Abstract: An analysis method of designing transmission lines of an integrated circuit packaging board including an integrated circuit chip, a printed circuit board, and an interposer disposed between the integrated circuit chip and the printed circuit board. A reference data file having information for dividing a series of transmission lines into connecting sections and/or continuous sections and a division model file having information on analysis models of a connecting section and a continuous section is prepared. The connecting sections are extracted from the series of transmission lines with reference to connection information. Boundaries for dividing the series of transmission lines into sections is determined with reference to the reference data file to generate division models. The division models are synthesized to form a synthesized model of the series of transmission lines to analyze electrical characteristics of the series of transmission lines.

Abstract: An analysis method of designing transmission lines of an integrated circuit packaging board including an integrated circuit chip, a printed circuit board, and an interposer disposed between the integrated circuit chip and the printed circuit board. A reference data file having information for dividing a series of transmission lines into connecting sections and/or continuous sections and a division model file having information on analysis models of a connecting section and a continuous section is prepared. The connecting sections are extracted from the series of transmission lines with reference to connection information. Boundaries for dividing the series of transmission lines into sections is determined with reference to the reference data file to generate division models. The division models are synthesized to form a synthesized model of the series of transmission lines to analyze electrical characteristics of the series of transmission lines.

Abstract: A magnetic member 2 for nonreciprocal circuit is fitted in a first hole formed in a dielectric substrate 1 and at least one magnetic member 3 is fitted in a second hole formed in a portion of the dielectric substrate 1, which surrounds the first hole. An electrical conductor is printed on surfaces of the dielectric substrate 1 and the magnetic member 2 for nonreciprocal circuit to form a micro strip line 4. A grounding conductor 5 is formed on the other surface of the dielectric substrate 1. Changing the magnetization of the magnetic member 3 for frequency regulation can reversibly perform a regulation of the frequency characteristics of the nonreciprocal circuit.

Abstract: Holes are formed in a ceramic substrate before sintering, magnetic parts and dielectric parts are fitted in the holes and the substrate is sintered at a temperature equal to or lower than the sintering temperature of the magnetic parts. It is possible to obtain a very compact high frequency integrated circuit, particularly, a micro wave integrated circuit which can be utilized in a frequency band of several tens GHz, by using hard ferrite as a material of the magnetic parts and magnetizing them after the sintering.

Abstract: A magnetic member 2 for nonreciprocal circuit is fitted in a first hole formed in a dielectric substrate 1 and at least one magnetic member 3 is fitted in a second hole formed in a portion of the dielectric substrate 1, which surrounds the first hole. An electrical conductor is printed on surfaces of the dielectric substrate 1 and the magnetic member 2 for nonreciprocal circuit to form a micro strip line 4. A grounding conductor 5 is formed on the other surface of the dielectric substrate 1. Changing the magnetization of the magnetic member 3 for frequency regulation can reversibly perform a regulation of the frequency characteristics of the nonreciprocal circuit.

Abstract: The present invention provides a high frequency dielectric filter which can realize high stability, the least loss of functionality, and mass-productiveness. In a high frequency dielectric filter adopting a TM mode, a resonator fixing plate 3 is used for fixing a dielectric resonator 2 and a case 1 and hence, they are firmly fixed both in the longitudinal direction and the lateral direction of the resonator. Accordingly, a high frequency dielectric filter which is stable against vibration and impact is provided.

Abstract: A magnetic member 2 for nonreciprocal circuit is fitted in a first hole formed in a dielectric substrate 1 and at least one magnetic member 3 is fitted in a second hole formed in a portion of the dielectric substrate 1, which surrounds the first hole. An electrical conductor is printed on surfaces of the dielectric substrate 1 and the magnetic member 2 for nonreciprocal circuit to form a micro strip line 4. A grounding conductor 5 is formed on the other surface of the dielectric substrate 1. Changing the magnetization of the magnetic member 3 for frequency regulation can reversibly perform a regulation of the frequency characteristics of the nonreciprocal circuit.

Abstract: Dielectric parts 12 which become resonators are fitted in holes formed in a dielectric substrate 11 and magnetic parts 13 for setting resonance frequencies of the dielectric parts 12 are also fitted in holes formed in the dielectric substrate 11. With such construction in which the dielectric parts are fitted in the holes of the dielectric substrate, the physical preciseness of a high frequency filter is improved. Further, by fitting not only the dielectric parts 12 but also the magnetic parts 13 in the holes of the dielectric substrate 11, it is possible to form the high frequency filter operating in a frequency band of several tens GHz as a micro wave integrated circuit to thereby improve the uniformality and mass-producibility of the high frequency filter.

Abstract: A Ni--Zn base ferrite is provided with a relatively small dielectric loss (tan.delta.(.epsilon.)) of the order of 10.sup.-3. Its saturation magnetization (4.pi.Ms) is relatively still high. A Ni--Zn base ferrite having a small dielectric loss (of the order of 10.sup.-3) can be obtained by proportioning raw materials to give a finished composition range of Ni.sub.X Zn.sub.1-X Fe.sub.2-Y-Z Mn.sub.Y M.sub.Z O.sub.4 where M: Ge and/or Sn, 0.55.ltoreq.X.ltoreq.1.00, 0.001.ltoreq.Y.ltoreq.0.36, and 0.002.ltoreq.Z.ltoreq.0.36, by calcination.

Abstract: A ceramic composition is herein disclosed, which is a lead-type perovskite compound capable of being subjected to low temperature-sintering among ceramic compositions for use in making capacitors, which has a high dielectric constant at room temperature of not less than 10000, a low temperature-dependency of the dielectric constant and a low decrease in capacitance upon application of a DC bias and which comprises, as a main constituent, a ternary system comprising lead magnesium niobate: [Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3 ], lead nickel niobate: [Pb(Ni.sub.1/3 Nb.sub.2/3)O.sub.3 ] and lead titanate: [PbTiO.sub.3 ] in which part of the Pb.sup.2+ ions present in the ternary system are substituted with a desired amount of Sr.sup.2+ ions, Ba.sup.2+ ions or Ca.sup.2+ ions.

Abstract: A ceramic composition is herein disclosed, which is a lead-type perovskite compound capable of being subjected to low temperature-sintering among ceramic compositions for use in making capacitors, which has a high dielectric constant, low temperature-dependency thereof and a low decrease in capacitance upon application of a DC bias and which comprises a ternary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3), lead nickel niobate (Pb(Ni.sub.1/3 Nb.sub.2/3)O.sub.3) and lead titanate (PbTiO.sub.3).sub.z or a ternary system comprising lead magnesium tungstate (Pb(Mg.sub.1/2 W.sub.1/2)O.sub.3) lead titanate (PbTiO.sub.3) and lead nickel niobate (Pb(Ni.sub.1/3 Nb.sub.2/3)O.sub.3) and a desired amount of lanthanum manganese niobate La(Mn.sub.2/3 Nb.sub.1/3)O.sub.3) incorporated into the ternary system or a predetermined amount of La.sup.3+ or Ca.sup.2+ ions with which the Pb.sup.2+ ions present in the ternary system are substituted.