Patents by Inventor Mitsuru Ito
Mitsuru Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240111366Abstract: An information processing apparatus comprises a processor configured to execute a program so as to: acquire viewpoint information, motion information and object information; process an object image wherein: the object image is an image representing a virtual substance and is updated based on the viewpoint information and the motion information; calculate a position when superimposing a background image and the object image, wherein: the background image is an image according to the field of view of the user; generate visual information superimposing the background image and the object image based on the position calculated, and output the generated visual information to a display device; and generate tactile information for an ultrasound generator irradiating the user with ultrasound corresponding to the object based on the position calculated, the motion information and the object information, and output the generated tactile information to the ultrasound generator.Type: ApplicationFiled: December 8, 2022Publication date: April 4, 2024Inventors: Mamoru MIYAWAKI, Hiroyuki SHINODA, Takaaki KAMIGAKI, Mitsuru ITO, Tao MORISAKI, Shun SUZUKI, Atsushi MATSUBAYASHI, Ryoya ONISHI, Yasutoshi MAKINO, Seki INOUE
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Publication number: 20240038436Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: ApplicationFiled: October 11, 2023Publication date: February 1, 2024Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO, Yuto SHIGA
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Patent number: 11817252Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: GrantFiled: January 11, 2022Date of Patent: November 14, 2023Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
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Publication number: 20230070168Abstract: A multilayer coil component includes: an element body; a coil disposed in the element body; and a first external electrode disposed on a surface of the element body in which the first external electrode has a first electrode layer disposed on the surface of the element body and a first plating layer and a second plating layer disposed on the first electrode layer, and the first plating layer and the second plating layer are disposed so as to be scattered in a plurality of places on an edge of the first electrode layer.Type: ApplicationFiled: September 7, 2022Publication date: March 9, 2023Applicant: TDK CORPORATIONInventors: Yusuke NAGAI, Kazuhiro EBINA, Takahiro SATO, Kunihiko KAWASAKI, Shinichi SATO, Seiichi NAKAGAWA, Kouichi KAKUDA, Yuya ISHIMA, Mitsuru ITO
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Publication number: 20220310301Abstract: In the multi-layer inductor, all of the plurality of through conductors are not aligned in a straight line, and the distance between the through conductors can be sufficiently kept in the element body having a predetermined dimensional standard. Therefore, the through conductor as a heat source is apart from each other, and the heat of the through conductor can be efficiently radiated to the outside of the element body.Type: ApplicationFiled: March 16, 2022Publication date: September 29, 2022Applicant: TDK CorporationInventors: Akihiko OIDE, Makoto YOSHINO, Tomoki OKADA, Seiji OSADA, Yuuki OKAZAKI, Takeshi SASAKI, Mitsuru ITO, Kenta SASAKI, Kazuhiro EBINA, Takashi ABE, Hiroshi ONO
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Publication number: 20220310299Abstract: In the multi-layer inductor, the internal electrode includes the auxiliary conductor, and the auxiliary conductor is jointed to the external electrode at the end face. Therefore, when a defect occurs in a part of the through conductors, a current flows through the remaining through conductor(s) and a current also flows through the auxiliary conductor. Therefore, overheating at the joint surface between the remaining through conductor(s) and the external electrode can be prevented, and cutting and/or fusion starting from the joint surface can be prevented.Type: ApplicationFiled: March 17, 2022Publication date: September 29, 2022Applicant: TDK CorporationInventors: Akihiko OIDE, Makoto YOSHINO, Tomoki OKADA, Seiji OSADA, Yuuki OKAZAKI, Takeshi SASAKI, Mitsuru ITO, Kenta SASAKI, Kazuhiro EBINA, Takashi ABE, Hiroshi ONO
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Publication number: 20220130594Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: ApplicationFiled: January 11, 2022Publication date: April 28, 2022Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO
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Patent number: 11270833Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: GrantFiled: February 13, 2020Date of Patent: March 8, 2022Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
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Patent number: 11239020Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: GrantFiled: February 13, 2020Date of Patent: February 1, 2022Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito
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Publication number: 20210375527Abstract: A multilayer inductor component includes an element body, an internal conductor, and an external electrode. The internal conductor is disposed in the element body. The external electrode is disposed on a surface of the element body and electrically connected to the internal conductor. The external electrode includes a sintered metal layer and a plating layer. The sintered metal layer is disposed on the surface of the element body. The plating layer covers the sintered metal layer. The sintered metal layer includes a thick portion and thin portions. The thick portion covers the surface of the element body. A plurality of glass particles is dispersed in the thick portion. The thin portions cover glass particles exposed on a surface of the thick portion among the plurality of glass particles and being in contact with the plating layer.Type: ApplicationFiled: May 25, 2021Publication date: December 2, 2021Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Daiki KATO, Yoji TOZAWA, Takashi ENDO, Seiichi NAKAGAWA, Mitsuru ITO, Kenta SASAKI, Akihiko OIDE, Makoto YOSHINO, Kazuhiro EBINA
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Patent number: 10882496Abstract: An imaging apparatus includes an optical member, a housing, and a light source. The optical member contains a photocatalyst film on an object-side surface. The housing contains an accommodation section in which the optical member is accommodated. The light source is located in an internal space of the housing and emits light to activate the photocatalyst film. The light from the light source passes through the optical member and irradiates the photocatalyst film.Type: GrantFiled: December 12, 2016Date of Patent: January 5, 2021Assignee: KYOCERA CorporationInventor: Mitsuru Ito
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Publication number: 20200185144Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: ApplicationFiled: February 13, 2020Publication date: June 11, 2020Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO
