Abstract: The present invention provides a casting method and cast product of spherical graphite cast iron, in which, even with a small modulus, there is no chill, the spherical graphite in the tissue is further made ultrafine, the dispersion of the particle diameter is small, and the number of the particles is several times that of the conventional one in the as cast state where heat treatment is not carried out. A casting method of a spherical graphite cast iron includes a melting process, a spheroidizing treatment process, an inoculation process, and a casting process, in which the original molten metal after the inoculation process is poured and filled up to a product space through a gate of a metal mold; where the original molten metal is controlled to a semi-solidification temperature range, before being filled up to the product space.

Abstract: An aluminum alloy additive manufacturing product and a method manufactures the same. The aluminum alloy additive manufacturing product is formed by molding a raw metal by an additive manufacturing method. The raw metal is made of an aluminum alloy. The aluminum alloy contains Fe and one or more of Mn and Cr. The Fe is an inevitable impurity of 0.3 weight % or less. The one or more of Mn and Cr have a total weight of 0.3 to 10 weight %. The aluminum alloy additive manufacturing product contains any one or more of an intermetallic compound and an aluminum alloy solid solution. The intermetallic compound contains two or more of Al, Mn, Fe, and Cr. One or more elements of Mn, Fe, and Cr are dissolved in the aluminum alloy solid solution.

Abstract: The present invention provides a casting method and cast product of spherical graphite cast iron, in which, even with a small modulus, there is no chill, the spherical graphite in the tissue is further made ultrafine, the dispersion of the particle diameter is small, and the number of the particles is several times that of the conventional one in the as cast state where heat treatment is not carried out. A casting method of a spherical graphite cast iron comprised from, a melting process, a spheroidizing treatment process, an inoculation process, and a casting process, in which the original molten metal after the inoculation process is poured and filled up to a product space through a gate of a metal mold; wherein the original molten metal before being filled up to the product space is controlled to a semi-solidification temperature range. An amount of nitrogen at the time of melting of the (cast iron?) is controlled to 0.9 ppm (mass) or less.

Abstract: The present invention provides a casting method and cast product of spherical graphite cast iron, in which, even with a small modulus, there is no chill, the spherical graphite in the tissue is further made ultrafine, the dispersion of the particle diameter is small, and the number of the particles is several times that of the conventional one in the as cast state where heat treatment is not carried out. A casting method of a spherical graphite cast iron comprised from, a melting process, a spheroidizing treatment process, an inoculation process, and a casting process, in which the original molten metal after the inoculation process is poured and filled up to a product space through a gate of a metal mold; wherein the original molten metal before being filled up to the product space is controlled to a semi-solidification temperature range. An amount of nitrogen at the time of melting of the (cast iron?) is controlled to 0.9 ppm (mass) or less.

Abstract: An aluminum alloy additive manufacturing product and a method manufactures the same. The aluminum alloy additive manufacturing product is formed by molding a raw metal by an additive manufacturing method. The raw metal is made of an aluminum alloy. The aluminum alloy contains Fe and one or more of Mn and Cr. The Fe is an inevitable impurity of 0.3 weight % or less. The one or more of Mn and Cr have a total weight of 0.3 to 10 weight %. The aluminum alloy additive manufacturing product contains any one or more of an intermetallic compound and an aluminum alloy solid solution. The intermetallic compound contains two or more of Al, Mn, Fe, and Cr. One or more elements of Mn, Fe, and Cr are dissolved in the aluminum alloy solid solution.

Abstract: A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.

Abstract: A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.

Abstract: A semiconductor device is provided in which the effect of the heat generated by a flip-chip mounted semiconductor on resin is suppressed. The semiconductor device includes: a substrate; a semiconductor chip which is mounted on the substrate with a front surface of the semiconductor chip facing downward; and a molding resin layer provided on a semiconductor chip-mounted surface of the substrate so as to be spaced apart from the semiconductor chip and to surround the semiconductor chip. In addition, the upper surface of the molding resin layer is positioned higher than the rear surface of the semiconductor chip.

