Patents by Inventor Mitsuo Tada

Mitsuo Tada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190011591
    Abstract: The object of the present invention is to provide a small-sized metal detection sensor for detecting fine metal contaminants, using an electromagnetic induction detection technique. A metal detection sensor for 20 detecting metal 14 contained in an object under inspection moving through a passageway 18 comprises: magnets 24, 26 generating static magnetic field; and a coil 30 for detecting a magnetic field 28 generated by the metal 14. The magnets 24, 26 are located outside of the coil 30 along its axial direction, and the coil 30 is located outside of the magnets 24, 26 along the axial direction connecting the N poles and the S poles of the magnets 24, 26. The magnets 24, 26 are opposed to the coil 30.
    Type: Application
    Filed: June 23, 2016
    Publication date: January 10, 2019
    Inventors: Taro TAKAHASHI, Mitsuo TADA
  • Patent number: 10134614
    Abstract: A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing controller (54) processes the electric signal of the reflected light to decide the state of the peripheral portion (30). The state of the peripheral portion being polished is monitored. Moreover, the polish end point is detected. A transmission wave other than the laser light may also be used. The peripheral portion (30) may also be enclosed by a passage forming member thereby to form a passage properly. The peripheral portion can be properly measured even in the situation where the liquid is flowing on the substrate peripheral portion.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: November 20, 2018
    Assignee: Ebara Corporation
    Inventors: Mitsuo Tada, Yasunari Suto, Hirofumi Ichihara, Kenya Ito, Tamami Takahashi
  • Publication number: 20170259394
    Abstract: An end-point detection sensor 50 detects an end point of polishing, the end-point detection sensor 50 being arranged in a polishing table 100. The end-point detection sensor 50 has a pot core. The pot core 60 has a bottom portion 61a, a magnetic core base portion 61b and a peripheral wall base portion 61c. The end-point detection sensor 50 has an exciting coil 62, and a detection coil 63. The back surface 101b of the polishing pad 101 has a space 30 which is arranged at a portion facing the polishing table 100 and houses a magnetic core extension portion 8 and a peripheral wall extension portion 11. The magnetic core extension portion 8 and the peripheral wall extension portion 11 extending to the space 30 are located in the space 30.
    Type: Application
    Filed: February 21, 2017
    Publication date: September 14, 2017
    Inventors: Taro TAKAHASHI, Akira NAKAMURA, Hiroaki SHIBUE, Mitsuo TADA
  • Patent number: 9632061
    Abstract: An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor is disposed near the metal film or the conductive film formed on the substrate to detect an eddy current generated in the metal film or the conductive film. The eddy current sensor includes a plurality of coils having different sizes formed by winding a wire or a conductive material. The plurality of coils includes an inner coil and an outer coil spaced from each other, and the outer coil is configured to surround the inner coil. The plurality of coils are configured to detect respective eddy currents generated in the metal film or the conductive film.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: April 25, 2017
    Assignee: Ebara Corporation
    Inventors: Taro Takahashi, Mitsuo Tada
  • Patent number: 9437507
    Abstract: The polishing process includes a first state where an eddy current sensor and a polishing target object do not face each other and a second state where the eddy current sensor and the polishing target object face each other. The method of correcting a film thickness measurement value includes obtaining a first measurement signal (Xout, Yout) output from the eddy current sensor in the first state (step S108), computing a correction value (?X, ?Y) on the basis of the obtained first measurement signal and a reference signal (Xsd, Ysd) set in advance, obtaining a second measurement signal (X, Y) output from the eddy current sensor in the second state (step S104), and correcting the obtained second measurement signal on the basis of the computed correction value while the polishing process is being performed (step S105).
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: September 6, 2016
    Assignee: Ebara Corporation
    Inventors: Akira Nakamura, Hiroaki Shibue, Yasumasa Hiroo, Hiroshi Ota, Taro Takahashi, Mitsuo Tada
  • Publication number: 20150262893
    Abstract: The polishing process includes a first state where an eddy current sensor and a polishing target object do not face each other and a second state where the eddy current sensor and the polishing target object face each other. The method of correcting a film thickness measurement value includes obtaining a first measurement signal (Xout, Yout) output from the eddy current sensor in the first state (step S108), computing a correction value (?X, ?Y) on the basis of the obtained first measurement signal and a reference signal (Xsd, Ysd) set in advance, obtaining a second measurement signal (X, Y) output from the eddy current sensor in the second state (step S104), and correcting the obtained second measurement signal on the basis of the computed correction value while the polishing process is being performed (step S105).
