Abstract: In order to set with a high precision the value of rush current flowing in the power switch circuit at the time of turning “on” the power, the internal circuit Int_Cir of the LSI is supplied with the internal source voltage Vint from the output transistor MP1 of the regulator VReg of the power switch circuit PSWC. The power switch circuit PSWC includes a control circuit CNTRLR and a start-up circuit STC. During the initial period Tint following the turning “on” of the power supply, the start-up circuit STC controls the output transistor MP1 and reduces the primary rush current so that the output current Isup of the output transistor MP1 may represent an approximately constant increment as the time passes. The difference ?V between the internal current voltage due to the charge of load capacitance C with the output current Isup controlled by the start-up circuit STC and the current voltage Vint from the regulator VReg is set within the predetermined limit to reduce the secondary rush current.

Abstract: An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.

Abstract: A difference between both emitter voltages of a first transistor having an emitter through which a first current flows, and at least one second transistor having an emitter through which such a second current as to reach a current density thereof smaller than that of the emitter of the first transistor flows, is applied across a first resistor. A second resistor is provided between the emitter of the second transistor and a circuit's ground potential. A third resistor and a fourth resistor are respectively provided between collectors of the first and second transistors and a power supply voltage. Such an output voltage that a collector voltage of the first transistor and a collector voltage of the second transistor become equal is formed in response to the collector voltage of the first transistor and the collector voltage of the second transistor and supplied to bases of the first and second transistors in common.

Abstract: A semiconductor integrated circuit device with reduced consumption current is provided. A first step-down circuit stationarily forms internal voltage lower than supply voltage supplied through an external terminal. A second step-down circuit is switched between first mode and second mode according to control signals. In first mode, the internal voltage is formed from the supply voltage supplied through the external terminal and is outputted through a second output terminal. In second mode, operating current for a control system that forms the internal voltage is interrupted and an output high impedance state is established. The first output terminal of the first step-down circuit and the second output terminal of the second step-down circuit are connected in common, and the internal voltage is supplied to internal circuits.

Abstract: An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.

Abstract: This invention provides a storage medium on which there is stored a cell library to design a semiconductor integrated circuit to satisfy low power consumption and high speed operation and a design method using the cell library. The cell library is registered with at least two kinds of cells which are different in delay and power consumption while having the same function and the same shape. To satisfy the specification of the semiconductor integrated circuit, one cell is selected from at least two kinds of cells of the cell library.

Abstract: In view of controlling overshoot when the power supply is inputted without increase in the area occupied with a chip in a voltage generating circuit mounted over a semiconductor integrated circuit, an internal voltage generating circuit comprises a voltage generating circuit for generating a second voltage from a first voltage supplied from outside, and an output buffer for generating a third voltage corresponding to the second voltage. The third voltage is used as the operation power supply of the internal circuit. Moreover, a first switch for enabling an output node of the second voltage to become conductive to the predetermined potential and a control circuit for turning ON the first switch for the predetermined period in response to input of the first voltage are also provided. An output terminal of the output buffer is not clamped but an output of the voltage generating circuit in the preceding stage is clamped to the predetermined voltage.

Abstract: The present invention provides a semiconductor device capable of realizing power saving and improvement in reliability or reduction in area. A semiconductor device includes: a power switch connecting an internal power supply in which power is not shut down and an internal power supply in which power is shut down; and an internal voltage determining circuit for determining voltage of the internal power supply in which power is shut down. Voltage of the internal power supply in which power is shut down is generated from voltage of an external power supply by using a regulator circuit. When the power of the internal power supply is interrupted, the power switch is turned off, the regulator circuit is turned off, and an output of the regulator circuit is shorted to a ground potential.

Abstract: A difference between both emitter voltages of a first transistor having an emitter through which a first current flows, and at least one second transistor having an emitter through which such a second current as to reach a current density thereof smaller than that of the emitter of the first transistor flows, is applied across a first resistor. A second resistor is provided between the emitter of the second transistor and a circuit's ground potential. A third resistor and a fourth resistor are respectively provided between collectors of the first and second transistors and a power supply voltage. Such an output voltage that a collector voltage of the first transistor and a collector voltage of the second transistor become equal is formed in response to the collector voltage of the first transistor and the collector voltage of the second transistor and supplied to bases of the first and second transistors in common.

Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.

Abstract: There is provided a semiconductor integrated circuit that hardly causes an unnecessary operation time for variable control over an operating frequency and an internal power supply voltage. A CPU specifies an operational clock signal frequency to a clock generation circuit and an internal power supply voltage to a power supply circuit. The power supply circuit comprises a voltage regulator and a determination circuit to determine a transition state to a specified internal power supply voltage. The CPU uses a first signal to notify which time point the power supply voltage variable control start to the power supply circuit. The power supply circuit returns a second signal to the CPU to notify at which time point the power supply voltage variable control terminated.

