Abstract: Provided is a display device which has improved heat dissipation efficiency. A display device according to the present invention is provided with a display unit, a circuit board which is positioned in the rear of the display unit, a heat dissipation member which is positioned in the rear of the circuit board and is capable of dissipating the heat of the circuit board, and a case body which contains at least the heat dissipation member. The heat dissipation member has a plurality of heat dissipation pieces which protrude to the outside of the case body through an opening that is provided in the case body, and which extend in the vertical direction, and the opening has an inclined surface, which is inclined upwardly, in a portion that faces the top of each heat dissipation piece.

Abstract: Provided is a display device which has improved heat dissipation efficiency. A display device according to the present invention is provided with a display unit, a circuit board which is positioned in the rear of the display unit, a heat dissipation member which is positioned in the rear of the circuit board and is capable of dissipating the heat of the circuit board, and a case body which contains at least the heat dissipation member. The heat dissipation member has a plurality of heat dissipation pieces which protrude to the outside of the case body through an opening that is provided in the case body, and which extend in the vertical direction, and the opening has an inclined surface, which is inclined upwardly, in a portion that faces the top of each heat dissipation piece.

Abstract: Provided are a heat dissipating structure with which stress on an electronic unit that generates heat can be reduced, and a display device comprising the same. The heat dissipating structure comprises: at least two electronic units, e.g. electronic units, that are provided on a circuit hoard, differ from one another in height from the circuit board, and generate heat; a dissipating member for dissipating heat generated from the electronic units; and heat conducting members that are sandwiched between the electronic units and the heat dissipating member so as to conduct heat, wherein the heat conducting members provided between the electronic units and the heat dissipating member have the same thickness.