Abstract: In a method for molding module electronic devices, an outer edge portion (24a?) of each of plural terminals (24) arranged on a base board (23) is subjected to press-deformation processing by a curved portion (30R) of an upper mold (30) to be shaped into a curved outer end portion (24a) when the upper mold (30) is caused to be in contact with a lower mold (31) for forming a molding space between the upper and lower molds (30:31) in which the base board (23) is positioned, then the molding space is filled with dissolved resin under a condition in which the curved portion (30R) of the upper mold (30) is in tight contact with the curved outer end portion (24a) of each of plural terminals (24), and finally the upper and lower molds (30;31) are separated from each other after the dissolved resin (36) in the molding space has solidified so that a module electronic device provided with the base board (23) on which the plural terminals (24) each having the curved outer end portion (24a) and a resin-molded portion (21;

Abstract: A method of shaping a semisolid metal comprising pouring a molten aluminum or magnesium alloy which contains a crystal grain refiner and which is superheated to less than 50° C. above a liquidus temperature of aluminum or magnesium, directly into a vessel without using a cooling jig, maintaining the alloy in the vessel for 30 seconds to 30 minutes as a resultant melt is cooled to a temperature where a specified liquid fraction is established such that a temperature of the poured alloy which is liquid and superheated to less than 10° C. above the liquidus temperature or which is partially solid, partially liquid and at a temperature of less than 5° C. below the liquidus temperature decreases from an initial level and passes through a temperature zone 5° C. below the liquidus temperature within at least 10 minutes, whereby fine primary crystals are generated in the alloy, recovering the alloy from the vessel, supplying the alloy into a mold, and shaping the alloy under pressure.

Abstract: In a method for molding module electronic devices, an outer edge portion (24a?) of each of plural terminals (24) arranged on a base board (23) is subjected to press-deformation processing by a curved portion (30R) of an upper mold (30) to be shaped into a curved outer end portion (24a) when the upper mold (30) is caused to be in contact with a lower mold (31) for forming a molding space between the upper and lower molds (30:31) in which the base board (23) is positioned, then the molding space is filled with dissolved resin under a condition in which the curved portion (30R) of the upper mold (30) is in tight contact with the curved outer end portion (24a) of each of plural terminals (24), and finally the upper and lower molds (30;31) are separated from each other after the dissolved resin (36) in the molding space has solidified so that a module electronic device provided with the base board (23) on which the plural terminals (24) each having the curved outer end portion (24a) and a resin-molded portion (21;

Abstract: In a method for molding module electronic devices, an outer edge portion (24a?) of each of plural terminals (24) arranged on a base board (23) is subjected to press-deformation processing by a curved portion (30R) of an upper mold (30) to be shaped into a curved outer end portion (24a) when the upper mold (30) is caused to be in contact with a lower mold (31) for forming a molding space between the upper and lower molds (30:31) in which the base board (23) is positioned, then the molding space is filled with dissolved resin under a condition in which the curved portion (30R) of the upper mold (30) is in tight contact with the curved outer end portion (24a) of each of plural terminals (24), and finally the upper and lower molds (30;31) are separated from each other after the dissolved resin (36) in the molding space has solidified so that a module electronic device provided with the base board (23) on which the plural terminals (24) each having the curved outer end portion (24a) and a resin-molded portion (21;

Abstract: In a method for molding module electronic devices, an outer edge portion (24a?) of each of plural terminals (24) arranged on a base board (23) is subjected to press-deformation processing by a curved portion (30R) of an upper mold (30) to be shaped into a curved outer end portion (24a) when the upper mold (30) is caused to be in contact with a lower mold (31) for forming a molding space between the upper and lower molds (30:31) in which the base board (23) is positioned, then the molding space is filled with dissolved resin under a condition in which the curved portion (30R) of the upper mold (30) is in tight contact with the curved outer end portion (24a) of each of plural terminals (24), and finally the upper and lower molds (30;31) are separated from each other after the dissolved resin (36) in the molding space has solidified so that a module electronic device provided with the base board (23) on which the plural terminals (24) each having the curved outer end portion (24a) and a resin-molded portion (21;

Abstract: A method of shaping a semisolid metal comprising pouring a molten aluminum or magnesium alloy which contains a crystal grain refiner and which is superheated to less than 50° C. above a liquidus temperature of aluminum or magnesium, directly into a vessel without using a cooling jig, maintaining the alloy in the vessel for 30 seconds to 30 minutes as a resultant melt is cooled to a temperature where a specified liquid fraction is established such that a temperature of the poured alloy which is liquid and superheated to less than 10° C. above the liquidus temperature or which is partially solid, partially liquid and at a temperature of less than 5° C. below the liquidus temperature decreases from an initial level and passes through a temperature zone 5° C. below the liquidus temperature within at least 10 minutes, whereby fine primary crystals are generated in the alloy, recovering the alloy from the vessel, supplying the alloy into a mold, and shaping the alloy under pressure.

