Patents by Inventor Mitsuru Hirano

Mitsuru Hirano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Alumina multilayer wiring substrate provided with high dielectric material layer
    Patent number: 5099388
    Abstract: An alumina multilayer wiring substrate having a high dielectric, low inductance capacitor in the substrate on which a VLSI is to be mounted to effectively eliminate electrical noise(s) which may hinder the operation of the VLSI at high speed (frequency) is provided.
    Type: Grant
    Filed: June 15, 1990
    Date of Patent: March 24, 1992
    Assignees: NGK Spark Plug Co., Ltd., NGK Spark Plugs (U.S.A.), Inc., Intel Corporation
    Inventors: Masahiro Ogawa, Kozo Yamasaki, Mitsuru Hirano, Michael A. Schmitt, Bidyut K. Bhattacharyya
  • Multiple resistivity wiring apparatus
    Patent number: 5060049
    Abstract: A ceramic multilayer wiring substrate is provided on which the metallized wirings are partially altered to provide multiple resistivities without changing the other electrical properties associated with a particular physical wiring geometry. Sequentially positioning conductive materials of different resistivities along the length of each individual wiring produces a final wiring pattern where each individual wiring can have a different resistance from the other wirings. A multiple resistivity wiring pattern can maximize the operation of a semiconductor chip attached thereto, for example, by reducing the effect of electronic noise on the semiconductor.
    Type: Grant
    Filed: July 18, 1990
    Date of Patent: October 22, 1991
    Assignees: NGK Spark Plug Co., Ltd., NGK Spark Plugs (U.S.A.), Inc., Intel Corporation
    Inventors: Kozo Yamasaki, Kouichi Mouri, Naomiki Kato, Mitsuru Hirano, Michael A. Schmitt, Bidyut Bhattacharyya