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Patent number: 10643781Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: GrantFiled: May 18, 2017Date of Patent: May 5, 2020Assignee: TDK CORPORATIONInventors: Masashi Shimoyasu, Shinichi Sato, Seiichi Nakagawa, Mamoru Kawauchi, Shigetoshi Kinouchi, Mitsuru Ito, Yuto Shiga
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Publication number: 20190001932Abstract: An imaging apparatus includes an optical member, a housing, and a light source. The optical member contains a photocatalyst film on an object-side surface. The housing contains an accommodation section in which the optical member is accommodated. The light source is located in an internal space of the housing and emits light to activate the photocatalyst film. The light from the light source passes through the optical member and irradiates the photocatalyst film.Type: ApplicationFiled: December 12, 2016Publication date: January 3, 2019Inventor: Mitsuru ITO
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Publication number: 20170345553Abstract: A multilayer coil component includes an element body, a coil disposed in the element body, and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a principal surface that is a mounting surface, and an end surface positioned adjacent to the principal surface and extending in a direction crossing to the principal surface. The external electrode includes an underlying metal layer and a conductive resin layer. The underlying metal layer is formed on the principal surface and the end surface. The conductive resin layer is formed to cover the underlying metal layer. A thickness of the conductive resin layer at an end positioned above the principal surface of the underlying metal layer is equal to or greater than 50% of a maximum thickness of a portion positioned above the principal surface of the conductive resin layer.Type: ApplicationFiled: May 18, 2017Publication date: November 30, 2017Applicant: TDK CORPORATIONInventors: Masashi SHIMOYASU, Shinichi SATO, Seiichi NAKAGAWA, Mamoru KAWAUCHI, Shigetoshi KINOUCHI, Mitsuru ITO, Yuto SHIGA
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Publication number: 20150009790Abstract: [PROBLEM] To provide an object lens such that the degradation of the optical properties of the object lens due to temperature change can be minimized, and a light pickup device using the same. [SOLUTION] An object lens R has lens surfaces R1, R2 which converges BD light, DVD light and CD light with prescribed numerical apertures into spots, and an antireflective film R1a formed on the lens surface R1. The lens surface R1 includes a BD exclusive region A1, a two-wavelength common region A2, and a three-wavelength common region A3. Diffractive structures P1, P2 and P3 are formed respectively for the BD exclusive region A1, the two-wavelength common region A2 and the three-wavelength common region A3. The antireflective film R1a is designed such that the transmittance for BD light is largest in the range of the two-wavelength common region A2.Type: ApplicationFiled: December 18, 2012Publication date: January 8, 2015Inventors: Mitsuru Ito, Yuki Koshimizu, Yoshitoshi Oyamada, Hiroyuki Ichikawa
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Objective lens, optical pickup apparatus using the same, and method for manufacturing objective lens
Patent number: 8488434Abstract: Provided is an objective lens manufactured well by using a mold and an optical pickup apparatus including the same. The objective lens of the present invention includes a first region that focuses laser beams of a BD, DVD, and CD standards, a second region that focuses the laser beams of the DVD and CD standards, and a third region that focuses the laser beams of the BD and the DVD standards are provided in this order from a center portion of the objective lens. A first annular zone step provided in the first region has a step amount larger than step amounts of annular zone steps provided in other regions.Type: GrantFiled: January 27, 2012Date of Patent: July 16, 2013Assignees: Sanyo Electric Co., Ltd, Sanyo Optec Design Co., LtdInventor: Mitsuru Ito -
Patent number: 8441900Abstract: Provided is an objective lens that allows securing of a long working distance for a laser beam with a long wavelength and has a predetermined thickness or larger, and an optical pickup apparatus including the objective lens. In an objective lens of the present invention, a first region that focuses laser beams of a BD, DVD, and CD standards, a second region that focuses the laser beams of the DVD and CD standards, and a third region that focuses the laser beams of the BD and the DVD standards are provided in this order from a center portion of the objective lens. An optical super resolution with the laser beam of the BD standard is achieved by preventing a portion of the laser beam of the BD standard transmitted through the second region from contributing to spot formation.Type: GrantFiled: January 17, 2012Date of Patent: May 14, 2013Assignees: SANYO Electric Co., Ltd., SANYO Optec Design Co., Ltd.Inventor: Mitsuru Ito
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Patent number: 8427926Abstract: An optical pickup lens for focusing a light beam from a laser light source on an optical information recording medium is a single lens. The optical pickup lens has two surfaces, and a surface R2 opposite to a surface R1 closer to the laser light source has a continuous shape. When the surface R2 has radii h1, h2 and h3 (h1<h2<h3) from an optical axis to a lens periphery, and where sags in the radii h1, h2 and h3 are sag1, sag2 and sag3, and differentials in the sags are ?sag1, ?sag2 and ?sag3, respectively, 0>?sag1>?sag2 and ?sag2<?sag3 are satisfied.Type: GrantFiled: August 14, 2012Date of Patent: April 23, 2013Assignee: Hitachi Maxwell, Ltd.Inventor: Mitsuru Ito
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Publication number: 20130003192Abstract: A method for designing an objective lens includes: designing a first objective lens, having no annular zone formed on an incident surface on an opposite side to an optical-disc-facing side according to a first optical design with which a laser beam is condensed on a layer between first and second signal recording layers of an optical disc, under conditions including a third temperature between first and second temperatures, and including a third wavelength between first and second wavelengths; and designing a second objective lens, having an annular zone formed on the incident surface of the first objective lens, according to a second optical design with which the laser beam is condensed on the second signal recording layer under the conditions including the second temperature and wavelength the annular zone having such an aspheric coefficient that spherical aberration becomes smaller than that of the first objective lens.Type: ApplicationFiled: January 25, 2012Publication date: January 3, 2013Applicants: SANYO OPTEC DESIGN CO., LTD., SANYO ELECTRIC CO., LTD.Inventor: Mitsuru ITO