    Type: Application
    Filed: March 12, 2015
    Publication date: September 17, 2015
    Inventors: Akira NAKAMURA, Hiroaki SHIBUE, Yasumasa HIROO, Hiroshi OTA, Taro TAKAHASHI, Mitsuo TADA
  • Publication number: 20150101752
    Abstract: A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing controller (54) processes the electric signal of the reflected light to decide the state of the peripheral portion (30). The state of the peripheral portion being polished is monitored. Moreover, the polish end point is detected. A transmission wave other than the laser light may also be used. The peripheral portion (30) may also be enclosed by a passage forming member thereby to form a passage properly. The peripheral portion can be properly measured even in the situation where the liquid is flowing on the substrate peripheral portion.
    Type: Application
    Filed: December 22, 2014
    Publication date: April 16, 2015
    Inventors: Mitsuo TADA, Yasunari SUTO, Hirofumi ICHIHARA, Kenya ITO, Tamami TAKAHASHI
  • Patent number: 8696924
    Abstract: A polishing apparatus is used for polishing and planarizing a substrate such as a semiconductor wafer on which a conductive film such as a copper (Cu) layer or a tungsten (W) layer is formed. The polishing apparatus includes a polishing table having a polishing surface, a motor for rotating the polishing table, a top ring for holding a substrate and pressing the substrate against the polishing surface, a film thickness measuring sensor disposed in the polishing table for scanning a surface of the substrate, and a computing device for processing signals of the film thickness measuring sensor to compute a film thickness of the substrate.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: April 15, 2014
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Mitsuo Tada, Taro Takahashi, Motohiro Niijima, Shinro Ohta, Atsushi Shigeta
  • Patent number: 8657644
    Abstract: An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor includes a sensor coil disposed near a metal film or a conductive film formed on a substrate, and the sensor coil includes a detection coil operable to detect an eddy current produced in the metal film or the conductive film. The detection coil includes a coil formed by winding a wire by a single row and plural layers, the row being defined as a direction perpendicular to the substrate and the layer being defined as a direction parallel to the substrate.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: February 25, 2014
    Assignee: Ebara Corporation
    Inventors: Mitsuo Tada, Taro Takahashi
  • Publication number: 20130260645
    Abstract: An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor is disposed near the metal film or the conductive film formed on the substrate to detect an eddy current generated in the metal film or the conductive film. The eddy current sensor includes a plurality of coils having different sizes formed by winding a wire or a conductive material. The plurality of coils includes an inner coil and an outer coil spaced from each other, and the outer coil is configured to surround the inner coil. The plurality of coils are configured to detect respective eddy currents generated in the metal film or the conductive film.
    Type: Application
    Filed: March 28, 2013
    Publication date: October 3, 2013
    Inventors: Taro Takahashi, Mitsuo Tada
  • Publication number: 20120088438
    Abstract: An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor includes a sensor coil disposed near a metal film or a conductive film formed on a substrate, and the sensor coil includes a detection coil operable to detect an eddy current produced in the metal film or the conductive film. The detection coil includes a coil formed by winding a wire by a single row and plural layers, the row being defined as a direction perpendicular to the substrate and the layer being defined as a direction parallel to the substrate.
    Type: Application
    Filed: December 7, 2011
    Publication date: April 12, 2012
    Inventors: Mitsuo TADA, Taro Takahashi
  • Patent number: 7960188
    Abstract: A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film. During the second polishing process and the third polishing process, a polishing state of the substrate is monitored with an eddy current sensor, and the third polishing process is terminated when an output signal of the eddy current sensor reaches a predetermined threshold.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: June 14, 2011
    Assignee: Ebara Corporation
    Inventors: Shinrou Ohta, Mitsuo Tada, Noburu Shimizu, Yoichi Kobayashi, Taro Takahashi, Eisaku Hayashi, Hiromitsu Watanabe, Tatsuya Kohama, Itsuki Kobata
  • Publication number: 20110124269
    Abstract: An eddy current sensor is used for detecting a metal film (or conductive film) formed on a surface of a substrate such as a semiconductor wafer. The eddy current sensor includes a sensor coil disposed near a metal film or a conductive film formed on a substrate, and the sensor coil includes a detection coil operable to detect an eddy current produced in the metal film or the conductive film. The detection coil includes a coil formed by winding a wire by a single row and plural layers, the row being defined as a direction perpendicular to the substrate and the layer being defined as a direction parallel to the substrate.
