignee: Disco Abrasive Systems, Ltd.
    Inventor: Mitsuo Sekiya