Patents by Inventor Mitsuru Matsuyama

Mitsuru Matsuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030087705
    Abstract: A forging method which enables formation of a hollow part by simple processes. In a cutting process, a cylinder blank 1 is cut at the upsetting ratio of L/D=1.5-2.0. In a first process, the cylinder blank 1 is upset in accordance with the outer shape of a nut. The height h of a semi-manufactured product 2 should be lower than the height h of a final product 4. In a second process, dents 3a and 3b are formed on both sides by extrusion. The depth of the dents 3a should be deeper than the other. The height of the semi-manufactured product 3 in the second process should be as tall as the height of the final product 4. In a third process, piercing is performed to the bottom portion of the deeper dent 3a so that both dents 3a and 3b can communicate.
    Type: Application
    Filed: November 2, 2001
    Publication date: May 8, 2003
    Inventor: Mitsuru Matsuyama
  • Patent number: 6558263
    Abstract: A forging method which enables formation of a hollow part by simple processes. In a cutting process, a cylinder blank 1 is cut at the upsetting ratio of L/D=1.5-2.0. In a first process, the cylinder blank 1 is upset in accordance with the outer shape of a nut. The height h of a semi-manufactured product 2 should be lower than the height h of a final product 4. In a second process, dents 3a and 3b are formed on both sides by extrusion. The depth of the dents 3a should be deeper than the other. The height of the semi-manufactured product 3 in the second process should be as tall as the height of the final product 4. In a third process, piercing is performed to the bottom portion of the deeper dent 3a so that both dents 3a and 3b can communicate.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: May 6, 2003
    Inventor: Mitsuru Matsuyama
  • Patent number: 6013363
    Abstract: A laminate which contains the following layers:(I) a stretched microporous resin film base layer having an opacity of at least 80%;(Ia) a heat sealable adhesive resin layer on the back side of the base layer;(II) a gas barrier resin film layer on the surface side of the base layer; and(III) an inorganic oxide thin film layer on the surface side of the gas barrier resin film layer,wherein the laminate:(i) has a water vapor permeability of at most 5 g/m.sup.2 .multidot.24 hr, and(ii) has an oxygen permeability of at most 5 cc/m.sup.2 .multidot.24 hr.multidot.atm.The laminate is useful, for example, for packaging a variety of articles, e.g., edible products, in which taste and freshness are desirably preserved during transportation and storage thereof.
    Type: Grant
    Filed: March 17, 1998
    Date of Patent: January 11, 2000
    Assignee: Oji-Yuka Synthetic Paper Co., Ltd.
    Inventors: Isao Takahashi, Junichi Yasuda, Mitsuru Matsuyama