Abstract: Light quantity unevenness is corrected at high resolution to improve image quality, without increasing a speed of system clock. Pixel correction data which is to correct a light emission characteristic of each light emission element by the pixel unit is prepared for plural lines, and the pixel correction data for the plural lines are periodically changed to modify a light emission driving time of each light emission element.

Abstract: A diffusion part diffuses an optical signal emitted from the end face of an optical fiber of an input light guide. An input reflection part reflects the optical signal diffused by the diffusion part in the direction of an output reflection part. A transparent medium guides the optical signal reflected by the input reflection part in the direction of the output reflection part. Output reflection parts reflect optical signals guided in the transparent media in the direction of optical fibers of output light guides. The optical signal reflected by the output reflection part is incident on the end face of the optical fiber and is transmitted over the output light guide.

Abstract: A frequency modulation apparatus capable of reducing a peak level of a radiation noise of a characteristic frequency band due to an image clock.

Abstract: SLED (Self-scanning type Light Emitting Diode) array chips of 56 pieces and one driving circuit which generates signals to drive the 56 SLED array chips are provided. A signal is generated by another driving circuit. A driving current control resistor which is connected in series to a common base of driving transistors is provided to variably adjust an input voltage value acting as a control signal of the driving circuit. Thus, a light emission array head, a driving level adjustment method of a driving signal for this head, and an image formation apparatus containing this head can be simplified.

Abstract: To prevent an electrical short due to ion movement in a semiconductor chip and improve the reliability. In a predetermined period T2 in which light-emitting or transfer operation is not performed by light-emitting elements, control signals &phgr;1, &phgr;2, &phgr;I, and &phgr;S and a signal &phgr;m of a negative-electrode-side power-supply input unit are set to a potential or high-impedance state same as that of a positive-electrode-side power-supply input unit.

Abstract: Distortion of an LED array head is eliminated by correcting an electrode pitch misalignment between an LED array substrate and a driver substrate to be caused by thermal expansion or contraction during thermal pressure bonding of a flexible cable. A tear preventing hole is formed in each area between adjacent four-divided areas of the flexible cable. When positions of the flexible cable and driver substrate are to be aligned, a pitch shift adjusting slit line is cut in order to correct the position misalignment to be caused by thermal expansion or contraction generated when the flexible cable is thermal-pressure bonded to the LED substrate. The pitch shift adjusting slit line is formed in the connection area between adjacent four-divided areas.

Abstract: A diffusion part diffuses an optical signal emitted from the end face of an optical fiber of an input light guide. An input reflection part reflects the optical signal diffused by the diffusion part in the direction of an output reflection part. A transparent medium guides the optical signal reflected by the input reflection part in the direction of the output reflection part. Output reflection parts reflect optical signals guided in the transparent media in the direction of optical fibers of output light guides. The optical signal reflected by the output reflection part is incident on the end face of the optical fiber and is transmitted over the output light guide.

Abstract: To prevent an electrical short due to ion movement in a semiconductor chip and improve the reliability. In a predetermined period T2 in which light-emitting or transfer operation is not performed by light-emitting elements, control signals &phgr;1, &phgr;2, &phgr;I, and &phgr;S and a signal &phgr;m of a negative-electrode-side power-supply input unit are set to a potential or high-impedance state same as that of a positive-electrode-side power-supply input unit.

Abstract: An image formation apparatus which records an image on a recording medium has a recording element array head on which plural recording chips are disposed, and in the recording chip plural recording elements are arrayed. A main scan unit is for scanning the recording elements, and a sub-scan unit, for effecting relative motion between the recording medium and the recording chips in a sub-scanning direction. The main scan unit scans the recording elements n (n≧2) times on the basis of image data corresponding to one scan. The direction along which the recording elements are disposed, is deviated from the direction perpendicular to the sub-scanning direction, by a predetermined angle.

Abstract: There is disclosed an LED array chip which can minimize LED optical property deterioration by addition of a surface protective film, and mainly side effects such as light quantity decrease and light quantity dispersion increase among light emitting bits. In the LED array chip comprising a plurality of LED light emitting elements arrayed in a row, a surface insulating film formed by the same material as a material of an inner-layer insulating film for forming a window to connect a wiring pattern in an internal electric circuit constitution and for establishing electric insulation between circuits and by the same thin film forming process as a process of the inner-layer insulating layer is formed in an thickness of 0.5 &mgr;m or less on the entire surface of a final surface layer excluding a wire bonding pad and including a light emitting portion surface.

Abstract: An LED array head for an electrophotographic system includes a base plate mounting thereon a number of linearly arranged LED chips and a support member holding the base plate. The base plate and the support member are bonded together by means of a principal adhesive agent which is elastic after hardening such as a silicone type and an auxiliary adhesive agent which hardens more quickly and is less elastic after hardening than the principal adhesive agent. An ultraviolet ray setting type adhesive agent is preferably used as the auxiliary adhesive agent. Assembling steps of such LED array heads can proceed without waiting for hardening of the principal adhesive agent.

