Abstract: A driving apparatus (101) is provided with: a first base part (111); a second base part (112); a third base part (113); a first elastic part (122) that connects the first base part and the second base part; a second elastic part (124) that connects the second base part and the third base part; a first driven part (131) that is supported by the first base part to be driven; and a second driven part (132) that is supported by the third base part to be driven.

Abstract: A driving apparatus (101) is provided with: a first base part (110); a second base part (120); an elastic part (210) configured to couple the first base part with the second base part; and a driven part (400) supported by the second base part in a drivable aspect. According to such a driving apparatus, for example, if a driving force is applied to the first base part, the driving force is transmitted to the second base part via the elastic part. Thus, the driven part supported by the second base part can be preferably driven.

Abstract: An electronic device is obtained in such a way that a MEMS substrate having a MEMS element mounted thereon and a CMOS substrate are bonded together at bonding surfaces and with a bonding material M having fluidity, wherein the MEMS substrate has a bonding projection part provided to project from a substrate main body and having the bonding surface and a gap formation part disposed between the bonding projection part and the MEMS element, and the gap formation part is supported by the bonding projection part via a plurality of support pieces extending from the bonding projection part and forms reception gaps, which are capable of receiving the bonding material M extruded from the bonding surface to the side of the MEMS element, between the wall surface thereof and the bonding projection part.

Abstract: An electronic device is obtained in such a way that a MEMS substrate having a MEMS element mounted thereon and a CMOS substrate are bonded together at bonding surfaces and with a bonding material M having fluidity, wherein the MEMS substrate has a bonding projection part provided to project from a substrate main body and having the bonding surface and a gap formation part disposed between the bonding projection part and the MEMS element, and the gap formation part is supported by the bonding projection part via a plurality of support pieces extending from the bonding projection part and forms reception gaps, which are capable of receiving the bonding material M extruded from the bonding surface to the side of the MEMS element, between the wall surface thereof and the bonding projection part.

Abstract: An electronic device 1 has a first semiconductor substrate 2 on which a bonding projection section 42 is projected via an insulation film 41, a second semiconductor substrate 3 that is bonded by welding the bonding projection section 42 of the first semiconductor substrate 2 via conductive bonding material, a through hole 54 that is formed to penetrate the bonding projection section 42 and the insulation film 41 in a bonding direction, and a conduction wiring section 44 that is formed by the conductive bonding material filled in the through hole 54 at a time of bonding by welding and conducts the first semiconductor substrate 2 with the second semiconductor substrate 3 to have same electric potential.

Abstract: An electronic device 1 has a first semiconductor substrate 2 on which a bonding projection section 42 is projected via an insulation film 41, a second semiconductor substrate 3 that is bonded by welding the bonding projection section 42 of the first semiconductor substrate 2 via conductive bonding material, a through hole 54 that is formed to penetrate the bonding projection section 42 and the insulation film 41 in a bonding direction, and a conduction wiring section 44 that is formed by the conductive bonding material filled in the through hole 54 at a time of bonding by welding and conducts the first semiconductor substrate 2 with the second semiconductor substrate 3 to have same electric potential.

Abstract: A rotational vibration type gyro 1 is provided by which a detection sensitivity influence of the other axis direction on detection sensitivity in a detection axis direction. The rotational vibration type gyro 1 has: a drive weight 4, drive electrodes 3, a detection weight 5 having a pair of X-axis divisional detection weights 5A, 5A and a pair of Y-axis divisional detection weights 5B, 5B, an anchor 6, a pair of X-axis weight support springs 7A, 7A and a pair of Y-axis weight support springs 7B, 7B, a pair of X-axis weight connection springs 8A, 8A and a pair of Y-axis weight connection springs 8B, 8B, and a pair of X-axis detection electrodes 9A, 9A and a pair of Y-axis detection electrodes 9B, 9B.

Abstract: A liquid crystal display device of reflection type has a liquid crystal display panel and a fixture substrate for fixing the liquid crystal display panel. The liquid crystal display panel is provided with: a semiconductor substrate; a transparent substrate opposed to the semiconductor substrate and on which a transparent electrode is formed, the transparent substrate having a width in a first direction along a surface thereof wider than the semiconductor substrate; a liquid crystal layer sealed between the semiconductor substrate and the transparent substrate; a plurality of switching elements formed on the semiconductor substrate in a matrix manner in correspondence with a pixel arrangement; and a plurality of pixel electrodes formed in the matrix manner in correspondence with the pixel arrangement each connected to respective one of the switching elements.