Patents by Inventor Mitsuo Togawa

Mitsuo Togawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT BOARD PRODUCTION METHOD, CIRCUIT SHEET AND CIRCUIT BOARD
    Publication number: 20200163221
    Abstract: A circuit board production method, the method comprising a process of disposing a circuit sheet on a substrate, the circuit sheet comprising circuits and a resin portion disposed at spaces between the circuits.
    Type: Application
    Filed: April 10, 2017
    Publication date: May 21, 2020
    Inventors: Tomoo NISHIYAMA, Mitsuo TOGAWA, Yoshitaka TAKEZAWA, Yuki NAKAMURA, Kazuya KIGUCHI, Yasuo MIYAZAKI, Shinji AMANUMA
  • Epoxy resin composition for semiconductor sealing and resin molded type semiconductor device sealed with the epoxy resin composition
    Patent number: 6005030
    Abstract: An epoxy resin composition for semiconductor sealing, which comprises an epoxy resin, a curing agent and an inorganic filler, and has a J-value of 10 to 50, which is a maximum jetting flow value determined according to a method of evaluating jetting flow of epoxy resin composition.
    Type: Grant
    Filed: January 16, 1998
    Date of Patent: December 21, 1999
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Mitsuo Togawa, Kazuhiko Miyabayashi, Takahiro Horie, Naoki Nara