Abstract: A data processor apparatus having first and second instruction storages for holding a series of instructions to be executed reiteratively. The number of instructions is calculated based on the difference between a start address and an end address respectively stored in a start address register and an end address register. When the number of instructions constituting the series of instructions is less than the capacity of the second instruction storage, the series of instructions is read from the second instruction storage and executed. When the number of instructions is greater than the capacity of the second instruction storage, the series of instructions is read from the first instruction storage.

Abstract: In a liquid crystal drive controller formed as a semiconductor integrated circuit having therein a power source circuit including a boosting circuit and driving a source line and a gate line of a TFT liquid crystal panel, the number of external capacitive elements and the number of external terminals for connecting the external capacitive elements are reduced, thereby reducing the size and cost of the chip and an electronic device on which the chip is mounted. As a boosting circuit for generating a voltage for driving a source line of the TFT liquid crystal panel in the liquid crystal controller having therein the power source including the boosting circuit, a boosting circuit having an external capacitive element is used. On the other hand, as a boosting circuit for generating a voltage for driving a gate line, a charge pump having a built-in (on-chip) capacitive element is used.

Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.

Abstract: In a semiconductor integrated circuit device, having a pair of voltage step-down power supply circuits for active and standby conditions, a first reference voltage is formed by amplifying a fixed voltage formed in a fixed voltage generating circuit with an amplifying circuit which can adjust the voltage gain having a resistance circuit and a switch controlled with a first trimming switch setting signal. An internal step-down voltage, when the internal circuit is in the active condition, is outputted from a first output buffer, which is activated with a first control signal. A second reference voltage is formed by adjusting a combination of threshold voltages of MOSFETs and a switch controlled with a second trimming switch setting signal; and, an internal step-down voltage, when the internal circuit is in the standby condition, is outputted with a second output buffer, which is activated with a second control signal.

Abstract: To improve the efficiency for repairing a defect of an LS1, a semiconductor integrated circuit device is provided which includes a central processing unit, an electrically reprogrammable nonvolatile memory and a volatile memory, sharing a data bus, which utilizes stored information of the nonvolatile memory to repair a defect of the volatile memory. The volatile memory includes a volatile storage circuit for latching the repair information for repairing a defective normal memory cell with a redundancy memory cell. The nonvolatile memory reads out the repair information from itself in response to an instruction initialization, and the volatile storage circuit latches the repair information. A fuse program circuit is not needed for the detect repair, and a defect which occurs after a burn-in can be newly repaired so that the new defect can be repaired even after packaging.

Abstract: In a MOS circuit comprising a plurality of MOSFETs constituting a digital circuit, an input signal is supplied to the digital circuit, and a first back bias voltage is supplied to a semiconductor substrate or a semiconductor well region in which the MOSFETs are formed, so that a pn junction between the semiconductor substrate or the semiconductor well region and a source region is brought to a forward voltage. In a non-operating state in which a circuit operation is suspended by the input signal supplied to the digital circuit as a fixed level, a second back bias voltage is applied to the semiconductor substrate or the semiconductor well region so that the pn junction between the semiconductor substrate or the semiconductor well region and the source region is brought to a reverse voltage.

Abstract: To improve the efficiency for repairing a defect of an LSI, a semiconductor integrated circuit device is provided which includes a central processing unit, an electrically reprogrammable nonvolatile memory and a volatile memory, sharing a data bus, which utilizes stored information of the nonvolatile memory to repair a defect of the volatile memory. The volatile memory includes a volatile storage circuit for latching the repair information for repairing a defective normal memory cell with a redundancy memory cell. The nonvolatile memory reads out the repair information from itself in response to an instruction initialization, and the volatile storage circuit latches the repair information. A fuse program circuit is not needed for the detect repair, and a defect which occurs after a burn-in can be newly repaired so that the new defect can be repaired even after packaging.

Abstract: A semiconductor integrated circuit device with reduced consumption current is provided. A first step-down circuit stationarily forms internal voltage lower than supply voltage supplied through an external terminal. A second step-down circuit is switched between first mode and second mode according to control signals. In first mode, the internal voltage is formed from the supply voltage supplied through the external terminal and is outputted through a second output terminal. In second mode, operating current for a control system that forms the internal voltage is interrupted and an output high impedance state is established. The first output terminal of the first step-down circuit and the second output terminal of the second step-down circuit are connected in common, and the internal voltage is supplied to internal circuits.

Abstract: A data processing system (1) has an erasable and programmable non-volatile memory (5) and a central processing unit (2). The central processing unit allows only a specified partial storage area (20Ba) of the non-volatile memory to be intended for a software ECC process. Since ECC codes are added to the partial storage area alone and an error correction is made thereto to thereby increase the number of rewrite assurances, substantially needless waste of each storage area by ECC codes can b avoided as compared with a configuration in which the ECC codes are added to all the write data without distinction regardless of the storage areas. Further, since software copes with ECC processing, ECC correcting capability matched with a device characteristic of the non-volatile memory can easily be selected.