Abstract: A method and apparatus for reducing image unevenness due to light emission of a transfer element. Namely, when a printing speed is changed to 1/2n (n is a positive integer), a SLED head controller repeats a cycle to perform exposure control for one line and then stops the exposure control for the lines corresponding to 1/2n speed. For example, in the 1/2 speed (i.e., n=1), transfer and light emission driving are performed at an initially set maximum speed, and the cycle when the exposure control for one line is stopped after the one-line exposure control is repeated. The printing speed is changed on the basis of the type or kind of recording medium used.

Abstract: In a drive apparatus of a self-scanning type light emission element array, a first bit light emission thyristor is surely set into an ON state, thereby stabilizing shift of a light emitting operation from the first bit light emission thyristor. In the light emission element array drive apparatus which drives a light emission element array having plural light emission thyristors arranged in array and plural shift thyristors arranged in array (each gate of shift thyristors is connected to each gate of light emission thyristors), the apparatus comprises: a generation unit for generating a shift signal to sequentially shift ON states of the shift thyristors; and a generation unit for generating a start signal to start drive of the light emission element array, wherein a gate voltage of the first light emission thyristor is supplied according to the start signal without setting the first shift thyristor into an ON state according to the shift signal.

Abstract: In a resinous circuit board having a circuitized substrate having conductive layers therewithin, a plurality of pin pads formed on a rear surface of the substrate, and a plurality of pins, each pin having a tip end portion and a head portion and soldered to the pin pad in such a manner as to contact at the head portion to the pin pad. The head portion of the pin consists of a flange section which is larger in diameter than the tip end portion, and a part-spherical abutment section bulging from the flange section in the direction opposite to the tip end portion and brought into contact with the pin pad. The part-spherical abutment section is made of eutectic silver solder which is lower in melting point than solder such as Sn—Ag solder which is used for soldering the pin to the pin pad. Since the silver solder and soft solder are present between the flange section and the pin pad, they can release the stress applied to the pin, thus making it possible to increase the joining strength considerably.

Abstract: A printed-wiring substrate including a substrate 101 having pin-bonding portions 111 formed on a main surface 104 thereof and lead pins 121. The lead pins 121 each have a flange 123 and a shaft portion 122 and being brazed to corresponding pin-bonding portions 111 via the corresponding flanges 123. A hemispherical convex shape is imparted to a bonding surface 124 of a flange 123. The flange 123 is used for brazing of a lead pin 121, and the bonding surface 124 faces a pin-bonding portion 111 of a substrate 101. A brazing filler metal 131 used for brazing of the lead pin 121 extends by wetting toward the tip end of the lead pin 121 beyond the outermost edge 127 of an opposite surface 126 of the flange 123, which is opposite the bonding surface 124 of the flange 123, such that an extension-by-wetting end of the brazing filler metal 131 is located between the outermost edge 127 and a shaft portion 122 of the lead pin 121. Since the solder 131 has no narrow portion, the bonding strength is not impaired.

Abstract: A sharp image having excellent color balance is formed by preventing differences in the amount of light among recording heads. When forming an image using at least two recording heads, each having transfer thyristors and light-emitting thyristors arranged in the form of an array, by causing the transfer thyristors of M, C and Y recording heads having light-emitting thyristors not to be lit to perform transfer operations as the transfer thyristors of a K recording head having light-emitting thrystors to be lit, the difference in the amount of light among the recording heads is corrected.

Abstract: A printed-wiring substrate including a substrate 101 having pin-bonding portions 111 formed on a main surface 104 thereof and lead pins 121. The lead pins 121 each have a flange 123 and a shaft portion 122 and being brazed to corresponding pin-bonding portions 111 via the corresponding flanges 123. A hemispherical convex shape is imparted to a bonding surface 124 of a flange 123. The flange 123 is used for brazing of a lead pin 121, and the bonding surface 124 faces a pin-bonding portion 111 of a substrate 101. A brazing filler metal 131 used for brazing of the lead pin 121 extends by wetting toward the tip end of the lead pin 121 beyond the outermost edge 127 of an opposite surface 126 of the flange 123, which is opposite the bonding surface 124 of the flange 123, such that an extension-by-wetting end of the brazing filler metal 131 is located between the outermost edge 127 and a shaft portion 122 of the lead pin 121. Since the solder 131 has no narrow portion, the bonding strength is not impaired.

Abstract: The present invention provides a color image forming apparatus comprising a plurality of color recording heads each having a plurality of recording chips for effecting the recording in response to an image signal. Features of the recording chips attached to the recording head for forming a yellow image differ from features of the recording chips attached to the other color recording heads.

Abstract: A recording head includes a recording element having a plurality of light-emitting elements, a first substrate on which the recording element is mounted, a driving unit for driving the recording element, a second substrate on which the driving unit is mounted, and bonding wires. The recording element has bonding pads, and the second substrate has through holes. The bonding wires connect the bonding pads and the inner surfaces of the through holes.

Abstract: An image recording apparatus which performs time division and driving of 128 recording devices arrayed within an LED chip includes shift registers for sequentially serially outputting 128 bits of continuous pixel data to 56 signal lines, corresponding to each LED, from one line of serially input pixel data row, selectors which perform time division of the 56 pieces of pixel data into 8 times of 7 pieces apiece and then outputs the data, and registers which hold the pixel data output from the selectors for each corresponding LED chip. The image recording apparatus may be used as a recording head for a printer using solid recording devices is simplified, and costs are reduced.