Abstract: A bonding apparatus for bonding a flexible member to a curved member in the atmosphere while preventing air bubbles from entering between the members includes a bonding stage for holding a first member with an inside surface facing up, a flexible carrier sheet for holding a second member with a bonding surface facing the inside surface of the first member, and a moveable bonding roller disposed above the carrier sheet. A control portion causes the bonding roller to move down so that the carrier sheet is depressed into a V-like shape, whereby a portion of the second member is bonded to the first member preceding the remaining portion of the second member, and thereafter, the bonding roller is caused to move along the curved shape of the first member to bond the remaining portion of the second member to the first member.

Abstract: A separation method allows a carrier substrate and a resin layer to be separated without, for example, breaking the resin layer for use in a final product, such that the resin layer can be rendered easy to handle thereafter. A protection step coats the surface of a resin layer with a protective film. A holding-by-suction step retains by suction the coated resin layer on a suction stage with a flat suction surface. After the back surface of the carrier substrate is supported at or near a first end by a support roller capable of moving from the first end to a second end of the carrier substrate, a peeling step lowers the first end of the carrier substrate while moving the support roller toward the second end, thereby peeling the carrier substrate from the resin layer while bending the carrier substrate at a portion supported by the support roller.

Abstract: A separation method allows a carrier substrate and a resin layer to be separated without, for example, breaking the resin layer for use in a final product, such that the resin layer can be rendered easy to handle thereafter. A protection step coats the surface of a resin layer with a protective film. A holding-by-suction step retains by suction the coated resin layer on a suction stage with a flat suction surface. After the back surface of the carrier substrate is supported at or near a first end by a support roller capable of moving from the first end to a second end of the carrier substrate, a peeling step lowers the first end of the carrier substrate while moving the support roller toward the second end, thereby peeling the carrier substrate from the resin layer while bending the carrier substrate at a portion supported by the support roller.

Abstract: A bonding apparatus for bonding a flexible member to a curved member in the atmosphere while preventing air bubbles from entering between the members includes a bonding stage for holding a first member with an inside surface facing up, a flexible carrier sheet for holding a second member with a bonding surface facing the inside surface of the first member, and a moveable bonding roller disposed above the carrier sheet. A control portion causes the bonding roller to move down so that the carrier sheet is depressed into a V-like shape, whereby a portion of the second member is bonded to the first member preceding the remaining portion of the second member, and thereafter, the bonding roller is caused to move along the curved shape of the first member to bond the remaining portion of the second member to the first member.

Abstract: The bonding apparatus 1 includes a leading end support part 10 that restricts a leading end 201 of the second plate-like member 200 from moving in an up and down direction, a trailing end support part 20 that restricts a trailing end 202 of the second plate-like member 200 from moving in an up and down direction, and an intermediate support part 40 that moves in the same direction as a bonding roller 30 while supporting the second plate-like member 200 at an intermediate point between the trailing end 202 and a bonding position P that is pressed by the bonding roller 30. When the bonding roller 30 is moving, the trailing end support part 20 keeps supporting the trailing end 202 at a lower position than the leading end 201, and the intermediate support part 40 keeps supporting the intermediate point of the second plate-like member 200 at a position lower than the leading end 201 but higher than the trailing end 202.

Abstract: The bonding apparatus 1 includes a leading end support part 10 that restricts a leading end 201 of the second plate-like member 200 from moving in an up and down direction, a trailing end support part 20 that restricts a trailing end 202 of the second plate-like member 200 from moving in an up and down direction, and an intermediate support part 40 that moves in the same direction as a bonding roller 30 while supporting the second plate-like member 200 at an intermediate point between the trailing end 202 and a bonding position P that is pressed by the bonding roller 30. When the bonding roller 30 is moving, the trailing end support part 20 keeps supporting the trailing end 202 at a lower position than the leading end 201, and the intermediate support part 40 keeps supporting the intermediate point of the second plate-like member 200 at a position lower than the leading end 201 but higher than the trailing end 202.

Abstract: A substrate cleaning apparatus of the present invention includes one sheet roll wound with one end of a polishing sheet that is arranged to be in contact with the surface of a liquid crystal panel, and the other sheet roll for rolling up the polishing sheet from the other end. The substrate cleaning apparatus further includes a rotating unit provided with a motor, a belt, and a rotation shaft for rotating the polishing sheet and the pair of sheet rolls with respect to the liquid crystal panel. Thus, the substrate cleaning apparatus can be provided which is capable of reducing an operation time required for removing foreign matters, enhancing operation efficiency, stably and reliably removing foreign matters, and restraining operation time even if the size of the substrate increases.

Abstract: A substrate cleaning apparatus of the present invention includes one sheet roll wound with one end of a polishing sheet that is arranged to be in contact with the surface of a liquid crystal panel, and the other sheet roll for rolling up the polishing sheet from the other end. The substrate cleaning apparatus further includes a rotating unit provided with a motor, a belt, and a rotation shaft for rotating the polishing sheet and the pair of sheet rolls with respect to the liquid crystal panel. Thus, the substrate cleaning apparatus can be provided which is capable of reducing an operation time required for removing foreign matters, enhancing operation efficiency, stably and reliably removing foreign matters, and restraining operation time even if the size of the substrate increases.