Abstract: In a method of forming a scan path network, typical of the present invention, at a semiconductor integrated circuit having a clock node supplying a clock signal, a scan-in node supplying scan data and a scan-out node for receiving scan data outputted from scan flip-flops, the following steps are carried out. A plurality of scan flip-flops are placed. Delay times taken for the clock signal supplied to the clock node to reach the scan flip-flops are calculated. Distances between the scan flip-flops are calculated. Skews between the scan flip-flops are calculated. A sum of the calculated distances and the skews is calculated. The smallest value from within this total is then decided upon. The scan flip-flops are then connected across the scan-in node and the scan-out node based on this smallest value.

Abstract: A semiconductor device has a semiconductor substrate and a conductor layer provided over the semiconductor substrate. The conductor layer includes a first linear part extending in a first direction and provided with slits extending in the first direction, a second linear part extending in a second direction at an angle with the first direction and provided with slits extending in the second direction, and a junction part formed where the first and second linear parts are connected and provided with slits shorter than the slits in the first and second linear parts.