Patents by Inventor Mitsuo Sorimachi

Mitsuo Sorimachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6135102
    Abstract: A running bonded abrasive wire cuts wafers one by one from a slice base, which hold the wafers. The cut wafers are transported on the first conveyor to a collecting part. During the transport process, a CCD camera images the shape of the wafer, and outputs the image data of the wafer to a control unit. The control unit image-processes the image data to recognize whether the transported wafers are normal or inferior. In accordance with the recognition results, the collecting part collects the normal wafers and the inferior wafers separately.
    Type: Grant
    Filed: November 17, 1998
    Date of Patent: October 24, 2000
    Assignee: Tokyo Seimitsu Co., Ltd.
    Inventors: Mitsuo Sorimachi, Kenichi Nakaura
  • Patent number: 4838815
    Abstract: A plurality of spring housing holes are formed in a first surface of an insulation block of a socket connector, and contact insertion holes are formed in a second surface of the block in communication with the spring housing holes. In each spring housing hole, a coil spring is housed, and the insulation block holds a terminal connected to the corresponding coil spring. A plurality of plug contacts are arranged and embedded in an insulation body of a plug connector. When the plug contacts are inserted into the contact insertion holes, the plug contacts are inserted and engaged between coils of the coil springs to connect the plug contacts and springs electrically with each other.
    Type: Grant
    Filed: September 18, 1987
    Date of Patent: June 13, 1989
    Assignee: Hosiden Electronics Co., Ltd.
    Inventors: Kyousuke Tajima, Goro Itoi, Mitsuo Sorimachi
  • Patent number: 4824402
    Abstract: A connector plug, for engagement with a connector socket, has a main positioning protrusion extending from the front marginal edge of a cylindrical metal cover in its axial direction and protruding outwardly from its outer peripheral surface. The cylindrical metal cover also includes a cut-away portion, along its front marginal edge, which defines two corner portions that cooperate with the main positioning protrusion to position the connector plug relative to the connector socket.
    Type: Grant
    Filed: November 24, 1987
    Date of Patent: April 25, 1989
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Mitsuo Sorimachi
  • Patent number: 4661667
    Abstract: A heart cam type locking mechanism is provided by which in response to a first push button depressing operation, a moving member is locked at a first position in a casing, the moving member is locked at a second position in response to a second push button depressing operation and the moving member is returned to its initial position in response to a third push button depressing operation. The inside of the push button is divided by a partition plate into first and second optical path spaces. A lamp is disposed in the casing so that it emits light into the first and second optical path spaces. A light shielding plate of a resilient material is disposed in the first optical path space and fixed at one end to the moving member.
    Type: Grant
    Filed: November 18, 1985
    Date of Patent: April 28, 1987
    Assignee: Hosiden Electronics Co., Ltd.
    Inventors: Mitsuo Sorimachi, Mamoru Sato
  • Patent number: 4371859
    Abstract: First and second fixed terminals are mounted in a casing and have one ends projecting out of the casing. Inside the casing, a bimetal extends between the first and second fixed terminals, the bimetal having one end secured to the first fixed terminal. The other end of the bimetal is held in engagement with one end of a coil spring disposed around a pivotable lever pivotably supported on the casing, the other end of the coil spring engaging the pivotable lever. When a current flowing through the bimetal exceeds a predetermined amount, the bimetal is bent to cause a contact supported on a distal end thereof to move rapidly out of contact with a contact supported on the second fixed terminal under the resiliency of the coil spring acting on the bimetal.
    Type: Grant
    Filed: July 8, 1981
    Date of Patent: February 1, 1983
    Assignee: Hosiden Electronics Co., Ltd.
    Inventor: Mitsuo Sorimachi