Abstract: In a method for molding module electronic devices, an outer edge portion (24a?) of each of plural terminals (24) arranged on a base board (23) is subjected to press-deformation processing by a curved portion (30R) of an upper mold (30) to be shaped into a curved outer end portion (24a) when the upper mold (30) is caused to be in contact with a lower mold (31) for forming a molding space between the upper and lower molds (30:31) in which the base board (23) is positioned, then the molding space is filled with dissolved resin under a condition in which the curved portion (30R) of the upper mold (30) is in tight contact with the curved outer end portion (24a) of each of plural terminals (24), and finally the upper and lower molds (30;31) are separated from each other after the dissolved resin (36) in the molding space has solidified so that a module electronic device provided with the base board (23) on which the plural terminals (24) each having the curved outer end portion (24a) and a resin-molded portion (21;

Abstract: A method of shaping a semisolid metal to provide shaped parts which are produced in a convenient, easy and inexpensive manner, without relying upon the conventional mechanical or electromagnetic agitation. The method includes feeding, without using a cooling jig, into an insulating vessel, a molten alloy containing an element for promoting generation of crystal nuclei and being held to be superheated to less than 100° C. above a liquidus temperature of the alloy; maintaining the molten alloy in the insulating vessel for 5 seconds to 60 minutes as the alloy is cooled at a cooling rate of 0.01° C./s to 3.0° C./s thereby crystallizing fine primary spherical crystals in an alloy solution containing a specified liquid fraction; and feeding the alloy solution into a forming mold for shaping the alloy under pressure.

Abstract: A method of shaping a semisolid metal to provide shaped parts which are produced in a convenient, easy and inexpensive manner, without relying upon the conventional mechanical or electromagnetic agitation. The method includes feeding, without using a cooling jig, into an insulating vessel, a molten alloy containing an element for promoting generation of crystal nuclei and being held to be superheated to less than 100° C. above a liquidus temperature of the alloy; maintaining the molten alloy in the insulating vessel for 5 seconds to 60 minutes as the alloy is cooled at a cooling rate of 0.01° C./s to 3.0° C./s thereby crystallizing fine primary spherical crystals in an alloy solution containing a specified liquid fraction; and feeding the alloy solution into a forming mold for shaping the alloy under pressure.

Abstract: A method and apparatus for the semisolid forming of alloys to enable shaped parts having a fine-grained, spherical thixotropic structure to be produced in a convenient, easy and inexpensive manner without relying upon the conventional mechanical or electromagnetic agitation. In the method, a molten alloy having crystal nuclei at a temperature not lower than the liquidus temperature or a partially solid, partially molten alloy having crystal nuclei at a temperature not lower than a molding temperature is fed into an insulated vessel and is maintained in the insulated vessel for 5 seconds to 60 minutes as it is cooled to the molding temperature where a specified liquid fraction is established, thereby crystallizing fine primary crystals in the alloy solution, and the alloy is fed into a forming mold, where it is shaped under pressure.

Abstract: In a method for molding module electronic devices, an outer edge portion (24a′) of each of plural terminals (24) arranged on a base board (23) is subjected to press-deformation processing by a curved portion (30R) of an upper mold (30) to be shaped into a curved outer end portion (24a) when the upper mold (30) is caused to be in contact with a lower mold (31) for forming a molding space between the upper and lower molds (30:31) in which the base board (23) is positioned, then the molding space is filled with dissolved resin under a condition in which the curved portion (30R) of the upper mold (30) is in tight contact with the curved outer end portion (24a) of each of plural terminals (24), and finally the upper and lower molds (30;31) are separated from each other after the dissolved resin (36) in the molding space has solidified so that a module electronic device provided with the base board (23) on which the plural terminals (24) each having the curved outer end portion (24a) and a resin-molded portio

Abstract: An improved apparatus for producing a semisolid shaping metal that has fine primary crystals dispersed in the liquid phase and which also has a uniform temperature distribution comprises a melt pouring section comprising a melting furnace which melts and holds a metal and a pouring device which lifts out the molten metal from said melting furnace, adjusts it to a specified temperature and pours it into a holding vessel, a nucleating section which generates crystal nuclei in the melt as it is supplied from said pouring device into said holding vessel, a crystal generating section which performs temperature adjustment such that the metal obtained from said nucleating section falls within a desired molding temperature range as it is cooled to a molding temperature at which it is partially solid, partially liquid, a holding vessel heating section which adjusts the temperature of the holding vessel when it is empty, a holding vessel conditioning section which inverts the holding vessel so that a partially molten m