Patents by Inventor Mitsuori Yoshimi

Mitsuori Yoshimi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame with a support portion having a through hole over a heat dissipation plate, semiconductor device, and manufacturing method of lead frame
    Patent number: 11837530
    Abstract: A lead frame includes: a support portion having a through-hole formed in as end; a lead; and a heat dissipation plate welded with the support portion in one opening of the through-hole. A manufacturing method of a lead frame includes: shaping a frame member from a metal plate, the frame member including a support portion having a through-hole formed in an end, and a lead; and welding a heat dissipation plate with the support portion in one opening of the through hole.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: December 5, 2023
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Jun Izuoka, Koichi Ishida, Mitsuori Yoshimi
  • LEAD FRAME, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF LEAD FRAME
    Publication number: 20220173019
    Abstract: A lead frame includes: a support portion having a through-hole formed in as end; a lead; and a heat dissipation plate welded with the support portion in one opening of the through-hole. A manufacturing method of a lead frame includes: shaping a frame member from a metal plate, the frame member including a support portion having a through-hole formed in an end, and a lead; and welding a heat dissipation plate with the support portion in one opening of the through hole.
    Type: Application
    Filed: November 29, 2021
    Publication date: June 2, 2022
    Inventors: Jun Izuoka, Koichi Ishida, Mitsuori Yoshimi