    Type: Application
    Filed: January 13, 2011
    Publication date: May 26, 2011
    Inventors: Mitsuo TADA, Taro Takahashi
  • Patent number: 7854646
    Abstract: The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: December 21, 2010
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Koichi Fukaya, Mitsuo Tada, Taro Takahashi, Yasunari Suto
  • Patent number: 7714572
    Abstract: A method of detecting a characteristic (such as thickness) of first and second films formed on a substrate includes supplying a sensor coil with a first alternating current having a first frequency when detecting the first film, and a second alternating current having a second frequency when detecting the second film. An eddy current is thereby generated in the first film or the second film. An impedance across the sensor coil is measured, and the characteristic of any one of the first film and the second film is detected based on the impedance.
    Type: Grant
    Filed: May 30, 2006
    Date of Patent: May 11, 2010
    Assignee: Ebara Corporation
    Inventors: Mitsuo Tada, Hironobu Yamasaki, Yasunari Suto
  • Publication number: 20100112901
    Abstract: The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).
    Type: Application
    Filed: January 15, 2010
    Publication date: May 6, 2010
    Inventors: Tetsuji TOGAWA, Koichi Fukaya, Mitsuo Tada, Taro Takahashi, Yasunari Suto
  • Patent number: 7670206
    Abstract: The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).
    Type: Grant
    Filed: June 17, 2004
    Date of Patent: March 2, 2010
    Assignee: Ebara Corporation
    Inventors: Tetsuji Togawa, Koichi Fukaya, Mitsuo Tada, Taro Takahashi, Yasunari Suto
  • Publication number: 20090286332
    Abstract: A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film, during the second polishing process and the third polishing process, monitoring a polishing state of the substrate with an eddy current sensor, and terminating the third polishing process when an output signal of the eddy current sensor reaches a predetermined threshold.
    Type: Application
    Filed: May 13, 2009
    Publication date: November 19, 2009
    Inventors: Shinrou OHTA, Mitsuo Tada, Noburu Shimizu, Yoichi Kobayashi, Taro Takahashi, Eisaku Hayashi, Hiromitsu Watanabe, Tatsuya Kohama, Itsuki Kobata
  • Patent number: 7508201
    Abstract: An eddy current sensor (10) has a sensor coil (100) disposed near a conductive film (6) formed on a semiconductor wafer (W) and a signal source (124) configured to supply an AC signal to the sensor coil (100) to produce an eddy current in the conductive film (6). The eddy current sensor (10) includes a detection circuit operable to detect the eddy current produced in the conductive film (6). The detection circuit is connected to the sensor coil (100). The eddy current sensor (10) also includes a housing (200) made of a material having a high magnetic permeability. The housing (200) accommodates the sensor coil (100) therein. The housing (200) is configured so that the sensor coil (100) forms a path of a magnetic flux (MF) so as to effectively produce an eddy current in the conductive film (6).
    Type: Grant
    Filed: October 18, 2004
    Date of Patent: March 24, 2009
    Assignee: Ebara Corporation
    Inventors: Mitsuo Tada, Yasunari Suto
  • Publication number: 20080274670
    Abstract: A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing controller (54) processes the electric signal of the reflected light to decide the state of the peripheral portion (30). The state of the peripheral portion being polished is monitored. Moreover, the polish end point is detected. A transmission wave other than the laser light may also be used. The peripheral portion (30) may also be enclosed by a passage forming member thereby to form a passage properly. The peripheral portion can be properly measured even in the situation where the liquid is flowing on the substrate peripheral portion.
    Type: Application
    Filed: May 23, 2005
    Publication date: November 6, 2008
    Applicant: EBARA CORPORATION
    Inventors: Mitsuo Tada, Yasunari Suto, Hirofumi Ichihara, Kenya Ito, Tamami Takahashi