Patents by Inventor Mitsuru Doi

Mitsuru Doi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180162100
    Abstract: An adhesive for laminating a metal foil to a resin film, the adhesive including: a polyol (A); a multimer of a polyisocyanate (B); and a metal compound (C) being a compound of at least one metal of Groups 7 and 12, wherein the multimer of a polyisocyanate (B) includes a multimer of a saturated aliphatic polyisocyanate (b1) and a multimer of a saturated alicyclic polyisocyanate (b2).
    Type: Application
    Filed: May 17, 2016
    Publication date: June 14, 2018
    Applicant: SHOWA DENKO K.K.
    Inventors: Kazunari FUKASE, Hiroto KOUKA, Yasuhiro NAKAGAWA, Mitsuru DOI
  • Publication number: 20170207427
    Abstract: There are provided an adhesive for laminating a metal foil to a resin film and the like, the adhesive comprising: a polyurethane polyol (A); and a saturated aliphatic and/or saturated alicyclic polyisocyanate (B), wherein the polyurethane polyol (A) is obtained by polyaddition of components comprising a chain polyolefin polyol (a1) and/or a polyester polyol (a2) having a constituent unit derived from a hydrogenated dimer acid and a constituent unit derived from a hydrogenated dimer diol, a hydroxylated hydrocarbon compound (b) having a saturated or unsaturated cyclic hydrocarbon structure and two or more hydroxy groups, and a polyisocyanate (c).
    Type: Application
    Filed: May 25, 2015
    Publication date: July 20, 2017
    Applicant: SHOWA DENKO K.K.
    Inventors: Hiroto KOUKA, Kazunari FUKASE, Naoki MURATA, Hui LI, Yasuhiro NAKAGAWA, Mitsuru DOI
  • Publication number: 20170095998
    Abstract: The present invention provides a heat-shrinkable multilayer film that has excellent wear resistance and that suffers less from static electricity generation and surface stickiness. Also provided are a method for manufacturing the heat-shrinkable multilayer film and a heat-shrinkable label formed using the heat-shrinkable multilayer film. The present invention is directed to a heat-shrinkable multilayer film including, in order: a wear-resistant layer (A) containing a polyester resin (a), a (meth)acrylic resin, a hydrocarbon wax, and an antistatic agent; a front layer (B) containing a polyester resin (b); an intermediate layer (C) containing a polystyrene resin; and a back layer (D) containing a polyester resin (d), the wear-resistant layer (A) containing the hydrocarbon wax in an amount of 1 to 60 parts by weight and the antistatic agent in an amount of 0.1 to 10.0 parts by weight, per 100 parts by weight of the total of the polyester resin (a) and the (meth)acrylic resin.
    Type: Application
    Filed: May 20, 2015
    Publication date: April 6, 2017
    Inventors: Ayumu NAKAHARA, Takanori NOZAKI, Yoshikatsu YASUI, Mitsuru DOI
  • Publication number: 20130237629
    Abstract: The present invention is a curable resin composition comprising a copolymer (A) represented by the following general formula (1), silica fine particles (B), a reactive monomer (C) and a polymerization initiator (D). In the general formula (1), X is an atomic group formed by removing “k” mercapto groups from a multifunctional thiol compound having at least “k” mercapto groups; Y is a monovalent organic group derived from a copolymer formed by copolymerizing unsaturated monomers; and “k” is an integer of 3 to 10. The present invention can provide a hard coat agent which has low curing shrinkage and which has both low curing shrinkage and antiblocking properties as needed; a hard coat film and a hard-coat treated plastic substrate having high pencil hardness and low curling properties, by using this hard coat agent.
    Type: Application
    Filed: November 8, 2011
    Publication date: September 12, 2013
    Applicant: SHOWA DENKO K.K.
    Inventors: Mitsuru Doi, Yoshikatsu Yasui, Nobuaki Ishii, Isao Ohtake, Katsuro Urakawa, Hiroko Oi, Yotaro Hattori
  • Publication number: 20100295533
    Abstract: According to a reception passive intermodulation measurement method of the present invention, a device under test is set to the mismatching condition, and a standing wave is generated on a transmission line where the sample is connected. Since the tip of the transmission line is short-circuited using the sample, the sample is positioned at the anti-node of the standing wave, and test signals are applied at a high current density. System noise is calibrated with the tip of the transmission line being open. Since impedance matching is not required and terminators are not employed, a large measurement dynamic range is obtained without being affected by passive intermodulation that is generated in terminators. The sample is very small, and an arbitrary shape can be selected. The property measurement is enabled for a wide range of materials, regardless of a conductive material, an insulating material and a magnetic material.
    Type: Application
    Filed: February 23, 2007
    Publication date: November 25, 2010
    Applicant: YOKOHAMA NATIONAL UNIVERSITY
    Inventors: Nobuhiro Kuga, Yasuyuki Yamamoto, Mitsuru Doi, Atsunori Endo