Abstract: A semiconductor device that includes a metal substrate including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive pattern. The top surface is insulated. Each of the side surfaces of the metal substrate includes a first inclining side surface and a second inclining side surface so as to form a convex shape protruding outwardly between the top surface and the bottom surface of the metal substrate, and the first inclining side surfaces of a pair of two opposing side surfaces are smaller than corresponding first inclining side surfaces of another pair of two opposing side surfaces.

Abstract: A semiconductor device that includes a metal substrate including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive pattern. The top surface is insulated. Each of the side surfaces of the metal substrate includes a first inclining side surface and a second inclining side surface so as to form a convex shape protruding outwardly between the top surface and the bottom surface of the metal substrate, and the first inclining side surfaces of a pair of two opposing side surfaces are smaller than corresponding first inclining side surfaces of another pair of two opposing side surfaces.

Abstract: An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with an insulating layer, and conductive patterns provided on the insulating layer. Circuit elements are electrically connected to the conductive patterns. Further, each side surface of the circuit board includes a first inclined portion extending obliquely downward from a peripheral portion of the surface of the circuit board, and a second inclined portion extending obliquely upward from a back surface of the circuit board and formed to be larger than the first inclined portion.

Abstract: In preferred embodiments, a method of manufacturing a hybrid integrated circuit device is provided, in which a plurality of circuit substrates 10 are manufactured from a single metal substrate 10A? by dicing. In some embodiments, the method includes: preparing a metal substrate 10A? having an insulating layer 11 formed on the top surface thereof; forming a plurality of conductive patterns 12 on the top surface of insulating layer 11; forming grooves 20 in lattice form on the rear surface of metal substrate 10B?; mounting hybrid integrated circuits onto conductive patterns 12; and separating individual circuit substrates 10 with, for example, a rotatable cutter.

Abstract: An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with an insulating layer, and conductive patterns provided on the insulating layer. Circuit elements are electrically connected to the conductive patterns. Further, each side surface of the circuit board includes a first inclined portion extending obliquely downward from a peripheral portion of the surface of the circuit board, and a second inclined portion extending obliquely upward from a back surface of the circuit board and formed to be larger than the first inclined portion.

Abstract: An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with an insulating layer, and conductive patterns provided on the insulating layer. Circuit elements are electrically connected to the conductive patterns. Further, each side surface of the circuit board includes a first inclined portion extending obliquely downward from a peripheral portion of the surface of the circuit board, and a second inclined portion extending obliquely upward from a back surface of the circuit board and formed to be larger than the first inclined portion.

Abstract: In preferred embodiments, a method of manufacturing a hybrid integrated circuit device is provided, in which a plurality of circuit substrates 10 are manufactured from a single metal substrate 10A′ by dicing. In some embodiments, the method includes: preparing a metal substrate 10A′ having an insulating layer 11 formed on the top surface thereof; forming a plurality of conductive patterns 12 on the top surface of insulating layer 11; forming grooves 20 in lattice form on the rear surface of metal substrate 10B′; mounting hybrid integrated circuits onto conductive patterns 12; and separating individual circuit substrates 10 with, for example, a rotatable cutter.

Abstract: A powder material for use in resistance welding articles of aluminum comprises a mixture of 10-50% by weight of a liquid resin and the remaining proportion of a magnesium powder or a blend of magnesium and aluminum powders. Also a method of resistance welding articles of aluminum comprises the steps of preparing a pasty mixture by mixing in a predetermined amount of a liquid resin having a predetermined initial viscosity, a predetermined amount of a metal powder or a blend of metal and metal oxide powders, and inserting the pasty mixture between the mating weld surfaces of the aluminum articles. Only a small welding force and a low current will be required in producing a resistance weld connection between the aluminum articles with desired strength.

Abstract: In the air-pressure molding method according to the present invention, a laminated material is arranged, when in a heated and softened state, on the shaping face of a mold having an air reservoir, and the portion to be molded is hermetically sealed within a box-shaped top cover. Air under pressure higher than atmospheric pressure is then applied to the inside of the top cover so that the laminated material is developed and shaped to have a uniform thickness on the air-cushion layer which is established by the air pressure between the laminated material and the shaping face of the mold. Immediately after, the air in the cushion layer is forced to the air reservoir thereby bringing the laminated material into contact with the mold so that the surface of the skin may be reversely embossed or stitched.

Abstract: Apparatus for attaching a fuel tank in an internal combustion engine, the apparatus comprising a wave-like seat plate including an assembly with alternately curved concavities and convexities therein, applied with said concavities to a lower surface of a bottom plate of the fuel tank so as to form adiabatic spaces above the concavities, and between the seat plate and the bottom plate, the assembly being secured with the seat plate to an upper surface of the engine body. Optionally, this body may have plural projecting fins, forming air passages into which cooling air may be led, for example from a fan.