Patents by Inventor Mitsuo Takamatsu
Mitsuo Takamatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 5631612Abstract: A SAW filter includes a first SAW resonator having a pair of terminals and a predetermined resonance frequency (f.sub.rp), the first SAW resonator being provided in a parallel arm of the SAW filter. A second SAW resonator has a pair of terminals and a predetermined resonance frequency (f.sub.rs) approximately equal to a predetermined antiresonance frequency of the first SAW resonator (f.sub.ap). The second SAW resonator is provided in a series arm of the SAW filter. An inductance element is connected in series to the first SAW resonator.Type: GrantFiled: January 6, 1995Date of Patent: May 20, 1997Assignee: Fujitsu LimitedInventors: Yoshio Satoh, Osamu Ikata, Tsutomu Miyashita, Takashi Matsuda, Mitsuo Takamatsu
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Patent number: 5559481Abstract: A SAW filter includes a first SAW resonator having a pair of terminals and a predetermined resonance frequency (f.sub.rp), the first SAW resonator being provided in a parallel arm of the SAW filter. A second SAW resonator has a pair of terminals and a predetermined resonance frequency (f.sub.rs) approximately equal to a predetermined antiresonance frequency of the first SAW resonator (f.sub.ap). The second SAW resonator is provided in a series arm of the SAW filter. An inductance element is connected in series to the first SAW resonator.Type: GrantFiled: October 23, 1992Date of Patent: September 24, 1996Assignee: Fujitsu LimitedInventors: Yoshio Satoh, Osamu Ikata, Tsutomu Miyashita, Takashi Matsuda, Mitsuo Takamatsu
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Patent number: 5300902Abstract: A surface acoustic wave device comprises a pair of multiple-electrode surface acoustic wave elements that are mirror-symmetrically arranged and disposed on a piezoelectric substrate. Each of the multiple-electrode surface acoustic wave elements comprises a plurality of input/output inter-digital transducers and connected inter-digital transducers. The number of the input/output inter-digital transducers is equal to or smaller by one, than the number of the connected inter-digital transducers, so that insertion loss of the surface acoustic wave device can be reduced without increasing the size of the device.Type: GrantFiled: March 13, 1992Date of Patent: April 5, 1994Assignee: Fujitsu LimitedInventors: Yoshio Satoh, Tsutomu Miyashita, Osamu Ikata, Mitsuo Takamatsu, Takashi Matsuda
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Patent number: 5281883Abstract: A surface acoustic wave device in which a surface acoustic wave device element is arranged with interdigital electrodes on a piezoelectric substrate is packaged in a package provided in a metal pattern. Metal bumps are formed on a bonding pad section of the surface wave device element and the metal bumps are contact connected with the metal pattern of the package.Type: GrantFiled: November 4, 1991Date of Patent: January 25, 1994Assignee: Fujitsu LimitedInventors: Osamu Ikata, Yoshio Satoh, Tsutomu Miyashita, Mitsuo Takamatsu, Takashi Matsuda
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Patent number: 5179310Abstract: A SAW device comprises a substrate, input and output interdigital electrodes provided on the substrate alternately to form a row of electrodes, and a pair of open strip reflectors disposed at both ends of the row, the input interdigital electrodes having a first pair number representing the number of pairs of opposing finger electrodes forming the input electrode, the output interdigital electrodes having a second pair number representing the number of pairs of opposing finger electrodes forming the output electrode, wherein the first pair number and second pair number are set different in the adjacent input and output electrodes with a predetermined ratio therebetween, the first pair number is changed in each input electrodes in the row, and the second pair number is changed in each output electrodes in the row.Type: GrantFiled: March 19, 1991Date of Patent: January 12, 1993Assignee: Fujitsu LimitedInventors: Yoshio Satoh, Osamu Ikata, Tsutomu Miyashita, Mitsuo Takamatsu, Takashi Matsuda
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Patent number: RE37375Abstract: A SAW filter includes a first SAW resonator having a pair of terminals and a predetermined resonance frequency (frp), the first SAW resonator being provided in a parallel arm of the SAW filter. A second SAW resonator has a pair of terminals and a predetermined resonance frequency (frs) approximately equal to a predetermined antiresonance frequency of the first SAW resonator (fap). The second SAW resonator is provided in a series arm of the SAW filter. An inductance element is connected in series to the first SAW resonator.Type: GrantFiled: September 22, 1998Date of Patent: September 18, 2001Assignee: Fujitsu LimitedInventors: Yoshio Satoh, Osamu Ikata, Tsutomu Miyashita, Takashi Matsuda, Mitsuo Takamatsu
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Patent number: RE37790Abstract: A SAW filter includes a first SAW resonator having a pair of terminals and a predetermined resonance frequency (frp), the first SAW resonator being provided in a parallel arm of the SAW filter. A second SAW resonator has a pair of terminals and a predetermined resonance frequency (frs) approximately equal to a predetermined antiresonance frequency of the first SAW resonator (fap). The second SAW resonator is provided in a series arm of the SAW filter. An inductance element is connected in series to the first SAW resonator.Type: GrantFiled: May 20, 1999Date of Patent: July 16, 2002Assignee: Fujitsu LimitedInventors: Yoshio Satoh, Osamu Ikata, Tsutomu Miyashita, Takashi Matsuda, Mitsuo Takamatsu
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Patent number: RE38002Abstract: This invention relates to a surface acoustic wave device and a production process thereof. An electrode is formed by alternately laminating a film of an aluminum alloy containing at least copper added thereto and a copper film on a piezoelectric substrate. While the particle size of the multi-layered electrode materials is kept small, the occurrence of voids in the film is prevented and life time of the surface acoustic wave device is elongated.Type: GrantFiled: January 14, 2000Date of Patent: February 25, 2003Assignee: Fujitsu LimitedInventors: Yoshio Satoh, Osamu Ikata, Hidema Uchishiba, Takashi Matsuda, Tokihiro Nishihara, Mitsuo Takamatsu, Hajime Taniguchi
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Patent number: RE40036Abstract: A SAW filter includes a first SAW resonator having a pair of terminals and a predetermined resonance frequency (frp), the first SAW resonator being provided in a parallel arm of the SAW filter. A second SAW resonator has a pair of terminals and a predetermined resonance frequency (frs) approximately equal to a predetermined antiresonance frequency of the first SAW resonator (fap). The second SAW resonator is provided in a series arm of the SAW filter. An inductance element is connected in series to the first SAW resonator.Type: GrantFiled: August 10, 2001Date of Patent: January 29, 2008Assignee: Fujitsu LimitedInventors: Yoshio Satoh, Osamu Ikata, Tsutomu Miyashita, Takashi Matsuda, Mitsuo Takamatsu
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Patent number: RE38278Abstract: This invention relates to a surface acoustic wave device and a production process thereof. An electrode is formed by alternately laminating a film of an aluminum alloy containing at least copper added thereto and a copper film on a piezoelectric substrate. While the particle size of the multi-layered electrode materials in kept small, the occurrence of voids in the film is prevented and life time of the surface acoustic wave device is elongated.Type: GrantFiled: April 5, 1999Date of Patent: October 21, 2003Assignee: Fujitsu LimitedInventors: Yoshio Satoh, Osamu Ikata, Hidema Uchishiba, Takashi Matsuda, Tokihiro Nishihara, Mitsuo Takamatsu, Hajime Taniguchi