Abstract: A plurality of electronic component chips (108) are stored in a space (109) defined in the interior of a case (111). The case is provided with an outlet (110) which communicates with the space for discharging the electronic component chips stored in the space. This outlet is closed by an openable closure. When the case is fixed to a hopper (102) included in an apparatus for supplying electronic component chips, the outlet is opened so that the electronic component chips are introduced into the hopper.

Abstract: To manufacture an electronic component of the present invention and according to a method of manufacturing the electronic component also of the invention, steps of positioning and temporarily fixing the electronic component element are performed by the use of a bent portion formed on the lead wire, the bent portion of the lead wire being pressed into the through hole of the electronic component element. Thereafter, the bonding agent, which was applied to the bent portion, is filled into the through hole of the electronic component element by capillarity. Alternatively, the bonding agent may be injected into the through hole after the lead wire is inserted. Thus, the bonding agent is filled in a shorter time.

Abstract: To manufacture an electronic component of the present invention and according to a method of manufacturing the electronic component also of the invention, steps of positioning and temporarily fixing the electronic component element are performed by the use of a bent portion formed on the lead wire, the bent portion of the lead wire being pressed into the through hole of the electronic component element. Thereafter, the bonding agent, which was applied to the bent portion, is filled into the through hole of the electronic component element by capillarity. Alternatively, the bonding agent may be injected into the through hole after the lead wire is inserted. Thus, the bonding agent is filled in a shorter time.

Abstract: A chip-like electronic component series retains a plurality of chip-like electronic components (2) distributed along a longitudinal direction of a tape (1). The tape (1) is formed with a plurality of cavities (5) distributed in its longitudinal direction, so that the chip-like electronic components are received in respective ones of the cavities. In order to retain the chip-like electronic components in the cavities, the cavities are covered by a cover sheet (3). Each of the cavities comprises a relatively flat receiving portion (7) having a bottom surface (6) extending along the longitudinal direction of the tape and a projecting receiving portion (8) projecting from a part of the bottom surface of the flat receiving portion. With such configuration, the cavities can retain at least two types of chip-like electronic components of different geometry or retain the chip-like electronic components at least in two types of conditions.

Abstract: An electronic component series (11) for feeding electronic components to an automatic inserting machine comprising a carrier band (12), a plurality of the parallel lead type electronic components (13) arranged on and distributed longitudinally of the carrier band (12), and an adhesive tape (17) bonded to the carrier band (12) with the lead wires of the electronic components held therebetween, the lead wires (15, 16) being cut off adjacent the end edge of the adhesive tape associated with the extremities of the lead wires (15, 16), and the extremities being removed.