Patents by Inventor Mitsuo Takamatsu

Mitsuo Takamatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5631612
    Abstract: A SAW filter includes a first SAW resonator having a pair of terminals and a predetermined resonance frequency (f.sub.rp), the first SAW resonator being provided in a parallel arm of the SAW filter. A second SAW resonator has a pair of terminals and a predetermined resonance frequency (f.sub.rs) approximately equal to a predetermined antiresonance frequency of the first SAW resonator (f.sub.ap). The second SAW resonator is provided in a series arm of the SAW filter. An inductance element is connected in series to the first SAW resonator.
    Type: Grant
    Filed: January 6, 1995
    Date of Patent: May 20, 1997
    Assignee: Fujitsu Limited
    Inventors: Yoshio Satoh, Osamu Ikata, Tsutomu Miyashita, Takashi Matsuda, Mitsuo Takamatsu
  • Patent number: 5559481
    Abstract: A SAW filter includes a first SAW resonator having a pair of terminals and a predetermined resonance frequency (f.sub.rp), the first SAW resonator being provided in a parallel arm of the SAW filter. A second SAW resonator has a pair of terminals and a predetermined resonance frequency (f.sub.rs) approximately equal to a predetermined antiresonance frequency of the first SAW resonator (f.sub.ap). The second SAW resonator is provided in a series arm of the SAW filter. An inductance element is connected in series to the first SAW resonator.
    Type: Grant
    Filed: October 23, 1992
    Date of Patent: September 24, 1996
    Assignee: Fujitsu Limited
    Inventors: Yoshio Satoh, Osamu Ikata, Tsutomu Miyashita, Takashi Matsuda, Mitsuo Takamatsu
  • Patent number: 5300902
    Abstract: A surface acoustic wave device comprises a pair of multiple-electrode surface acoustic wave elements that are mirror-symmetrically arranged and disposed on a piezoelectric substrate. Each of the multiple-electrode surface acoustic wave elements comprises a plurality of input/output inter-digital transducers and connected inter-digital transducers. The number of the input/output inter-digital transducers is equal to or smaller by one, than the number of the connected inter-digital transducers, so that insertion loss of the surface acoustic wave device can be reduced without increasing the size of the device.
    Type: Grant
    Filed: March 13, 1992
    Date of Patent: April 5, 1994
    Assignee: Fujitsu Limited
    Inventors: Yoshio Satoh, Tsutomu Miyashita, Osamu Ikata, Mitsuo Takamatsu, Takashi Matsuda
  • Patent number: 5281883
    Abstract: A surface acoustic wave device in which a surface acoustic wave device element is arranged with interdigital electrodes on a piezoelectric substrate is packaged in a package provided in a metal pattern. Metal bumps are formed on a bonding pad section of the surface wave device element and the metal bumps are contact connected with the metal pattern of the package.
    Type: Grant
    Filed: November 4, 1991
    Date of Patent: January 25, 1994
    Assignee: Fujitsu Limited
    Inventors: Osamu Ikata, Yoshio Satoh, Tsutomu Miyashita, Mitsuo Takamatsu, Takashi Matsuda
  • Patent number: 5179310
    Abstract: A SAW device comprises a substrate, input and output interdigital electrodes provided on the substrate alternately to form a row of electrodes, and a pair of open strip reflectors disposed at both ends of the row, the input interdigital electrodes having a first pair number representing the number of pairs of opposing finger electrodes forming the input electrode, the output interdigital electrodes having a second pair number representing the number of pairs of opposing finger electrodes forming the output electrode, wherein the first pair number and second pair number are set different in the adjacent input and output electrodes with a predetermined ratio therebetween, the first pair number is changed in each input electrodes in the row, and the second pair number is changed in each output electrodes in the row.
    Type: Grant
    Filed: March 19, 1991
    Date of Patent: January 12, 1993
    Assignee: Fujitsu Limited
    Inventors: Yoshio Satoh, Osamu Ikata, Tsutomu Miyashita, Mitsuo Takamatsu, Takashi Matsuda
  • Patent number: RE37375
    Abstract: A SAW filter includes a first SAW resonator having a pair of terminals and a predetermined resonance frequency (frp), the first SAW resonator being provided in a parallel arm of the SAW filter. A second SAW resonator has a pair of terminals and a predetermined resonance frequency (frs) approximately equal to a predetermined antiresonance frequency of the first SAW resonator (fap). The second SAW resonator is provided in a series arm of the SAW filter. An inductance element is connected in series to the first SAW resonator.
    Type: Grant
    Filed: September 22, 1998
    Date of Patent: September 18, 2001
    Assignee: Fujitsu Limited
    Inventors: Yoshio Satoh, Osamu Ikata, Tsutomu Miyashita, Takashi Matsuda, Mitsuo Takamatsu
  • Patent number: RE37790
    Abstract: A SAW filter includes a first SAW resonator having a pair of terminals and a predetermined resonance frequency (frp), the first SAW resonator being provided in a parallel arm of the SAW filter. A second SAW resonator has a pair of terminals and a predetermined resonance frequency (frs) approximately equal to a predetermined antiresonance frequency of the first SAW resonator (fap). The second SAW resonator is provided in a series arm of the SAW filter. An inductance element is connected in series to the first SAW resonator.
    Type: Grant
    Filed: May 20, 1999
    Date of Patent: July 16, 2002
    Assignee: Fujitsu Limited
    Inventors: Yoshio Satoh, Osamu Ikata, Tsutomu Miyashita, Takashi Matsuda, Mitsuo Takamatsu
  • Patent number: RE38002
    Abstract: This invention relates to a surface acoustic wave device and a production process thereof. An electrode is formed by alternately laminating a film of an aluminum alloy containing at least copper added thereto and a copper film on a piezoelectric substrate. While the particle size of the multi-layered electrode materials is kept small, the occurrence of voids in the film is prevented and life time of the surface acoustic wave device is elongated.
    Type: Grant
    Filed: January 14, 2000
    Date of Patent: February 25, 2003
    Assignee: Fujitsu Limited
    Inventors: Yoshio Satoh, Osamu Ikata, Hidema Uchishiba, Takashi Matsuda, Tokihiro Nishihara, Mitsuo Takamatsu, Hajime Taniguchi
  • Patent number: RE40036
    Abstract: A SAW filter includes a first SAW resonator having a pair of terminals and a predetermined resonance frequency (frp), the first SAW resonator being provided in a parallel arm of the SAW filter. A second SAW resonator has a pair of terminals and a predetermined resonance frequency (frs) approximately equal to a predetermined antiresonance frequency of the first SAW resonator (fap). The second SAW resonator is provided in a series arm of the SAW filter. An inductance element is connected in series to the first SAW resonator.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: January 29, 2008
    Assignee: Fujitsu Limited
    Inventors: Yoshio Satoh, Osamu Ikata, Tsutomu Miyashita, Takashi Matsuda, Mitsuo Takamatsu
  • Patent number: RE38278
    Abstract: This invention relates to a surface acoustic wave device and a production process thereof. An electrode is formed by alternately laminating a film of an aluminum alloy containing at least copper added thereto and a copper film on a piezoelectric substrate. While the particle size of the multi-layered electrode materials in kept small, the occurrence of voids in the film is prevented and life time of the surface acoustic wave device is elongated.
    Type: Grant
    Filed: April 5, 1999
    Date of Patent: October 21, 2003
    Assignee: Fujitsu Limited
    Inventors: Yoshio Satoh, Osamu Ikata, Hidema Uchishiba, Takashi Matsuda, Tokihiro Nishihara, Mitsuo Takamatsu, Hajime Taniguchi